TD62064BP1G/BFG
TOSHIBA Bipolar Digital Integrated Circuit
Silicon Monolithic
TD62064BP1G,TD62064BFG
4ch High-Current Darlington Sink Driver
The TD62064BP1G and TD62064BFG are high-voltage,
high-current darlington drivers comprised of four NPN
darlington pairs. All units feature integral clamp diodes for
switching inductive loads.
Applications include relay, hammer, lamp and stepping motor
drivers.
TD62064BP1G
Features
•
•
•
•
•
•
Package type
BP1G: DIP16 pin
BFG: HSOP16 pin
TD62064BFG
High output sustaining voltage: V
CE (SUS)
=
80 V (min)
Output current (single output): I
OUT
=
1.5 A/ch (max)
Output clamp diodes
Input compatible with TTL and 5 V CMOS
GND and SUB terminal
=
Heat sink
Pin Assignment
(top view)
TD62064BP1G
O4
16
NC
15
I4
14
Heat sink
& GND
13
12
I3
11
NC
10
O3
9
Weight
DIP16-P-300-2.54A: 1.11 g (typ.)
HSOP16-P-300-1.00: 0.50 g (typ.)
1
COM
2
O1
3
I1
4
5
Heat sink
& GND
6
I2
7
O2
8
COM
TD62064BFG
O4
16
NC
15
I4
14
NC
13
Heat sink
& GND
NC
12
I3
11
NC
10
O3
9
1
COM
2
O1
3
I1
4
NC
Heat sink
& GND
5
NC
6
I2
7
O2
8
COM
Note: The NC pins are not connected to the die. If wiring is required, it is recommended to connect the pins to the
Heat sink & GND line(s).
1
2009-10-01
TD62064BP1G/BFG
Schematics
(each driver)
TD62064BP1G/BFG
COMMON
Input
8.2 kΩ
230
Ω
1.1 kΩ
Output
GND
Note: The input and output parasitic diodes cannot be used as clamp diodes.
Precautions for Using
(1)
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed
due to short-circuit between outputs, air contamination fault, or fault by improper grounding.
If a TD62064BP1G/BFG is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba
recommends that the diodes (pins 1 and 8) be connected to the secondary power supply pin so as to absorb the
counter electromotive force generated by the load. Please adhere to the device’s absolute maximum ratings.
Toshiba recommends that Zener diodes be connected between the diodes (pins 1 and 8) and the secondary
power supply pin (as the anode) so as to enable rapid absorption of the counter electromotive force. Again,
please adhere to the device’s absolute maximum ratings.
(2)
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics
Output sustaining voltage
Parasitic transistor output voltage
Output current
Input current
Input voltage
Clamp diode reverse voltage
Clamp diode forward current
BP1G
Power dissipation
BFG
Operating temperature
Storage temperature
T
opr
T
stg
P
D
Symbol
V
CE (SUS)
V
CEF
(Note 1)
I
OUT
I
IN
V
IN
V
R
I
F
Rating
−0.5
to 80
80
1.5
50
7
80
1.5
1.47
2.7 (Note 2)
0.9
1.4 (Note 3)
−40
to 85
−55
to 150
Unit
V
V
A/ch
mA
V
V
A
W
°C
°C
Note 1: Parasitic transistor (COMMON
−
GND
−
OUTPUT) output voltage
Note 2: On glass epoxy PCB (50
×
50
×
1.6 mm Cu 50%)
Note 3: On glass epoxy PCB (60
×
30
×
1.6 mm Cu 30%)
2
2009-10-01
TD62064BP1G/BFG
Recommended Operating Conditions
(Ta
=
−
40
to
85°C)
Characteristics
Output sustaining voltage
Symbol
V
CE (SUS)
Test Condition
⎯
DC1 circuit, Ta
=
25°C
BP1G
(Note 1)
BFG
(Note 2)
V
IN
Input voltage
Output ON
Output OFF
Input current
Clamp diode reverse voltage
Clamp diode forward current
Power dissipation
BP1G
BFG
V
IN (ON)
V
IN (OFF)
I
IN
V
R
I
F
P
D
Ta
=
85°C
Ta
=
85°C
I
OUT
=
1.25 A
⎯
⎯
⎯
⎯
(Note 1)
(Note 2)
t
pw
=
25 ms
4 circuits
Ta
=
85°C
T
j
=
120°C
Duty
=
10%
Duty
=
50%
Duty
=
10%
Duty
=
50%
⎯
Min
0
0
0
0
0
0
0
2.5
0
0
0
⎯
⎯
⎯
Typ.
