IC GATE NAND 1CH 2-INP 5DSBGA
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | DSBGA-5 |
| 针数 | 5 |
| Reach Compliance Code | not_compliant |
| Factory Lead Time | 1 week |
| Is Samacsys | N |
| 系列 | AUC |
| JESD-30 代码 | R-XBGA-B5 |
| 长度 | 1.4 mm |
| 逻辑集成电路类型 | NAND GATE |
| 最大I（ol） | 0.005 A |
| 功能数量 | 1 |
| 输入次数 | 2 |
| 端子数量 | 5 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA5,2X3,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 1.2/2.5 V |
| 传播延迟（tpd） | 3.2 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 2.7 V |
| 最小供电电压 (Vsup) | 0.8 V |
| 标称供电电压 (Vsup) | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 0.9 mm |
| Base Number Matches | 1 |
| SN74AUC1G00YEPR | SN74AUC1G00DBVR | SN74AUC1G00DCKR | SN74AUC1G00DCKRE4 | SN74AUC1G00DCKRG4 | SN74AUC1G00DRLR | SN74AUC1G00YZPR | |
|---|---|---|---|---|---|---|---|
| 描述 | IC GATE NAND 1CH 2-INP 5DSBGA | NAND Gate 1-Element 2-IN CMOS 5-Pin SOT-23 T/R | Single 2-Input Positive-NAND Gate 5-SC70 -40 to 85 | Single 2-Input Positive-NAND Gate 5-SC70 -40 to 85 | Single 2-Input Positive-NAND Gate 5-SC70 -40 to 85 | Single 2-Input Positive-NAND Gate 5-SOT-5X3 -40 to 85 | Single 2-Input Positive-NAND Gate 5-DSBGA -40 to 85 |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | SOT-23 | SOIC | SOIC | SOIC | SOT | BGA |
| 包装说明 | DSBGA-5 | SOT-23, 5 PIN | SC-70, 5 PIN | SC-70, 5 PIN | SC-70, 5 PIN | SOT-553, 5 PIN | DSBGA-5 |
| 针数 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| Reach Compliance Code | not_compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| Is Samacsys | N | N | N | N | N | N | N |
| 系列 | AUC | AUC | AUC | AUC | AUC | AUC | AUC |
| JESD-30 代码 | R-XBGA-B5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-F5 | R-XBGA-B5 |
| 长度 | 1.4 mm | 2.9 mm | 2 mm | 2 mm | 2 mm | 1.6 mm | 1.4 mm |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 最大I（ol） | 0.005 A | 0.009 A | 0.009 A | 0.009 A | 0.005 A | 0.009 A | 0.009 A |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | VFBGA | LSSOP | TSSOP | TSSOP | TSSOP | VSOF | VFBGA |
| 封装等效代码 | BGA5,2X3,20 | TSOP5/6,.11,37 | TSSOP5/6,.08 | TSSOP5/6,.08 | TSSOP5/6,.08 | FL6,.047,20 | BGA5,2X3,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 包装方法 | TAPE AND REEL | TR | TR | TR | TR | TR | TR |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V |
| 传播延迟（tpd） | 3.2 ns | 3.2 ns | 3.2 ns | 3.2 ns | 3.2 ns | 3.2 ns | 3.2 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | NO | NO | NO | NO | NO | NO | NO |
| 座面最大高度 | 0.5 mm | 1.45 mm | 1.1 mm | 1.1 mm | 1.1 mm | 0.6 mm | 0.5 mm |
| 最大供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 最小供电电压 (Vsup) | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| 标称供电电压 (Vsup) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | GULL WING | GULL WING | GULL WING | GULL WING | FLAT | BALL |
| 端子节距 | 0.5 mm | 0.95 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 0.9 mm | 1.6 mm | 1.25 mm | 1.25 mm | 1.25 mm | 1.2 mm | 0.9 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Factory Lead Time | 1 week | 1 week | 1 week | 6 weeks | - | 1 week | 1 week |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| JESD-609代码 | - | e4 | e4 | e4 | e4 | e4 | e1 |
| 负载电容（CL） | - | 15 pF | 15 pF | 15 pF | - | 15 pF | 15 pF |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 最大电源电流（ICC） | - | 0.01 mA | 0.01 mA | 0.01 mA | - | 0.01 mA | 0.01 mA |
| Prop。Delay @ Nom-Sup | - | 3.2 ns | 3.2 ns | 3.2 ns | - | 3.2 ns | 3.2 ns |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) |
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