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HDC1080
SNAS672A – NOVEMBER 2015 – REVISED JANUARY 2016
HDC1080 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor
1 Features
•
•
•
•
•
•
1
3 Description
The HDC1080 is a digital humidity sensor with
integrated temperature sensor that provides excellent
measurement accuracy at very low power. The
HDC1080 operates over a wide supply range, and is
a low cost, low power alternative to competitive
solutions in a wide range of common applications.
The humidity and temperature sensors are factory
calibrated.
Device Information
PART
NUMBER
HDC1080
PACKAGE
PWSON (6-pin) DMB
(1)
•
•
•
Relative Humidity Accuracy ±2% (typical)
Temperature Accuracy ±0.2°C (typical)
Excellent Stability at High Humidity
14 Bit Measurement Resolution
100 nA Sleep Mode Current
Average Supply Current:
– 710 nA @ 1sps, 11 bit RH Measurement
– 1.3 µA @ 1sps, 11 bit RH and Temperature
Measurement
Supply Voltage 2.7 V to 5.5 V
Small 3 mm x 3 mm Device Footprint
I
2
C Interface
BODY SIZE (NOM)
3.00 mm x 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
2 Applications
•
•
•
•
•
•
•
HVAC
Smart Thermostats and Room Monitors
White Goods
Printers
Handheld Meters
Medical Devices
Wireless Sensor (TIDA:
00374, 00484, 00524)
4 Typical Application
3.3 V
RH
3.3 V
3.3 V
HDC1080
Registers
+
Logic
VDD
SDA
SCL
I
2
C
MCU
I
2
C
Peripheral
VDD
ADC
TEMPERATURE
OTP
Calibration Coefficients
GND
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
HDC1080
SNAS672A – NOVEMBER 2015 – REVISED JANUARY 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features
..................................................................
Applications
...........................................................
Description
.............................................................
Typical Application
................................................
Revision History.....................................................
Pin Configuration and Functions
.........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information .................................................
Electrical Characteristics...........................................
I2C Interface Electrical Characteristics .....................
I2C Interface Timing Requirements ........................
Typical Characteristics ..............................................
1
1
1
1
2
3
4
4
4
4
4
5
6
6
7
8.4 Device Functional Modes..........................................
9
8.5 Programming...........................................................
10
8.6 Register Map ..........................................................
14
9
Application and Implementation
........................
17
9.1 Application Information............................................
17
9.2 Typical Application .................................................
17
9.3 Implementation and Usage Recommendations .....
18
10 Power Supply Recommendations
.....................
19
11 Layout...................................................................
19
11.1 Layout Guidelines ................................................
19
11.2 Layout Example ....................................................
19
12 Device and Documentation Support
.................
21
12.1
12.2
12.3
12.4
12.5
Documentation Support ........................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
21
21
21
21
21
8
Detailed Description
..............................................
9
8.1 Overview ...................................................................
9
8.2 Functional Block Diagram .........................................
9
8.3 Feature Description...................................................
9
13 Mechanical, Packaging, and Orderable
Information
...........................................................
21
5 Revision History
Changes from Original (November 2015) to Revision A
•
Page
Product Preview to Production Data Release .......................................................................................................................
1
2
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Copyright © 2015–2016, Texas Instruments Incorporated
HDC1080
www.ti.com
SNAS672A – NOVEMBER 2015 – REVISED JANUARY 2016
6 Pin Configuration and Functions
DMB Package
6 Pin PWSON
Top View
Top View
SDA
1
6
SCL
GND
2
RH
SENSOR
5
VDD
NC
3
4
NC
Pin Functions
PIN
NAME
SDA
GND
NC
VDD
SCL
DAP
(1)
NO.
1
2
3,4
5
6
DAP
I/O TYPE
(1)
I/O
G
-
P
I
-
DESCRIPTION
Serial data line for I2C, open-drain; requires a pull-up resistor to VDD
Ground
These pins may be left floating, or connected to GND
Supply Voltage
Serial clock line for I2C, open-drain; requires a pull-up resistor to VDD
Die Attach Pad. Should be left floating. (On bottom of the device, not shown in the figure)
P=Power, G=Ground, I=Input, O=Output
Copyright © 2015–2016, Texas Instruments Incorporated
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3
HDC1080
SNAS672A – NOVEMBER 2015 – REVISED JANUARY 2016
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
(1)
MIN
VDD
Input Voltage
Storage Temperature
(1)
SCL
SDA
T
STG
-0.3
-0.3
-0.3
-65
MAX
6
6
6
150
°C
V
UNIT
Stresses beyond those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended
Operating Conditions.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
V
(ESD)
(1)
(2)
Electrostatic discharge
Charged-device model (CDM), per JEDEC specification JESD22-
C101
(2)
±2000
±500
V
UNIT
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating range (unless otherwise noted)
MIN
V
DD
T
A
, Temperature sensor
T
A
, Humidity sensor
(1)
T
A
, Humidity sensor
(1)
See
Figure 2.
