*Customer:
SPECIFICATION
ITEM
MODEL
Revision NO.
CHIP LED DEVICE
SSC-FR104-II1
Rev5.2 (060504)
[Contents]
1. Features
2. Absolute maximum ratings
3. Electro-optical characteristics
4. Characteristic diagram
5. Soldering profile
6. Outline dimension
7. Packing
8. Reel packing structure
9.
Precaution for use
Pb Free
Customer
Approved by
Approved by
Approved by
Supplier
Drawn by
Checked by
Approved by
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-FR104-II1
Seoul Semiconductor
- 1/7 -
1. Features
Package : 1.6×0.8×0.4 mm
Untinted, Diffused flat mold
Wavelength : 625 nm
2. Absolute Maximum Ratings
Parameter
Power Dissipation
Forward Current
Peak Forward Current
*1
Reverse Voltage
Operating Temperature
Storage Temperature
Symbol
P
d
I
F
I
FM
V
R
T
opr
T
stg
Value
69
30
50
5
-30 ~ 85
-40 ~ 100
(Ta=25℃)
Unit
½
㎃
㎃
V
℃
℃
*1 I
FM
conditions: Pulse width Tw≤ 0.1ms and Duty ratio≤ 1/10
3. Electro-Optical Characteristics
Parameter
Forward Voltage
Reverse Current
Luminous Intensity
*2
Wavelength
Spectral Bandwidth
Viewing angle
*3
Symbol
V
F
I
R
I
V
λ
D
(Ta=25℃)
Condition
I
F
=5㎃
V
R
=5V
I
F
=5㎃
I
F
=20㎃
I
F
=20㎃
I
F
=5㎃
Min
1.8
-
16
619
-
-
Typ
1.95
-
28
625
30
120
Max
2.30
10
44
629
-
-
Unit
V
㎂
mcd
㎚
㎚
˚
Δλ
2θ
1/2
*2 The luminous intensity I
V
is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package.
*3
θ
1/2
is the off-axis where the luminous intensity is 1/2 the peak intensity.
[Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 5, 20mA
within the maximum ratings shown above. All measurements were made under the standardized environment of SSC.
(Tolerance :
Iv
±10
%,
λ
D
±2
nm, VF
±0.1
V)
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-FR104-II1
- 2/7 -
4. Characteristic Diagrams
Forward Current vs Forward Voltage
100
Luminous Intensity vs Forward Current
1000
Luminous Intensity I
V
(%)
Forward Current I
F
(mA)
10
100
1
10
0.1
1.6
1.8
2.0
2.2
2.4
1
0.1
1
10
100
Forward Voltage V
F
(V)
Forward Current I
F
(mA)
Forward Current Derating Curve
Radiation Diagram
50
40
Forward current I
F
(mA)
30
20
10
0
-25
0
25
50
75
100
Ambient temperature Ta(? )
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-FR104-II1
- 3/7 -
5. Soldering Profile
(1) Reflow Soldering Conditions / Profile
Preliminary heating to be at 150℃max. for 2 minutes max.
Soldering heat to be at 230
±
5℃max. for 5 seconds max.
LED Surface temperature
LED Surface temperature
°C
Operation heating
230
150
~
120
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
Relative Spectral Emission
0
60 to 120 sec.
5sec. max
(2) Reflow Soldering Conditions /Lead-Free Solder
Preliminary heating to be at 150℃max. for 2 minutes max.
Soldering heat to be at 255℃(+5/-0)℃max. for 10 seconds max.
°C
Operation heating
255
(+5)
150
~
120
0
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
60 to 120 sec.
5 to 10 sec.
(3) Hand Soldering conditions
Not more than 3 seconds @MAX280℃, under Soldering iron.
[Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-FR104-II1
- 4/7 -
6. Outline Dimension
Tolerance:
±0.1,
0.3
(0.13)
Resin
1.1
0.8
1.6
1.2
2.4
Unit:
㎜
PCB
0.3
0.8
0.4
±0.05
0.8
[Recommended Solder Pattern]
7. Packing
1.5
+0.1
-0
±0.05
1.85
±0.05
1.75
2.0
±0.05
±0.1
4.0
±0.1
0.2
±0.05
3.5
(2.75)
4.0
±0.1
0.5
±0.08
0.95
±0.05
8.0
±0.2
0.5
±0.05
180
+0
-3
11.4
9
±0.3
2
±0.2
+0.2
-0
22
13
±0.2
Label
60
Tolerance:
±0.2,
Unit:
㎜
(1) Quantity : 4,000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be
±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off
from the carrier tape at 10˚ angle to be the carrier tape.
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.
SSC-FR104-II1
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 5/7 -
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