IC MCU 8BIT 64KB FLASH 44TQFP
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
包装说明 | TQFP, TQFP44,.47SQ,32 |
Reach Compliance Code | compliant |
Factory Lead Time | 4 weeks |
具有ADC | YES |
其他特性 | OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ |
地址总线宽度 | 16 |
位大小 | 8 |
CPU系列 | 8051 |
最大时钟频率 | 24 MHz |
DAC 通道 | YES |
DMA 通道 | NO |
外部数据总线宽度 | 8 |
JESD-30 代码 | S-PQFP-G44 |
JESD-609代码 | e3 |
长度 | 10 mm |
湿度敏感等级 | 3 |
I/O 线路数量 | 38 |
端子数量 | 44 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TQFP |
封装等效代码 | TQFP44,.47SQ,32 |
封装形状 | SQUARE |
封装形式 | FLATPACK, THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
电源 | 2.5/3.3 V |
认证状态 | Not Qualified |
RAM(字节) | 4352 |
ROM(单词) | 65536 |
ROM可编程性 | FLASH |
座面最大高度 | 1.2 mm |
速度 | 24 MHz |
最大压摆率 | 8.5 mA |
最大供电电压 | 3.6 V |
最小供电电压 | 2.7 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 10 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
Base Number Matches | 1 |
AT89LP6440-20AU | AT89LP6440-20MU | AT89LP3240-20MU | AT89LP3240-20JU | AT89LP6440-20JU | AT89LP3240-20AU | AT89LP6440-20PU | AT89LP3240-20PU | |
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描述 | IC MCU 8BIT 64KB FLASH 44TQFP | 8-bit Microcontrollers - MCU Single-Cycle 8051 64K ISP Flash | IC MCU 8BIT 32KB FLASH 44VQFN | IC MCU 8BIT 32KB FLASH 44PLCC | IC MCU 8BIT 64KB FLASH 44PLCC | IC MCU 8BIT 32KB FLASH 44TQFP | IC MCU 8BIT 64KB FLASH 40DIP | IC MCU 8BIT 32KB FLASH 40DIP |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | TQFP, TQFP44,.47SQ,32 | HVQCCN, LCC44,.28SQ,20 | HVQCCN, LCC44,.28SQ,20 | QCCJ, LDCC44,.7SQ | GREEN, PLASTIC, MS-018AC, LCC-44 | TQFP, TQFP44,.47SQ,32 | DIP, DIP40,.6 | 0.600 INCH, GREEN, PLASTIC, MS-011AC, DIP-40 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
Factory Lead Time | 4 weeks | 7 weeks | 7 weeks | 12 weeks | 12 weeks | 7 weeks | 4 weeks | 4 weeks |
具有ADC | YES | YES | YES | YES | YES | YES | YES | YES |
其他特性 | OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ | OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ | OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ | OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ | OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ | OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ | OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ | OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ |
地址总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
CPU系列 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
最大时钟频率 | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz |
DAC 通道 | YES | YES | YES | YES | YES | YES | YES | YES |
DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | S-PQFP-G44 | S-PQCC-N44 | S-PQCC-N44 | S-PQCC-J44 | S-PQCC-J44 | S-PQFP-G44 | R-PDIP-T40 | R-PDIP-T40 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
长度 | 10 mm | 7 mm | 7 mm | 16.586 mm | 16.586 mm | 10 mm | 52.324 mm | 52.324 mm |
I/O 线路数量 | 38 | 38 | 38 | 38 | 38 | 38 | 38 | 38 |
端子数量 | 44 | 44 | 44 | 44 | 44 | 44 | 40 | 40 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TQFP | HVQCCN | HVQCCN | QCCJ | QCCJ | TQFP | DIP | DIP |
封装等效代码 | TQFP44,.47SQ,32 | LCC44,.28SQ,20 | LCC44,.28SQ,20 | LDCC44,.7SQ | LDCC44,.7SQ | TQFP44,.47SQ,32 | DIP40,.6 | DIP40,.6 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK, THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER | CHIP CARRIER | FLATPACK, THIN PROFILE | IN-LINE | IN-LINE |
电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 4352 | 4352 | 4352 | 4352 | 4352 | 4352 | 4352 | 4352 |
ROM(单词) | 65536 | 65536 | 32768 | 32768 | 65536 | 32768 | 65536 | 32768 |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
座面最大高度 | 1.2 mm | 1 mm | 1 mm | 4.572 mm | 4.572 mm | 1.2 mm | 4.826 mm | 4.826 mm |
速度 | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz |
最大压摆率 | 8.5 mA | 8.5 mA | 8.5 mA | 8.5 mA | 8.5 mA | 8.5 mA | 8.5 mA | 8.5 mA |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
端子形式 | GULL WING | NO LEAD | NO LEAD | J BEND | J BEND | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 0.8 mm | 0.5 mm | 0.5 mm | 1.27 mm | 1.27 mm | 0.8 mm | 2.54 mm | 2.54 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | DUAL | DUAL |
宽度 | 10 mm | 7 mm | 7 mm | 16.586 mm | 16.586 mm | 10 mm | 15.24 mm | 15.24 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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