(1)
NOM
3
MAX
5.5
125
70
85
UNIT
V
°C
°C
°C
Supply Voltage
Ambient Operating Temperature
Ambient Operating Temperature
Functional Operating Temperature
2.7
-40
-20
-20
7.4 Thermal Information
HDC1080
THERMAL METRIC
R
θJA
R
θJC(top)
R
θJB
ψ
JT
ψ
JB
R
θJC(bot)
(1)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
(1)
PWSON (DMB)
6 PINS
49.4
29.8
23.1
3.3
23.1
4.2
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics
application
report,
SPRA953.
4
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SNAS672A – NOVEMBER 2015 – REVISED JANUARY 2016
7.5 Electrical Characteristics
(1)
The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. T
A
= 30°C,
RH = 40%, and V
DD
= 3V.
PARAMETER
POWER CONSUMPTION
I
DD
Supply Current
RH measurement, bit 12 of 0x02 register =
0
(5)
Temperature measurement, bit 12 of 0x02
register = 0
(5)
Sleep Mode
Average @ 1 measurement/second, RH (11
bit), bit 12 of 0x02 register = 0
(5) (6)
Average @ 1 measurement/second, Temp
(11 bit), bit 12 of 0x02 register = 0
(5) (6)
Average @ 1 measurement/second, RH
(11bit) +temperature (11 bit), bit 12 of 0x02
register = 1
(5) (6)
Startup (average on Start-up time)
I
HEAT
Heater Current
(7)
Peak current
Average @ 1 measurement/second, RH
(11bit) +temperature (11 bit), bit 12 of 0x02
register = 1
(5) (6)
RELATIVE HUMIDITY SENSOR
RH
ACC
RH
REP
RH
HYS
RH
RT
RH
CT
Accuracy
Repeatability
(7)
Hysteresis
(8)
TEST CONDITION
(2)
MIN
(3)
TYP
(4)
190
160
100
710
590
1.3
MAX
(3)
220
185
200
UNIT
µA
µA
nA
nA
nA
µA
300
7.2
50
µA
mA
µA
Refer to
Figure 2
in Typical Characteristics
section.
14 bit resolution
10%
≤
RH
≤
70%
t
63
%
(10)
(7)
±2
±0.1
±1
15
2.50
3.85
6.50
0
±0.25
100
%RH
%RH
%RH
s
ms
ms
ms
%RH
%RH/yr
±0.4
°C
°C
ms
ms
Response Time
(9)
Conversion Time
8 bit resolution
11 bit resolution
14 bit resolution
RH
OR
RH
LTD
TEMP
ACC
TEMP
REP
TEMP
CT
Operating Range
(11)
Long Term Drift
Accuracy
(7)
Repeatability
(7)
(12)
Non-condensing
TEMPERATURE SENSOR
5°C < T
A
< 60°C
14 bit resolution
11 bit accuracy
14 bit accuracy
(1)
±0.2
±0.1
3.65
6.35
Conversion Time
(7)
Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
(2) Register values are represented as either binary (b is the prefix to the digits), or hexadecimal (0x is the prefix to the digits). Decimal
values have no prefix.
(3) Limits are ensured by testing, design, or statistical analysis at 30°C. Limits over the operating temperature range are ensured through
correlations using statistical quality control (SQC) method.
(4) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on
shipped production material.
(5) I
2
C read/write communication and pull-up resistors current through SCL and SDA not included.
(6) Average current consumption while conversion is in progress.
(7) This parameter is specified by design and/or characterization and it is not tested in production.
(8) The hysteresis value is the difference between an RH measurement in a rising and falling RH environment, at a specific RH point.
(9) Actual response times will vary dependent on system thermal mass and air-flow.
(10) Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity.
(11) Recommended humidity operating range is 10% to 70% RH. Prolonged operation outside this range may result in a measurement
offset. The measurement offset will decrease after operating the sensor in this recommended operating range.
(12) Drift due to aging effects at typical conditions (30°C and 20% to 50% RH). This value may be impacted by dust, vaporized solvents, out-
gassing tapes, adhesives, packaging materials, etc.
Copyright © 2015–2016, Texas Instruments Incorporated
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