3-Line To 8-Line Decoders/Demultiplexers 16-PDIP 0 to 70
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 其他特性 | 2 ACTIVE-LOW AND 1 ACTIVE-HIGH ENABLE INPUT, SCHOTTKY-CLAMPED FOR HIGH PERFORMANCE |
| 系列 | AS |
| 输入调节 | STANDARD |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e4 |
| 长度 | 19.305 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 最大I（ol） | 0.02 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 最大电源电流（ICC） | 20 mA |
| Prop。Delay @ Nom-Su | 22 ns |
| 传播延迟（tpd） | 10 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| SN74AS138N | SN74AS138NSR | SN74AS138D | SN74ALS138ANSR | SN74ALS138AN | SN74ALS138ADR | SN74ALS138AD | SN74ALS138ANG4 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 3-Line To 8-Line Decoders/Demultiplexers 16-PDIP 0 to 70 | 3-Line To 8-Line Decoders/Demultiplexers 16-SO 0 to 70 | 3-Line To 8-Line Decoders/Demultiplexers 16-SOIC 0 to 70 | 3-Line to 8-Line Decoders/Demultiplexers 16-SO 0 to 70 | 3-Line to 8-Line Decoders/Demultiplexers 16-PDIP 0 to 70 | 3-Line to 8-Line Decoders/Demultiplexers 16-SOIC 0 to 70 | 3-Line to 8-Line Decoders/Demultiplexers 16-SOIC 0 to 70 | IC DECODER/DEMUX 3-8LINE 16-DIP |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 零件包装代码 | DIP | SOIC | SOIC | SOIC | DIP | SOIC | SOIC | - |
| 包装说明 | DIP, DIP16,.3 | SOP, SOP16,.3 | SOIC-16 | SOP, SOP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | SOP, SOP16,.25 | - |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | - |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| Factory Lead Time | 1 week | 1 week | 1 week | 6 weeks | 1 week | 6 weeks | 1 week | - |
| 其他特性 | 2 ACTIVE-LOW AND 1 ACTIVE-HIGH ENABLE INPUT, SCHOTTKY-CLAMPED FOR HIGH PERFORMANCE | 2 ACTIVE-LOW AND 1 ACTIVE-HIGH ENABLE INPUT, SCHOTTKY-CLAMPED FOR HIGH PERFORMANCE | 2 ACTIVE-LOW AND 1 ACTIVE-HIGH ENABLE INPUT, SCHOTTKY-CLAMPED FOR HIGH PERFORMANCE | 2 ACTIVE-LOW AND 1 ACTIVE-HIGH ENABLE INPUT, SCHOTTKY-CLAMPED FOR HIGH PERFORMANCE | 2 ACTIVE-LOW AND 1 ACTIVE-HIGH ENABLE INPUT, SCHOTTKY-CLAMPED FOR HIGH PERFORMANCE | - | 2 ACTIVE-LOW AND 1 ACTIVE-HIGH ENABLE INPUT, SCHOTTKY-CLAMPED FOR HIGH PERFORMANCE | - |
| 系列 | AS | AS | AS | ALS | ALS | - | ALS | - |
| 输入调节 | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | - | STANDARD | - |
| JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | - | R-PDSO-G16 | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | - | e4 | - |
| 长度 | 19.305 mm | 10.2 mm | 9.9 mm | 10.2 mm | 19.3 mm | - | 9.9 mm | - |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - | 50 pF | - |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | - | OTHER DECODER/DRIVER | - |
| 最大I（ol） | 0.02 A | 0.02 A | 0.02 A | 0.008 A | 0.008 A | - | 0.008 A | - |
| 位数 | 8 | 8 | 8 | 8 | 8 | - | 8 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - | 1 | - |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | - | 16 | - |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - | 70 °C | - |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | - | INVERTED | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - |
| 封装代码 | DIP | SOP | SOP | SOP | DIP | - | SOP | - |
| 封装等效代码 | DIP16,.3 | SOP16,.3 | SOP16,.25 | SOP16,.3 | DIP16,.3 | - | SOP16,.25 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | - | SMALL OUTLINE | - |
| 包装方法 | TUBE | TR | TUBE | TR | TUBE | - | TUBE | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | 260 | NOT SPECIFIED | - | 260 | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | - |
| 最大电源电流（ICC） | 20 mA | 20 mA | 20 mA | 10 mA | 10 mA | - | 10 mA | - |
| Prop。Delay @ Nom-Su | 22 ns | 22 ns | 22 ns | 22 ns | 22 ns | - | 22 ns | - |
| 传播延迟（tpd） | 10 ns | 10 ns | 10 ns | 22 ns | 22 ns | - | 22 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - |
| 座面最大高度 | 5.08 mm | 2 mm | 1.75 mm | 2 mm | 5.08 mm | - | 1.75 mm | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | - |
| 表面贴装 | NO | YES | YES | YES | NO | - | YES | - |
| 技术 | TTL | TTL | TTL | TTL | TTL | - | TTL | - |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | - | GULL WING | - |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | - | 1.27 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| 宽度 | 7.62 mm | 5.3 mm | 3.9 mm | 5.3 mm | 6.35 mm | - | 3.9 mm | - |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | - |
综合技术交流
嵌入式系统
微控制器 MCU
嵌入式系统
能源基础设施
NXP MCU
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
