REVISION AC
DO NOT
SCALE FROM
THIS PRINT
"H" REF (SEE TABLE 3)
"M" REF
SEAF-XX-XX-X-XX-X-RA-XX-TR
No OF POSITIONS
-20,-30,-40,-50
(PER ROW)
LEAD STYLE
-01
"A"
PACKAGING
-TR: TAPE & REEL
(STANDARD PACKAGING)
(SEE NOTE 4 & 7)
.522 13.26 (TYP)
TO WAFER
C
PLATING SPECIFICATION
-S: SELECTIVE GOLD,
30µ GOLD, MATTE TIN ON TAILS
(USE SUB-IM-C-242-XX-S-X)
-L: LIGHT SELECTIVE GOLD,
10µ GOLD, MATTE TIN ON TAILS
(USE SUB-IM-C-242-XX-L-X)
No OF ROWS
-04,-06,*-08,*-10
(* = SEE NOTE 8)
OPTIONS
-GP: GUIDE POST HOLE
-LP: LATCH POST
(USE WITH SEAC ONLY)
(-06 ROW, ALL POS AND
-08 ROW, 40 POS ONLY)
(NOT AVAILABLE WITH -GP OPTION)
-K: PAD
RIGHT ANGLE
-RA
SOLDER COMPOSITION
C
& STYLE
-1: 63% TIN / 37% LEAD CHARGE TAIL
(USE SUB-IM-C-242-XX-XX-X-1)
-2: 95.5% TIN / 3.8 SILVER / 0.7% COPPER
LEAD FREE CHARGE TAIL
(USE SUB-IM-C-242-XX-XX-X-2)
"A"
.592 15.04
REF
"F" REF
C
L
.060 1.52
REF
"G" REF
"B" REF
"A"
C
PIN D1
"G"
.0500 1.270 (TYP)
(TOL NON-ACCUM)
C
.050 1.27 REF
.241 6.12
REF
.035 0.89 REF
.100 2.54 REF
.0500 1.270 (TYP)
C
L
C
.140±.007 3.55±0.18
C
"N"±.007 (SEE SECTION E-E)
(SEE NOTE 9)
C
.025 0.64
REF (TYP)
PIN A1
"G"
(SEE SHT 2)
C
"D"
"E" (REF)(ALIGNMENT PIN CENTERS)
C
L
PIN A1
.044 1.12
REF
.315 7.99
REF
(A-PIN C )
L
'J'
.044 1.12
"E"
"E"
PIN D1
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. MINIMUM PUSH-OUT FORCE: .50 LBS[2.2N].
3. INSPECT DIMENSION AT FIRST POSITION WAFER LOCATION ONLY, FIRST AND LAST PIN.
4. ONLY FULL REEL QUANTITIES ARE SHIPPED ON A REEL WITH LEADER AND TRAILER.
5. NOTE DELETED
6. NOTE DELETED
7. ATTACH LABEL "SEAX-0001" TO EACH TAPE & REEL PACKAGE.
8. ON -08 & -10 ROW ASSEMBLIES, SEE FIG 10, SHEET 5 FOR CAT FIXTURE VIEW.
9. CHECK DIMENSION ON FIRST AND LAST ROW OF TAILS.
10. A 20~30°C TEMPERATURE DIFFERENCE MAY EXIST BETWEEN THIS HIGH-DENSITY COMPONENT AND THE BOARD
SURFACE DURING REFLOW. SAMTEC RECOMMENDS A THERMAL STUDY BE PERFORMED TO UNDERSTAND THE
TEMPERATURE GRADIENTS YOU MAY EXPERIENCE.
11. SOME RELAXATION/WARPING OF THE BACK STRAP IS ACCEPTABLE AFTER PROCESSING.
12. SEE SHEET 5 FOR PROCESSING INFORMATION.
13. VOID PATTERN MAY VARY BY ROW AND END OPTION.
(SEAF-20-01-X-04-X-RA-GP)
(SOME DETAIL OMITTED FOR CLARITY)
FIG 1
.034 0.86 REF
SEE NOTE 13
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
*
PROPRIETARY NOTE
*
.XX: .01 [.3]
2
.XXX: .005 [.13]
.XXXX: .0020 [.051]
ANGLES
THIS DOCUMENT CONTAINS CONFIDENTIAL AND
PROPRIETARY INFORMATION AND ALL DESIGN,
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
INSULATOR: LCP COLOR: BLACK
CONTACT: PHOS BRONZE .006 THICK
SEAF-RA ASSEMBLY
DWG. NO.
