PL
IA
Features
■
■
■
■
■
Double contacts offer high reliability
Low contact resistance
Self-clean on contact area
Splay terminals allow for automatic
insertion by IC insertion machine
Straight terminals are available for
manual insertion
*R
oH
S
CO
The SND Series is currently available,
although not recommended for new
designs.
M
NT
■
RoHS compliant*
SND Series DIP Switch (Machine Insertable Type)
Electrical Characteristics
Electrical Life ............2,000 operations min.
per switch, 24 VDC, 25 mA
Non-Switching Rating ......100 mA, 50 VDC
Switching Rating ................25 mA, 24 VDC
Contact Resistance
........................50 milliohms max. at initial
..............100 milliohms max. after life test
Insulation Resistance....100 megohms min.
Dielectric Strength ............500 VAC/minute
Capacitance ..................5 pf max. between
adjacent closed switch
Circuit ....................Single pole single throw
Environmental Characteristics
Mechanical Life..2,000 operations per switch
Operation Force ......................1,000 g max.
Stroke ..............................................1.0 mm
Operating Temp. Range ....-20 °C to +85 °C
Storage Temperature ........-40 °C to +85 °C
Vibration Test ......................MIL-STD-202F,
Method 201A
Frequency ................10-55-10 Hz/minute
Directions ................X,Y,Z, three mutually
perpendicular directions
Time......................2 hours each direction.
High reliability
Shock Test ..........................MIL-STD-202F,
Method 213B, Condition A
Gravity ..........50 G (peak value), 11 msec
Direction & Times....................6 sides and
3 times in each direction.
High reliability
Physical Characteristics
Base and Cover Materials
......................UL94V-0 high-temperature
thermoplastic PPS
Color ................................................Black
Actuator Materials ................UL94V-0 nylon
thermoplastic
Color ................................................White
Contact Materials ....................Alloy copper
Terminal Materials ..............................Brass
Contact Plating Materials
......................3 micro inches gold plating
over 40 micro inches nickel
Terminal Plating Materials ....................Gold
Wave Soldering Process
†
....Recommended solder temp. at 260 °C
(500 °F) max., 5 sec.
Hand Soldering Process
†
................Use a soldering iron of 30 watts
or less, controlled at 320 °C (608 °F) for
approx. 2 sec. while applying solder
Standard Packaging
......IC tubes/all poles in the “off” position
Product Dimensions
A +.006/ -0
(A + .0002/-0)
SND Series Dimensions
1.9
(.075)
DIP
ON
1
2
3
4
5
6
7
8
6.20
(.244)
3.60
MAX.
(.142)
MODEL NO.
SND-12
SND-10
SND-9
SND-8
SND-7
SND-6
SND-5
SND-4
SND-3
SND-2
SND-1
POS.
12
10
9
8
7
6
5
4
3
2
1
DIM. A
31.42 (1.237)
26.34 (1.037)
23.80 (.937)
21.26 (.837)
18.72 (.737)
16.18 (.637)
13.64 (.537)
11.10 (.437)
8.56 (.337)
6.02 (.237)
3.48 (.137)
DIM. B
26.94 (1.100)
22.86 (.900)
20.32 (.800)
17.78 (.700)
15.24 (.600)
12.70 (.500)
10.16 (.400)
7.62 (.300)
5.08 (.200)
2.54 (.100)
—
1.74 2.54
(.069) (.100)
TYP.
0.50
(.020)
B
0.70
(.028)
4.30
(.169)
MIN.
1.0
(.039)
How to Order
SND X - 1 S - X
Model
Actuator
• X = Raised Actuator
• R = Recessed Actuator
Number of Positions
• 1 = 1 Position
• 2 = 2 Positions
• 3 = 3 Positions
• 4 = 4 Positions
• 5 = 5 Positions
• 6 = 6 Positions
• 7 = 7 Positions
• 8 = 8 Positions
• 9 = 9 Positions
• 10 = 10 Positions
• 12 = 12 Positions
7.80
(.307)
7.62 ± 0.50
(.30 ± .020)
9.84 ± 0.50
(.387 ± .020)
SNDR SERIES
0.25
(.010)
SNDX SERIES
RECOMMENDED PCB LAYOUT
B ± 0.10 = 2.54 x (P-1)
(B ± .004 = .100 x (P-1)
Terminal Type
• S = Splay (Machine Insertion Type)
• H = Straight (Manual Insertion Type)
Seal
• X = Standard (Not Sealed)
• T = Top Tape Sealed
(“R” actuator only, excluding 1 position)
Reflow Soldering Profile
0.97 ± 0.05
DIA.
(.038 ± .002)
7.62 ± 0.10
(.300 ± .004)
275
225
Temperature (°C)
175
125 120
°C
75
30-40 Sec.
25
0
20
40
60
10-15
Sec.
80-90 Sec.
35-60
Sec.
240
°C
180
°C
DIMENSIONS:
MM
(IN)
SCHEMATIC (TYP.)
1-12 POSITIONS AVAILABLE
80 100 120 140 160 180 200
Time (Seconds)
†For best results, keep all switch contacts in their “off”
position for all operations.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
SND Series DIP Switch (Machine Insertable Type)
Packaging Specifications
12.0
±
0.1
(.472
±
.004)
11.0
±
0.1
(.433
±
.004)
0.5
(.019)
2.0
(.08)
0.5
(.019)
11.0
±
0.1
(.433
±
.004)
5.0
±
0.2
1.45
±
0.1
0.1
(.433
±
.004) (.20
±
.004)
R
(.004)
2.5
(.100)
5.0
±
0.1
(.20
±
.004)
0.5
(.019)
2.5
(.100)
5.0 +0/-.2
(.20 +0/-.004)
2.0
(.08)
8.0 +0.2/-0.1
(.315 +.008/-.004)
4.0
(.16)
6.50
(.260)
5.35
(.210)
16.50
(.650)
4.15
(.160)
0.5
(.019)
0.5
(.019)
REV. 02/06
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
