Digital Bus Switch ICs High-Performance Impact-X Circuit
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, BGA56,6X10,25 |
| 针数 | 56 |
| Reach Compliance Code | _compli |
| Factory Lead Time | 1 week |
| 系列 | CB3Q/3VH/3C/2B |
| JESD-30 代码 | R-PBGA-B56 |
| JESD-609代码 | e0 |
| 长度 | 7 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 1 |
| 位数 | 12 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 56 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA56,6X10,25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 2.5/3.3 V |
| 传播延迟（tpd） | 0.25 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | AEC-Q100 |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 0.65 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4.5 mm |
| Base Number Matches | 1 |
| SN74CB3Q16211GQLR | SN74CB3Q16211DL | SN74CB3Q16211ZQLR | SN74CB3Q16211DGVR | SN74CB3Q16211DGGR | |
|---|---|---|---|---|---|
| 描述 | Digital Bus Switch ICs High-Performance Impact-X Circuit | 24-Channel, 1:1 Analog Switch with High Bandwidth 56-SSOP -40 to 85 | 24-Channel, 1:1 Analog Switch with High Bandwidth 56-BGA MICROSTAR JUNIOR -40 to 85 | 24-Channel, 1:1 Analog Switch with High Bandwidth 56-TVSOP -40 to 85 | 24-Channel, 1:1 Analog Switch with High Bandwidth 56-TSSOP -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | BGA | SSOP | BGA | SSOP | TSSOP |
| 包装说明 | VFBGA, BGA56,6X10,25 | SSOP, SSOP56,.4 | VFBGA, BGA56,6X10,25 | TSSOP, TSSOP56,.25,16 | TSSOP, TSSOP56,.3,20 |
| 针数 | 56 | 56 | 56 | 56 | 56 |
| Reach Compliance Code | _compli | compli | compli | compli | compli |
| Factory Lead Time | 1 week | 1 week | 1 week | 1 week | 1 week |
| 系列 | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B |
| JESD-30 代码 | R-PBGA-B56 | R-PDSO-G56 | R-PBGA-B56 | R-PDSO-G56 | R-PDSO-G56 |
| JESD-609代码 | e0 | e4 | e1 | e4 | e4 |
| 长度 | 7 mm | 18.415 mm | 7 mm | 11.3 mm | 14 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 56 | 56 | 56 | 56 | 56 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | SSOP | VFBGA | TSSOP | TSSOP |
| 封装等效代码 | BGA56,6X10,25 | SSOP56,.4 | BGA56,6X10,25 | TSSOP56,.25,16 | TSSOP56,.3,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 | 260 | 260 | 260 | 260 |
| 电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
| 传播延迟（tpd） | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| 座面最大高度 | 1 mm | 2.79 mm | 1 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | BALL | GULL WING | BALL | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.635 mm | 0.65 mm | 0.4 mm | 0.5 mm |
| 端子位置 | BOTTOM | DUAL | BOTTOM | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 4.5 mm | 7.49 mm | 4.5 mm | 4.4 mm | 6.1 mm |
| Base Number Matches | 1 | 1 | - | 1 | 1 |
| 控制类型 | - | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| 计数方向 | - | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| 包装方法 | - | TUBE | TR | TR | TR |
| 最大电源电流（ICC） | - | 2 mA | 2 mA | 2 mA | 2 mA |
| Prop。Delay @ Nom-Su | - | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns |
| 翻译 | - | N/A | N/A | N/A | N/A |
| ECCN代码 | - | - | EAR99 | EAR99 | EAR99 |
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