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Max
80
1250
1250
390
900
172
5.5
8
0.4
20
80
1.25
1.4
0.7
mA
V
A
W
V
mA/ch
Unit
V
Output current
I
OUT
Note 1: On glass epoxy PCB (50
×
50
×
1.6 mm Cu 50%)
Note 2: On glass epoxy PCB (60
×
30
×
1.6 mm Cu 30%)
Electrical Characteristics
(Ta
=
25°C unless otherwise noted)
Characteristics
Output leakage current
Symbol
I
CEX
Test
Circuit
1
Test Condition
V
CE
=
80 V, Ta
=
25°C
V
CE
=
80 V, Ta
=
85°C
I
OUT
=
1.25 A, V
IN
=
2.4 V
I
OUT
=
0.75 A, V
IN
=
2.4 V
V
CE
=
2 V, I
OUT
=
1.25 A
I
OUT
=
1.25 A, I
IN
=
2 mA
V
R
=
80 V, Ta
=
25°C
V
R
=
80 V, Ta
=
85°C
I
F
=
1.25 A
V
IN
=
0, f
=
1 MHz
V
OUT
=
80 V, R
L
=
68
Ω
V
OUT
=
80 V, R
L
=
68
Ω
I
CEF
=
150 mA
Min
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
80
Typ.
⎯
⎯
⎯
⎯
1500
⎯
⎯
⎯
1.5
15
0.1
1.0
⎯
Max
50
100
1.6
1.25
⎯
2.4
50
100
2.0
⎯
⎯
⎯
⎯
V
μA
V
pF
μs
μs
V
Unit
μA
Output saturation voltage
DC current transfer ratio
Input voltage (output on)
Clamp diode leakage current
Clamp diode forward voltage
Input capacitance
Turn-ON delay
Turn-OFF delay
Parasitic transistor output voltage
V
CE (sat)
h
FE
V
IN (ON)
I
R
V
F
C
IN
t
ON
t
OFF
V
CEF
2
2
3
4
5
6
7
7
8
V
3
2009-10-01
TD62064BP1G/BFG
Test Circuit
1. ICEX
Open
I
CEX
Open
V
CE
V
CE
, V
CE (sat)
V
IN (ON)
V
CE
I
IN
2. V
CE (sat)
, h
FE
Open
I
OUT
3. V
IN (ON)
Open
I
OUT
4. I
R
I
R
Open
Open
5. V
F
V
F
V
R
Open
Open
I
F
6. C
IN
Open
f
i
Capacitance
bridge
L
O
Open
V
IN
7. t
ON
, t
OFF
Input
Open
V
OUT
R
L
Pulse
generator
(Note 1)
V
IN
Output
C
L
=
15 pF
(Note 2)
Input
t
r
90%
50%
10%
t
ON
Output
50%
50
μs
(Note 1)
t
f
90%
50%
10%
t
OFF
50%
V
OL
V
IH
=
2.4 V
0
V
OH
Note 1: Pulse Width 50
μs,
Duty Cycle 10%
Output Impedance 50
Ω,
t
r
≤
5 ns, t
f
≤
10 ns
Note 2: C
L
includes probe and jig capacitance
8. V
cef
Open
COM1, 2
Open
Output
I
cef
=
150 mA
V
cef
I
cef
=
150 mA (at. single pulse
=
5 ms)
4
2009-10-01
TD62064BP1G/BFG
I
OUT
– V
CE
(sat)
1.6
TD62064
Ta
=
25°C
2 mA
1.5
TD62064
I
OUT
– V
CE
(sat)
(mA)
1.2
(mA)
I
OUT
1.0
typ.
25°C max
1 mA
500
μA
I
OUT
Output current
0.8
Output current
2.0
0.4
IIN
=
300
μA
0.5
0
0
0.4
0.8
1.2
1.6
0
0
0.5
1.0
1.5
2.0
Output saturation voltage V
CE (sat)
(V)
Output saturation voltage V
CE (sat)
(V)
I
IN
– V
IN
2.0
TD62064
12
1.6
TD62064
Ta
=
25°C
I
IN
– V
IN
IOUT
=
100 mA
I
IN
(mA)
max
8
typ.
min
I
IN
(mA)
1.2
500 mA
1A
Input current
Input current
2.0
3.0
4.0
5.0
0.8
4
0.4
0
1.0
0
0
0.4
0.8
1.2
1.6
2.0
2.4
Input voltage
V
IN
(V)
Input voltage
V
IN
(V)
I
OUT
– I
IN
3.0
400
VCE
=
2 V
(1)
2.4
P
D
– Ta
(1) DIP-16 pin
On glass epoxy PCB
(50
×
50
×
1.6 mm Cu 50%)
(2) DIP-16 pin free air
(3) HSOP-16 pin
On glass epoxy PCB
(60
×
30
×
1.6 mm Cu 30%)
(2)
1.2
(3)
(4) HSOP-16 pin free air
(mA)
Ta
=
75 °C
25
−30
Power dissipation P
D
I
OUT
300
(W)
200
1.8
Output current
100
(4)
0.6
0
50
100
150
200
0
0
40
80
120
160
200
Input current
I
IN
(μA)
Ambient temperature Ta (°C)
5
2009-10-01
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