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OM13086UL

产品描述A70CM CLOUD CONNECTIVITY KIT
产品类别开发板/开发套件/开发工具   
文件大小187KB,共2页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
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OM13086UL概述

A70CM CLOUD CONNECTIVITY KIT

OM13086UL规格参数

参数名称属性值
类型收发器;802.11 b/g/n(Wi-Fi,WiFi,WLAN)
频率2.4GHz
配套使用产品/相关产品LPC43S67,ZentriOS
所含物品

OM13086UL文档预览

OM13086
LPC43S67-A70CM Cloud Connectivity Kit
Rev 1.2 – November 18th 2015
Product Brief
The LPCXpresso43S67 – A70CM Cloud Connectivity Kit provides a complete hardware and software platform
for developers to evaluate and prototype with the LPC43S6x processor family and A70CM in cloud connected
applications based on IEEE802.11b/g/n wireless connectivity.
Feature summary
LPCXpresso43S67 (OM13084) with LPC43S67 triple-core (M4F and dual M0) MCU running
at up to 204MHz
Zentri IEEE 802.11b/g/n SD card (featuring Murata SN8000 module)
Fully supported by ZentriOS
High Speed USB based debug probe with CMSIS-DAP and SEGGER J-Link OB protocol options
NXP A7001CM Secure Microcontroller
NTAG plug-in card featuring NXP NT3H1201W0FHK Forum Type 2 Tag with field detection pin and I²C
LPC General Purpose Shield (OM13082) with Ethernet (RJ45), LCD screen and user LEDs, Bosch
BMI160 accelerometer/gyroscope, temperature sensor, potentiometer, joystick and SD card slot
High speed USB A/B connector for host or slave operation
8Mb Macronix quad SPI flash
FTDI UART connector and built-in UART to USB bridge options
USB cables included
Overview
The Kit combines an LPCXpresso43S67 board, which also includes an A7001CM Secure Microcontroller, with a
Zentri-designed, IEEE802.11b/g/n radio board featuring the Murata SN8000 industrial-grade module, to provide
a high performance MCU platform for application development.
The LPC General Purpose Shield also included in the Kit provides access to Ethernet connectivity along with
several sensing devices/inputs and a convenient LCD display. In addition to on-board sensors, the Shield also
provides easy access to terminal blocks for CAN bus analog inputs.
© NXP B.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19th January 2015
OM13086
LPC43S67-A70CM Cloud Connectivity Kit
Rev 1.2 – November 18th 2015
Product Brief
The A7001CM Secure Microcontroller complements the LPC43S67 by offering tamper-resistant public and
secret key encryption, certificate management and the ability to securely store other sensitive system
information.
The plug-in NTAG I
2
C board provides a convenient option for applications such as system
commissioning/configuration and/or passing diagnostic information with an NFC-enabled device such as an
Android phone.
ZentriOS
Zentri is radically changing the way product companies deliver secure mobile and cloud connected products
that deliver rich connected experiences. Delivering the connected experience product buyers expect, Zentri
enables secure product authentication, provides license management, seamless and secure OTA software
update, remote product diagnosis and analytics, and more. The heart of Zentri's platform is ZentriOS, a
complete connected product operating system available as a licensable software solution. Cloud device
management software is available as a service or as a connector for existing cloud partners. Users of the
OM13086 kit can evaluate ZentriOS for free. See
http://www.zentri.com/nxp
for more information.
Development Tools
The Kit is supported by LPCXpresso IDE, available for free download at
http://www.lpcware.com/lpcxpresso/download.
The Zentri SDK, can be easily combined with the rich editing and
debugging capabilities of the LPCXpresso IDE by installation of a free plugin. The LPCXpresso43S67’s on-
board Link2 probe provides full source code debugging capability without the need for any additional hardware.
In addition to ZentriOS (as mentioned above), NXP provides a full set of example for the LPCXpress43S67 and
LPC General Purpose shield, available for free download at
http://www.lpcware.com/lpcopen.
Board specifications
Recommended operating conditions: 0 to 70
o
C ambient
Weight: 91gm (3.2 ounces) excluding cables
Size: 220mm (max length) x 63mm, fully assembled, including connectors
© NXP B.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19th January 2015

 
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