The new Metal Hybrid PPTC device, MHP-TAT18, offers
a 9VDC rating and a higher current rating than typical
MHP-TAM device. This helps to meet the battery safety
requirements of higher-capacity LiP and prismatic
batteries found in the latest gaming PC and ultra-book
products. Hybrid MHP technology connects a bimetal
protector in parallel with a Polymeric Positive Temperature
Coefficient (PPTC) device. The resulting MHP-TAT18
(Thermal Activation) series helps to provide resettable
overtemperature protection, while utilizing the PPTC device
to act as a heater and to help keep the bimetal latched until
the fault is removed.
Agency Approvals
Agency
Agency File Number
Pending
Circuit Diagram
Typical Electrical Ratings
Specification
LI
MHP-TAT18-9-72
M
E
MHP-TAT18-9-77
Operation Temperature
Reset Temperature
Contact Rating
IN
A
Features
Applications
MHP-TAT18-9-82
• Miniature Thermal Cutoff (TCO) device
• High current capacity, low resistance
• Overtemperature and overcurrent protection
for lithium polymer and prismatic cells
• Multiple activation temperature ratings
(72°C, 77°C, 82°C, 85°C, 90°C)
• Compact size (L: 5.8mm x W: 3.80mm x H: 1.05mm)
allows for ultra-thin battery pack designs
Battery cell protection for high-capacity Lithium Polymer
and Prismatic cells used in:
• Gaming PCs
• Notebook PCs
• Ultra-book
• Tablets
72°C+/-5°C
≥40°C
77°C+/-5°C
≥40°C
82°C+/-5°C
≥40°C
DC 9V/30A, 6000 Cycles
DC 5V/80A, 100 Cycles
DC 28V/30A, 100 Cycles
3V
200mA @25°C
3.5 milliohms Max.
P
R
Maximum Breaking Current
Maximum Open Voltage
Minimum Hold Voltage
Resistance
Maximum Leakage Current
Precautions for Electrical Characteristics:
a.
Device electrical characteristics may change depending on installation conditions. Users should independently evaluate the suitability of and test each product in their own application.
b.
If any terminal or lead extensions are added to the device, especially in the case of high current discharging, the device performance may be negatively impacted due to variations
in welding methods or materials. Please avoid designs that might cause heat to be generated around the joints of the lead extensions or on the extended terminals.
c.
SMT solder reflow, wave-soldering and manual soldering irons are not permitted.