Latches 3 St ABT Octal DType
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC20/24,.14X.18,20 |
| 针数 | 20 |
| Reach Compliance Code | unknow |
| 系列 | LVT |
| JESD-30 代码 | R-PQCC-N20 |
| JESD-609代码 | e4 |
| 长度 | 4.5 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.064 A |
| 湿度敏感等级 | 2 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC20/24,.14X.18,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Su | 3.9 ns |
| 传播延迟（tpd） | 4.9 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.5 mm |
| SN74LVTH573RGYRG4 | SN74LVTH573PWRE4 | SN74LVTH573PWE4 | SN74LVTH573DWE4 | SN74LVTH573DWRG4 | SN74LVTH573DWRE4 | SN74LVTH573DWG4 | SN74LVTH573NSRE4 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Latches 3 St ABT Octal DType | Latches 3 St ABT Octal DType | Latches ABT 3.3V | 3.3-V ABT Octal Transparent D-Type Latches With 3-State Outputs 20-SOIC -40 to 85 | Latches 3.3V ABT Octal Transp DType Latches | 3.3-V ABT Octal Transparent D-Type Latches With 3-State Outputs 20-SOIC -40 to 85 | Latches 3.3V ABT Octal Transp DType Latches | Latches 3 St ABT Octal DType |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN | TSSOP | TSSOP | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | HVQCCN, LCC20/24,.14X.18,20 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | SOP, SOP20,.4 | SOP, SOP20,.4 | SOP, SOP20,.4 | SOP, SOP20,.4 | SOP, SOP20,.3 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknow | unknow | unknow | compli | unknow | compli | unknow | unknow |
| 系列 | LVT | LVT | LVT | LVT | LVT | LVT | LVT | LVT |
| JESD-30 代码 | R-PQCC-N20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 4.5 mm | 6.5 mm | 6.5 mm | 12.8 mm | 12.8 mm | 12.8 mm | 12.8 mm | 12.6 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A |
| 湿度敏感等级 | 2 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | TSSOP | TSSOP | SOP | SOP | SOP | SOP | SOP |
| 封装等效代码 | LCC20/24,.14X.18,20 | TSSOP20,.25 | TSSOP20,.25 | SOP20,.4 | SOP20,.4 | SOP20,.4 | SOP20,.4 | SOP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 包装方法 | TAPE AND REEL | TR | TUBE | TUBE | TAPE AND REEL | TR | TUBE | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Su | 3.9 ns | 3.9 ns | 3.9 ns | 3.9 ns | 3.9 ns | 3.9 ns | 3.9 ns | 3.9 ns |
| 传播延迟（tpd） | 4.9 ns | 4.9 ns | 4.9 ns | 4.9 ns | 4.9 ns | 4.9 ns | 4.9 ns | 4.9 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1.2 mm | 1.2 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.5 mm | 4.4 mm | 4.4 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 5.3 mm |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
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