DESCRIPTION:
SEAF-XX-XX-X-XX-X-RA-XX-TR
12/15/2007
SHEET
1
OF
5
BY:
C. PIERCE
F:\DWG\MISC\MKTG\SEAF-XX-XX-X-XX-X-RA-XX-TR-MKT.SLDDRW
REVISION AC
.020 0.51 REF
.008 0.20
REF
WT-XX-XX-T
(SEE TABLE 2, SHEET 1)
.036 0.92 REF
.036±.006 0.91±0.15
C
.050 1.27 (TYP)
.140 3.55 REF
"N" REF
(SEE TABLE 1, SHT 1)
.0185±.0030
[0.470 0.076]
(TYP)
.050 1.27
REF
SECTION "E"-"E"
SCALE 6 : 1
SUB-IM-C-242-XX-X-X
(SEE TABLE 2, SHEET 1)
SEAF-XX-01-RA-XX-XX
(SEE TABLE 2, SHEET 1)
'F'
C
.314 7.99
.050 1.27 (TYP)
.085 2.16
.059
- .005
1.51
- 0.13
+.008
+0.20
C
.172 4.38
.017 0.43 REF
.301 7.65
REF
.312 7.91
REF
"C"
(SEE TABLE 2, SHT 1)
C
DETAIL 'J'
SCALE 8 : 1
.040 1.02 REF
C
L
OF SOLDER
C
.173 4.38 (TYP)
TAILS
"C" REF
.025 0.64 REF (TYP)
SECTION "A"-"A"
SCALE 6 : 1
.039 0.98
REF
C
.006[0.15]
VIEW "G"-"G"
C
.002
+.002
0.051
+0.05
- .003
- 0.08
(SEE NOTE 3)
.009 0.23 REF
C
.140 3.55 (SEE NOTE 9)
THIS DOCUMENT CONTAINS CONFIDENTIAL AND
PROPRIETARY INFORMATION AND ALL DESIGN,
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
*
PROPRIETARY NOTE
*
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
DO NOT SCALE DRAWING
SEAF-RA ASSEMBLY
(SEAF-20-01-X-04-X-RA-GP SHOWN)
(FILL FIRST WAFER TO DIMENSIONS SHOWN)
IN-PROCESS VIEW
SHEET SCALE: 2:1
SEAF-XX-XX-X-XX-X-RA-XX-TR
12/15/2007
SHEET
2
OF
5
BY:
C. PIERCE
F:\DWG\MISC\MKTG\SEAF-XX-XX-X-XX-X-RA-XX-TR-MKT.SLDDRW
REVISION AC
.904 22.95 (.924[23.47] MAX )
(AFTER PROCESSING-SEE NOTE 11)
SEAX-RA-BS-XX-XX
(SEE TABLE 8, SHEET 5)
SUB-IM-C-242-XX-X-X
(SEE TABLE 2, SHEET 1)
C
.904 22.95 (.924[23.47] MAX)
(AFTER PROCESSING-SEE NOTE 11)
SEAX-RA-BS-XX-XX
(SEE TABLE 8, SHEET 5)
SUB-IM-C-242-XX-X-X
(SEE TABLE 2, SHEET 1)
C
SUB-IM-C-242-XX-X-X
(SEE TABLE 2, SHEET 1)
"D"
.592 15.04
REF
.522 13.26 (TYP)
TO WAFER
C
.822 20.88 (TYP)
TO WAFER
C
.822 20.88 (TYP)
C
TO WAFER
SEAF-XX-XX-RA-XX
(SEE TABLE 2, SHEET 1)
SEAF-XX-XX-RA-XX
(SEE TABLE 2, SHEET 1)
"H" REF
(SEE TABLE 3, SHT 1)
"H" REF
(SEE TABLE 3, SHT 1)
SEAF-XX-XX-RA-XX-GP
(SEE TABLE 2, SHEET 1)
"D"
"H" REF
(SEE TABLE 3, SHT 1)
.541 13.74
REF
C
L
(SEAF-20-01-X-04-X-RA SHOWN)
(SAME AS FIG 1 EXCEPT AS NOTED)
(SOME DETAIL REMOVED FOR CLARITY)
FIG 2
(SEAF-20-01-X-10-X-RA SHOWN)
(SAME AS FIG 4 EXCEPT AS NOTED)
(SOME DETAIL REMOVED FOR CLARITY)
FIG 9
.704 17.87 (.724[18.39] MAX)
C
(AFTER PROCESSING-SEE NOTE 11)
SEAX-RA-BS-XX-XX
(SEE TABLE 8, SHEET 5)
SUB-IM-C-242-XX-X-X
(SEE TABLE 2, SHEET 1)
"B"
.100 2.54
(TYP)
.612 15.53
REF
.622 15.80 (TYP)
TO WAFER
.059 1.49
C
C
"B"
SEE NOTE 13
.100 2.54
(TYP)
.412 10.45
REF
SEAF-XX-XX-RA-XX-GP
(SEE TABLE 2, SHEET 1)
"H" REF
(SEE TABLE 3, SHT 1)
(SEAF-20-01-X-10-X-RA-GP)
(SAME AS FIG 1 EXCEPT AS NOTED)
(SOME DETAIL REMOVED FOR CLARITY)
FIG 4
.341 8.66
REF
THIS DOCUMENT CONTAINS CONFIDENTIAL AND
PROPRIETARY INFORMATION AND ALL DESIGN,
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
*
PROPRIETARY NOTE
