TD62064APG/AFG
TOSHIBA Bipolar Digital Integrated Circuit
Silicon Monolithic
TD62064APG, TD62064AFG
4ch High-Current Darlington Sink Driver
The TD62064APG/AFG are high-voltage, high-current
darlington drivers comprised of four NPN darlington pairs.
All units feature integral clamp diodes for switching inductive
loads.
Applications include relay, hammer, lamp and stepping motor
drivers.
TD62064APG
Features
•
•
•
•
•
•
•
Output current (single output) 1.5 A (max)
High sustaining voltage output 50 V (min)
Output clamp diodes
Input compatible with TTL and 5 V CMOS
GND terminal
=
Heat sink
Package type-APG: DIP-16 pin
Package type-AFG: HSOP-16 pin
TD62064AFG
Pin Assignment (top view)
TD62064APG
O4
16
NC
15
I4
14
Heat sink
& GND
13
12
I3
11
NC
10
O3
9
Weight
DIP16-P-300-2.54A: 1.11 g (typ.)
HSOP16-P-300-1.00: 0.50 g (typ.)
1
COM
2
O1
3
I1
4
5
Heat sink
& GND
6
I2
7
O2
8
COM
TD62064AFG
O4
16
NC
15
I4
14
NC
13
Heat sink
& GND
NC
12
I3
11
NC
10
O3
9
1
COM
2
O1
3
I1
4
NC
Heat sink
& GND
5
NC
6
I2
7
O2
8
COM
1
2011-01-14
TD62064APG/AFG
Schematics
(each driver)
COMMON
Input
8.2 kΩ
230
Ω
1.1 kΩ
Output
GND
Note: The input and output parasitic diodes cannot be used as clamp diodes.
Precautions for Using
(1)
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed
due to short-circuit between outputs, air contamination fault, or fault by improper grounding.
This IC is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba recommends that
the diodes (pins 1 and 8) be connected to the secondary power supply pin so as to absorb the counter
electromotive force generated by the load. Please adhere to the device’s absolute maximum ratings.
Toshiba recommends that zener diodes be connected between the diodes (pins 1 and 8) and the secondary power
supply pin (as the anode) so as to enable rapid absorption of the counter electromotive force. Again, please
adhere to the device’s absolute maximum ratings.
(2)
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics
Output sustaining voltage
Output current
Input current
Input voltage
Clamp diode reverse voltage
Clamp diode forward current
Power dissipation
Operating temperature
Storage temperature
APG
AFG
Symbol
V
CE (SUS)
I
OUT
I
IN
V
IN
V
R
I
F
P
D
T
opr
T
stg
Rating
−0.5
to 50
1.5
50
−0.5
to 17
50
1.5
1.47/2.7 (Note 1)
0.9/1.4 (Note 2)
−40
to 85
−55
to 150
Unit
V
A/ch
mA
V
V
A
W
°C
°C
Note 1: On glass epoxy PCB (50
×
50
×
1.6 mm Cu 50%)
Note 2: On glass epoxy PCB (60
×
30
×
1.6 mm Cu 30%)
2
2011-01-14
TD62064APG/AFG
Operating Conditions
(Ta
=
−
40
to
85°C)
Characteristics
Output sustaining voltage
Symbol
V
CE (SUS)
Test Condition
⎯
DC1 circuit, Ta
=
25°C
APG (Note 1)
t
pw
=
25 ms
4 circuits
T
j
=
120°C
Ta
=
85°C
V
IN
Input voltage
Output ON
Output OFF
Input current
Clamp diode reverse voltage
Clamp diode forward current
Power dissipation
APG
AFG
V
IN (ON)
V
IN (OFF)
I
IN
V
R
I
F
P
D
Ta
=
85°C
Ta
=
85°C
I
OUT
=
1.25 A
⎯
⎯
⎯
⎯
(Note 1)
(Note 2)
Duty
=
10%
Duty
=
50%
Duty
=
10%
Duty
=
50%
⎯
Min
0
0
0
0
0
0
0
2.5
0
0
0
⎯
⎯
⎯
Typ.
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Max
50
1250
1250
390
907
172
8
8
0.4
20
50
1.25
1.4
0.7
mA
V
A
W
V
mA/ch
Unit
V
Output current
I
OUT
AFG (Note 2)
Note 1: On glass epoxy PCB (50
×
50
×
1.6 mm Cu 50%)
Note 2: On glass epoxy PCB (60
×
30
×
1.6 mm Cu 30%)
Electrical Characteristics
(Ta
=
25°C)
Characteristics
Output leakage current
Symbol
I
CEX
Test
Circuit
1
Test Condition
V
CE
=
50 V, Ta
=
25°C
V
CE
=
50 V, Ta
=
85°C
I
OUT
=
1.25 A, I
IN
=
2 mA
I
OUT
=
0.75 A, I
IN
=
935
μA
V
CE
=
2 V
I
OUT
=
1.0 A
I
OUT
=
1.25 A
Min
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Typ.
