CD-HD0x Series Surface Mount Schottky Bridge Rectifier Diode
General Information
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
The markets of portable communications, computing and video equipment are
challenging the semiconductor industry to develop increasingly smaller electronic
components.
Bourns offers Schottky Bridge Rectifier Diodes for rectification applications in compact
chip package 0.24 ˝ x 0.19 ˝ size format, which offers PCB real estate savings and are
considerably smaller than standard parts. The Schottky Bridge Rectifier Diodes offer a
forward current of 1 A with a choice of repetitive peak reverse voltages between 40 V
and 100 V.
Absolute Maximum Ratings (@ T
A
= 25 °C Unless Otherwise Noted)
Parameter
Maximum Repetitive
Peak Reverse Voltage
Maximum Average Forward Rectified
Current (T
A
= 55 °C)
Symbol
VRRM
IF(AV)
IFSM
TJ
CD-
HD004
40
HD006
60
1.0
30.0
-55 to +125
-55 to +125
4
–
1
+
~
3
~
2
HD01
100
Unit
V
A
A
°C
°C
Peak Forward Surge Current 8.3 ms
Single Half Sine-Wave Superimposed
on Rated Load (JEDEC Method)
Operating Temperature Range
Storage Temperature Range
TSTG
Electrical Characteristics (@ T
A
= 25 °C Unless Otherwise Noted)
Parameter
Symbol
CD-HD0x
Test Conditions
CD-HD004
Instantaneous Forward Voltage
Repetitive Peak Reverse Current
Junction Capacitance
Thermal Resistance, Junction to Air
Thermal Resistance, Junction to Lead
VF
IRRM
CJ
IF = 1 A
VR = VRRM
CD-HD006
CD-HD01
TA = +25 °C
Min.
Typ.
0.49
0.60
0.75
0.025
110
15
Max.
0.5
0.70
0.85
0.20
250
mA
pF
°C / W
°C / W
V
Unit
Rth(JC) Junction to Lead
(NOTE 1)
Rth(JA) Junction to Ambient
(NOTE 1)
VR = 4 V, f = 1.0 MHz
NOTE 1: Measured when mounted on PCB with 5.0 mm x 5.0 mm (0.2 “ x 0.2 “) copper pad areas.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CD-HD0x Series Surface Mount Schottky Bridge Rectifier Diode
Rating and Characteristic Curves
Forward Current Derating Curve
Average Forward Rectified Current (Amps)
1.5
Maximum Non-Repetitive Peak Forward Surge Current
35
Peak Forward Surge Current (Amps)
30
25
20
15
10
5
0
1
10
Pulse Width 8.3 ms
Single Half-Sine-Wave
1.0
0.5
0
60 Hz Resistive
or Inductive Load
0
25
50
75
100
125
150
100
Ambient Temperature (°C)
Number of Cycles at 60 Hz
Forward Characteristics
10.00
Reverse Characteristics
100
10
Instantaneous Forward Current (Amps)
1.00
CD-HD006
CD-HD004
CD-HD01
Instantaneous Reverse Current (mA)
1.0
TJ = 100 °C
0.10
0.10
TA = 25 °C
0.01
TJ = 25 °C
0.01
0.001
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0
20
40
60
80
100
Instantaneous Forward Voltage (Volts)
Percent of Rated Peak Reverse Voltage (%)
Typical Junction Capacitance
3000
Junction Capacitance (pF)
1000
500
TJ = 25 °C
200
0
0.1
1
10
100
Reverse Voltage (Volts)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different
applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
3312 - 2 mm SMD Trimming Potentiometer
CD-HD0x Series Surface Mount Schottky Bridge Rectifier Diode
Product Dimensions
This is an RoHS2 compliant product, packaged with FRP substrate and is epoxy underfilled. The terminals are pure tin plated (lead free) and
aresolderable per MIL-STD-750, Method 2026. The package and dimensions are shown below.
A
B
Dimensions
A
B
F
4.65 - 4.85
(0.183 - 0.191)
2.49 - 2.59
(0.098 - 0.102)
6.05 - 6.25
(0.238 - 0.246)
0.95 - 1.05
(0.037 - 0.041)
1.35 - 1.45
(0.053 - 0.057)
0.92 - 1.22
(0.036 - 0.048)
TOP VIEW
C
D
C
MM
DIMENSIONS:
(INCHES)
E
F
D
E
Recommended Footprint
2.54 ± 0.05
(0.100 ± 0.002)
How to Order
CD - HD 004
Common Code
Chip Diode
Package
HD = HD Bridge Series
Reverse Voltage
004 = 40 V
006 = 60 V
01 = 100 V
6.15 ± 0.1
(0.242 ± 0.004)
Typical Part Marking
MANUFACTURER S
TRADEMARK
V
RMS
40 = 40 V
60 = 60 V
100 = 100 V
DATE CODE
10
60
FORWARD
CURRENT
x 100 mA
1.0 ± 0.05
(0.039 ± 0.002)
DIMENSIONS:
MM
(INCHES)
1.4 ± 0.05
(0.055 ± 0.002)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CD-HD0x Series Surface Mount Schottky Bridge Rectifier Diode
Packaging Information
The surface mount product is packaged in a 12 mm x 8 mm tape and reel format per EIA-481 standard.
P
0
P
1
T
120 °
F
B
W
D2
D1 D
d
Index Hole
E
P
Trailer
A
Device
C
Leader
End
.......
.......
10 pitches (min.)
.......
.......
.......
.......
.......
.......
10 pitches (min.)
Start
W1
DIMENSIONS:
MM
(INCHES)
Direction of Feed
Item
Carrier Width
Carrier Length
Carrier Depth
Sprocket Hole
Reel Outside Diameter
Reel Inner Diameter
Feed Hole Diameter
Sprocket Hole Position
Punch Hole Position
Punch Hole Pitch
Sprocket Hole Pitch
Embossment Center
Overall Tape Thickness
Tape Width
Reel Width
Quantity per Reel
Symbol
A
B
C
d
D
D1
D2
E
F
P
P0
P1
T
W
W1
--
CD-HD0x
5.20 ± 0.30
(0.205 ± 0.012)
6.60 ± 0.30
(0.260 ± 0.012)
1.65 ± 0.10
(0.065 ± 0.004)
1.50 ± 0.10
(0.059 ± 0.004)
330
(12.992)
50.0
MIN.
(1.969)
13.0 ± 0.50
(0.512 ± 0.02)
1.75 ± 0.10
(0.069 ± 0.004)
5.50 ± 0.05
(0.217 ± 0.002)
8.00 ± 0.10
(0.315 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
2.00 ± 0.10
(0.079 ± 0.004)
0.40
(0.016)
12.00 ± 0.30
(0.472 ± 0.012)
14.4
MAX.
(0.567)
5,000
Asia-Pacific:
Tel: +886-2 2562-4117
Email: asiacus@bourns.com
Europe:
Tel: +36 88 520 390
Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500
Email: americus@bourns.com
www.bourns.com
11/16
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
主题：自备终端(BYOD)发展趋势;用员工自己的移动设备来控制对工作设施及设备的使用，会对信息安全产生怎样的影响;在不使公司有安全风险或不损害员工隐私的前提下，有哪些方式能安全地实现这样的设施及设备使用。 自备终端(Bring Your Own Device，简称BYOD)，即企业允许员工离职时保留自己的手机，这种做法正日益流行。如今智能手机功能也越来越多，我们不仅能用自己的手机访问电脑、网...[详细]
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