Universal Bus Functions 3.3-V 12-Bit Univ Bus Driver
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SSOP |
| 包装说明 | TSSOP, TSSOP56,.25,16 |
| 针数 | 56 |
| Reach Compliance Code | compli |
| Factory Lead Time | 1 week |
| 系列 | ALVC/VCX/A |
| JESD-30 代码 | R-PDSO-G56 |
| 长度 | 11.3 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 12 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 56 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP56,.25,16 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| 传播延迟（tpd） | 6.1 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.4 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4.4 mm |
| SN74ALVCH16903DGVR | 74ALVCH16903DGGRG4 | 74ALVCH16903DLG4 | 74ALVCH16903DGVRE4 | 74ALVCH16903DGGRE4 | SN74ALVCH16903DLR | SN74ALVCH16903DGGR | |
|---|---|---|---|---|---|---|---|
| 描述 | Universal Bus Functions 3.3-V 12-Bit Univ Bus Driver | Universal Bus Functions 3.3V 12B Univ Bus Dr | Universal Bus Functions 3.3V 12B Univ Bus Dr | Universal Bus Functions 3.3V 12B Univ Bus Dr | Universal Bus Functions 3.3V 12B Univ Bus Dr | Bus Transceivers 16-Bit Bus Trnscvrs With 3-State Outputs | Universal Bus Functions 3.3-V 12-Bit Univ Bus Driver |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SSOP | TSSOP | SSOP | SSOP | TSSOP | SSOP | TSSOP |
| 包装说明 | TSSOP, TSSOP56,.25,16 | TSSOP, TSSOP56,.3,20 | SSOP, SSOP56,.4 | TSSOP, TSSOP56,.25,16 | TSSOP, TSSOP56,.3,20 | SSOP, SSOP56,.4 | TSSOP, TSSOP56,.3,20 |
| 针数 | 56 | 56 | 56 | 56 | 56 | 56 | 56 |
| Reach Compliance Code | compli | unknow | unknow | unknown | unknow | unknow | unknow |
| 系列 | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A | ALVC/VCX/A |
| JESD-30 代码 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 |
| 长度 | 11.3 mm | 14 mm | 18.415 mm | 11.3 mm | 14 mm | 18.415 mm | 14 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 56 | 56 | 56 | 56 | 56 | 56 | 56 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | SSOP | TSSOP | TSSOP | SSOP | TSSOP |
| 封装等效代码 | TSSOP56,.25,16 | TSSOP56,.3,20 | SSOP56,.4 | TSSOP56,.25,16 | TSSOP56,.3,20 | SSOP56,.4 | TSSOP56,.3,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 传播延迟（tpd） | 6.1 ns | 6.1 ns | 6.1 ns | 6.1 ns | 6.1 ns | 6.1 ns | 6.1 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 2.79 mm | 1.2 mm | 1.2 mm | 2.79 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.4 mm | 0.5 mm | 0.635 mm | 0.4 mm | 0.5 mm | 0.635 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 4.4 mm | 6.1 mm | 7.49 mm | 4.4 mm | 6.1 mm | 7.49 mm | 6.1 mm |
| 是否无铅 | - | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 |
| JESD-609代码 | - | e4 | e4 | - | e4 | - | e4 |
| 湿度敏感等级 | - | 1 | 1 | - | 1 | - | 1 |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
stm32/stm8
单片机
嵌入式系统
嵌入式系统
FPGA/CPLD
stm32/stm8
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