⎯
⎯
⎯
⎯
800
1500
⎯
⎯
⎯
⎯
15
0.1
1.0
Max
50
500
1.6
1.25
⎯
⎯
2.4
50
100
2.0
⎯
⎯
⎯
Unit
μA
Output saturation voltage
V
CE (sat)
2
V
DC current transfer ratio
Input voltage (output on)
Clamp diode leakage current
Clamp diode forward voltage
Input capacitance
Turn-ON delay
Turn-OFF delay
h
FE
V
IN (ON)
I
R
V
F
C
IN
t
ON
t
OFF
2
3
4
5
6
7
7
⎯
V
μA
V
pF
μs
μs
I
OUT
=
1.25 A, I
IN
=
2 mA
V
R
=
50 V, Ta
=
25°C
V
R
=
50 V, Ta
=
85°C
I
F
=
1.25 A
V
IN
=
0 V, f
=
1 MHz
C
L
=
15 pF, V
OUT
=
50 V,
R
L
=
42
Ω
C
L
=
15 pF, V
OUT
=
50 V,
R
L
=
42
Ω
3
2011-01-14
TD62064APG/AFG
Test Circuit
1. ICEX
Open
I
CEX
Open
V
CE
V
CE
, V
CE (sat)
V
IN (ON)
V
CE
I
IN
2. V
CE (sat)
, h
FE
Open
I
OUT
3. V
IN (ON)
Open
I
OUT
4. I
R
5. V
F
V
F
V
R
Open
Open
6. C
IN
Open
f
i
Capacitance
bridge
L
O
Open
V
IN
I
R
Open
Open
I
F
7. t
ON
, t
OFF
Input
Open
V
OUT
R
L
Pulse
generator
(Note 1)
V
IN
Output
C
L
=
15 pF
(Note 2)
Output
Input
t
r
90%
50%
10%
t
ON
50%
50
μs
(Note 1)
t
f
90%
50%
10%
t
OFF
50%
V
OL
V
IH
=
2.4 V
0
V
OH
Note 1: Pulse Width 50
μs,
Duty Cycle 10%
Output Impedance 50
Ω,
t
r
≤
5 ns, t
f
≤
10 ns
Note 2: C
L
includes probe and jig capacitance
4
2011-01-14
TD62064APG/AFG
I
OUT
– V
CE
(sat)
1.5
TD62064APG
12
TD62064APG
I
IN
– V
IN
(A)
I
OUT
1.0
typ.
25°C max
Input current I
IN
(mA)
max
8
typ.
min
Output current
0.5
4
0
0
0.5
1.0
1.5
2.0
0
1.0
2.0
3.0
4.0
5.0
Collector-emitter saturation voltage
V
CE (sat)
(V)
Input voltage
V
IN
(V)
I
OUT
– I
IN
3.0
400
VCE
=
2 V
(1)
2.4
P
D
– Ta
(1) DIP-16 pin
on glass epoxy PCB
(50
×
50
×
1.6 mm Cu 50%)
(2) DIP-16 pin free air
(3) HSOP-16 pin
on glass epoxy PCB
(60
×
30
×
1.6 mm Cu 30%)
(2)
1.2
(3)
(4) HSOP-16 pin free air
(mA)
Ta
=
75 °C
25
−30
Power dissipation P
D
I
OUT
300
(W)
200
1.8
Output current
100
(4)
0.6
0
50
100
150
200
0
0
40
80
120
160
200
Input current I
IN
(μA)
Ambient temperature Ta (°C)
I
OUT
– Duty cycle
1500
n
=
1
1500
I
OUT
– Duty cycle
n
=
1
(mA)
n
=
3
900
n
=
4
n
=
2
(mA)
1200
1200
n
=
4
900
n
=
3
n
=
2
I
OUT
Output current
Output current
I
OUT
600
600
300
TD62064APG
Ta
=
25°C
n-ch ON
300
TD62064APG
Ta
=
85°C
n-ch ON
0
0
20
40
60
80
100
0
0
20
40
60
80
100
Duty Cycle
(%)
Duty Cycle
(%)
5
2011-01-14
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