IC I/O EXPANDER I2C 8B 16HVQFN
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | QFN |
| 包装说明 | 3 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT758-1, HVQFN-16 |
| 针数 | 16 |
| 制造商包装代码 | SOT758-1 |
| Reach Compliance Code | compliant |
| JESD-30 代码 | S-PQCC-N16 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| I/O 线路数量 | 8 |
| 端口数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC16,.12SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2.3/5.5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 2.3 V |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3 mm |
| uPs/uCs/外围集成电路类型 | PARALLEL IO PORT, GENERAL PURPOSE |
| Base Number Matches | 1 |
| PCA9674ABS,118 | PCA9674TS,112 | PCA9674PW-S911118 | PCA9674APW,118 | PCA9674D,512 | PCA9674PW/S911,118 | PCA9674AD,518 | PCA9674ATS,118 | PCA9674D,518 | PCA9674TS,118 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC I/O EXPANDER I2C 8B 16HVQFN | IC I/O expander i2c 8B 20ssop | Interface - I/O Expanders 8-BIT I2C FM+ QB GPIO INT PU | IC I/O EXPANDER I2C 8B 16TSSOP | IC I/O EXPANDER I2C 8B 16SOIC | IC I/O EXPANDER I2C 8B 16TSSOP | IC I/O EXPANDER I2C 8B 16SOIC | IC I/O EXPANDER I2C 8B 20SSOP | IC I/O EXPANDER I2C 8B 16SOIC | IC I/O EXPANDER I2C 8B 20SSOP |
| Brand Name | NXP Semiconductor | NXP Semiconduc | - | NXP Semiconductor | NXP Semiconductor | - | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | QFN | SSOP2 | - | TSSOP | SOP | TSSOP | SOP | SSOP2 | SOP | SSOP2 |
| 包装说明 | 3 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT758-1, HVQFN-16 | LSSOP, SSOP20,.25 | - | TSSOP, TSSOP16,.25 | SOP, SOP16,.4 | TSSOP, | SOP, SOP16,.4 | LSSOP, SSOP20,.25 | SOP, SOP16,.4 | LSSOP, SSOP20,.25 |
| 针数 | 16 | 20 | - | 16 | 16 | 16 | 16 | 20 | 16 | 20 |
| 制造商包装代码 | SOT758-1 | SOT266-1 | - | SOT403-1 | SOT162-1 | - | SOT162-1 | SOT266-1 | SOT162-1 | SOT266-1 |
| Reach Compliance Code | compliant | unknow | - | compliant | compliant | unknown | compliant | unknown | compliant | unknown |
| JESD-30 代码 | S-PQCC-N16 | R-PDSO-G20 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G20 | R-PDSO-G16 | R-PDSO-G20 |
| JESD-609代码 | e4 | e4 | - | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 3 mm | 6.5 mm | - | 5 mm | 10.3 mm | 5 mm | 10.3 mm | 6.5 mm | 10.3 mm | 6.5 mm |
| 湿度敏感等级 | 1 | 1 | - | 1 | 2 | - | 2 | 1 | 2 | 1 |
| 位数 | 8 | 8 | - | 8 | 8 | - | 8 | 8 | 8 | 8 |
| I/O 线路数量 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端口数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 20 | - | 16 | 16 | 16 | 16 | 20 | 16 | 20 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | LSSOP | - | TSSOP | SOP | TSSOP | SOP | LSSOP | SOP | LSSOP |
| 封装等效代码 | LCC16,.12SQ,20 | SSOP20,.25 | - | TSSOP16,.25 | SOP16,.4 | - | SOP16,.4 | SSOP20,.25 | SOP16,.4 | SSOP20,.25 |
| 封装形状 | SQUARE | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | - | 260 | 260 | - | 260 | 260 | 260 | 260 |
| 电源 | 2.3/5.5 V | 2.3/5.5 V | - | 2.3/5.5 V | 2.3/5.5 V | - | 2.3/5.5 V | 2.3/5.5 V | 2.3/5.5 V | 2.3/5.5 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1.5 mm | - | 1.1 mm | 2.65 mm | 1.1 mm | 2.65 mm | 1.5 mm | 2.65 mm | 1.5 mm |
| 最大供电电压 | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 2.3 V | 2.3 V | - | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 | 3 V | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | - | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.65 mm | - | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm |
| 端子位置 | QUAD | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 30 | - | 30 | 30 | - | 30 | 30 | 30 | 30 |
| 宽度 | 3 mm | 4.4 mm | - | 4.4 mm | 7.5 mm | 4.4 mm | 7.5 mm | 4.4 mm | 7.5 mm | 4.4 mm |
| uPs/uCs/外围集成电路类型 | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | - | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE |
| Base Number Matches | 1 | 1 | - | 1 | 1 | - | 1 | 1 | 1 | 1 |
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