Quadruple D-Type Positive-Edge-Triggered Flip-Flops With Clear 16-SOIC 0 to 70
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | SOIC |
包装说明 | SOIC-16 |
针数 | 16 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
Factory Lead Time | 6 weeks |
系列 | ALS |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e4 |
长度 | 9.9 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP |
最大频率@ Nom-Su | 50000000 Hz |
最大I(ol) | 0.008 A |
湿度敏感等级 | 1 |
位数 | 4 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出极性 | COMPLEMENTARY |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP16,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
包装方法 | TR |
峰值回流温度(摄氏度) | 260 |
电源 | 5 V |
最大电源电流(ICC) | 14 mA |
Prop。Delay @ Nom-Su | 17 ns |
传播延迟(tpd) | 17 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE |
宽度 | 3.91 mm |
最小 fmax | 50 MHz |
Base Number Matches | 1 |
SN74ALS175DR | SN74AS174N | SN74AS174D | SN74ALS175N | SN74ALS175D | SN74ALS174N | SN74ALS174DR | SN74ALS174D | |
---|---|---|---|---|---|---|---|---|
描述 | Quadruple D-Type Positive-Edge-Triggered Flip-Flops With Clear 16-SOIC 0 to 70 | Hex D-Type Positive-Edge-Triggered Flip-Flops With Clear 16-PDIP 0 to 70 | Hex D-Type Positive-Edge-Triggered Flip-Flops With Clear 16-SOIC 0 to 70 | Quadruple D-Type Positive-Edge-Triggered Flip-Flops With Clear 16-PDIP 0 to 70 | Quadruple D-Type Positive-Edge-Triggered Flip-Flops With Clear 16-SOIC 0 to 70 | Hex D-Type Positive-Edge-Triggered Flip-Flops With Clear 16-PDIP 0 to 70 | Hex D-Type Positive-Edge-Triggered Flip-Flops With Clear 16-SOIC 0 to 70 | Hex D-Type Positive-Edge-Triggered Flip-Flops With Clear 16-SOIC 0 to 70 |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | SOIC | DIP | SOIC | DIP | SOIC | DIP | SOIC | SOIC |
包装说明 | SOIC-16 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP-16 | SOP, SOP16,.25 | SOP, SOP16,.25 |
针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | compli | compli | compli | compli | compli | compliant | compliant | compliant |
Factory Lead Time | 6 weeks | 1 week | 1 week | 1 week | 1 week | 1 week | 1 week | 1 week |
是否无铅 | 不含铅 | - | 不含铅 | - | 不含铅 | - | 不含铅 | 不含铅 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
系列 | ALS | AS | AS | ALS | ALS | ALS | - | - |
JESD-30 代码 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | - | - |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | - | - |
长度 | 9.9 mm | 19.3 mm | 9.9 mm | 19.3 mm | 9.9 mm | 19.3 mm | - | - |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - | - |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | - | - |
最大频率@ Nom-Su | 50000000 Hz | 100000000 Hz | 100000000 Hz | 50000000 Hz | 50000000 Hz | - | - | - |
最大I(ol) | 0.008 A | 0.02 A | 0.02 A | 0.008 A | 0.008 A | 0.008 A | - | - |
位数 | 4 | 6 | 6 | 4 | 4 | 6 | - | - |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | - | - |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - | - |
输出极性 | COMPLEMENTARY | TRUE | TRUE | COMPLEMENTARY | COMPLEMENTARY | TRUE | - | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
封装代码 | SOP | DIP | SOP | DIP | SOP | DIP | - | - |
封装等效代码 | SOP16,.25 | DIP16,.3 | SOP16,.25 | DIP16,.3 | SOP16,.25 | DIP16,.3 | - | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | - | - |
包装方法 | TR | TUBE | TUBE | TUBE | TUBE | TUBE | - | - |
峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | - | - |
最大电源电流(ICC) | 14 mA | 45 mA | 45 mA | 14 mA | 14 mA | 19 mA | - | - |
Prop。Delay @ Nom-Su | 17 ns | 10 ns | 10 ns | 17 ns | 17 ns | - | - | - |
传播延迟(tpd) | 17 ns | 10 ns | 10 ns | 17 ns | 17 ns | 17 ns | - | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
座面最大高度 | 1.75 mm | 5.08 mm | 1.75 mm | 5.08 mm | 1.75 mm | 5.08 mm | - | - |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
表面贴装 | YES | NO | YES | NO | YES | NO | - | - |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | - | - |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | - |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | - | - |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | - | - |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | - | - |
宽度 | 3.91 mm | 6.35 mm | 3.91 mm | 6.35 mm | 3.91 mm | 6.35 mm | - | - |
最小 fmax | 50 MHz | 100 MHz | 100 MHz | 50 MHz | 50 MHz | 50 MHz | - | - |
Base Number Matches | 1 | - | - | 1 | 1 | 1 | 1 | 1 |
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