*
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
(SEAF-20-01-X-06-X-RA-GP)
(SAME AS FIG 1 EXCEPT AS NOTED)
(SOME DETAIL REMOVED FOR CLARITY)
FIG 3
C
.059 1.49
DO NOT SCALE DRAWING
SHEET SCALE: 1:1
SEAF-RA ASSEMBLY
SECTION "B"-"B"
SCALE 2 : 1
SEAF-XX-XX-X-XX-X-RA-XX-TR
12/15/2007
SHEET
3
OF
5
BY:
C. PIERCE
F:\DWG\MISC\MKTG\SEAF-XX-XX-X-XX-X-RA-XX-TR-MKT.SLDDRW
REVISION AC
SEAX-RA-BS-XX-XX
(SEE TABLE 8, SHEET 5)
"C"
SUB-IM-C-242-XX-X-X
(SEE TABLE 2, SHEET 1)
.100 2.54
(TYP)
C
.804 20.41 (.824[20.93] MAX)
(AFTER PROCESSING-SEE NOTE 11)
.722 18.34 (TYP)
C
TO WAFER
.512 12.99
REF
"C"
"H" REF
(SEE TABLE 3, SHT 1)
SEAF-XX-XX-RA-XX-GP
(SEE TABLE 2, SHEET 1)
SECTION "C"-"C"
SCALE 2 : 1
.059 1.49
C
.441 11.20
REF
(SEAF-20-01-X-08-X-RA-GP)
(SAME AS FIG 1 EXCEPT AS NOTED)
(SOME DETAIL REMOVED FOR CLARITY)
FIG 5
.692 17.58
REF
SUB-IM-C-242-XX-X-X
(SEE TABLE 2, SHEET 1)
.622 15.80 (TYP)
C
TO WAFER
WT-44-01-N
SEAF-XX-XX-RA-XX-LP
(SEE TABLE 2, SHEET 1)
"G"
(SEE TABLE 3, SHT 1)
"H" REF
(SEE TABLE 3, SHT 1)
1.123 28.52 REF
.186 4.72
C
"D"
C
(SEE TABLE 1, SHT 1)
.140 3.56
REF
THIS DOCUMENT CONTAINS CONFIDENTIAL AND
PROPRIETARY INFORMATION AND ALL DESIGN,
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
*
PROPRIETARY NOTE
*
C
"J"
(SEE TABLE 3, SHT 1)
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
(SEAF-30-01-X-06-X-RA-LP)
(SOME DETAIL OMITTED FOR CLARITY)
(SAME AS FIG 3 EXCEPT AS SHOWN)
FIG 6
DO NOT SCALE DRAWING
SHEET SCALE: 1:1
SEAF-RA ASSEMBLY
SHEET
4
OF
5
SEAF-XX-XX-X-XX-X-RA-XX-TR
BY:
C. PIERCE
12/15/2007
F:\DWG\MISC\MKTG\SEAF-XX-XX-X-XX-X-RA-XX-TR-MKT.SLDDRW
REVISION AC
SEAF-XX-XX-RA-XX
(SEE TABLE 2, SHEET 1)
"L"
"Q"±.02 [0.5]
C
C
"K" 0.02[0.5]
"P"
DOT APPLICATOR-KAPTON TAPE: USE
-04 ROW: K-DOT-.295-.406-.005
-06 ROW: K-DOT-.295-.406-.005
-08 ROW: K-DOT-.649-.737-.010
-10 ROW: K-DOT-.649-.737-.010
(USE K-DOT-.XXX-.XXX-.XXX)
(SEAF-20-01-X-04-X-RA-GP-K)
FIG 8
-K OPTION
CAT-SEAF-XX-XX-RA PROCESSING FIXTURE-SEE TABLE 9,
FOR SPECIFIC FIXTURE NUMBER.
NOTE:
FIG 10, DIMENSION "R" INDICATES CONNECTOR/FIXTURE HEIGHT ON PCB.
TO GUARANTEE ENOUGH REFLOW OVEN WORKING SPACE, DIMENSION "R",
PCB THICKNESS, AND THE HEIGHT OF THE COMPONENTS ON THE OPPOSITE
SIDE OF THE BOARD NEED TO BE CONSIDERED.
"R"
(BEFORE PROCESSING HEIGHT)
FIG 10
SEAF-RA PROCESSING FIXTURE
(USE CAT-SEAF-XX-XX-RA FIXTURE)
AFTER APPLYING BACKSTRAP -
HEAT STACK IN THIS AREA TO MAKE PERMANENT
(SEE TABLE 8)
THIS DOCUMENT CONTAINS CONFIDENTIAL AND
PROPRIETARY INFORMATION AND ALL DESIGN,
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
*
PROPRIETARY NOTE
*
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
FIG 11
HEAT STAKING BACKSTRAP
SEAF-RA ASSEMBLY
SEAF-XX-XX-X-XX-X-RA-XX-TR
BY:
C. PIERCE
12/15/2007
SHEET
5
OF
5
F:\DWG\MISC\MKTG\SEAF-XX-XX-X-XX-X-RA-XX-TR-MKT.SLDDRW
PCB设计
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
