电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

IDT72V281L10TFG8

产品描述FIFO, 64KX9, 6.5ns, Synchronous, CMOS, PQFP64, SLIM, TQFP-64
产品类别存储   
文件大小273KB,共26页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 选型对比 全文预览

IDT72V281L10TFG8概述

FIFO, 64KX9, 6.5ns, Synchronous, CMOS, PQFP64, SLIM, TQFP-64

IDT72V281L10TFG8规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明LFQFP,
针数64
Reach Compliance Codecompliant
ECCN代码EAR99
Is SamacsysN
最长访问时间6.5 ns
周期时间10 ns
JESD-30 代码S-PQFP-G64
JESD-609代码e3
长度10 mm
内存密度589824 bit
内存宽度9
功能数量1
端子数量64
字数65536 words
字数代码64000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织64KX9
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层MATTE TIN
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度10 mm
Base Number Matches1

文档预览

下载PDF文档
3.3 VOLT CMOS SuperSync FIFO™
65,536 x 9
131,072 x 9
FEATURES:
IDT72V281
IDT72V291
Choose among the following memory organizations:
IDT72V281
65,536 x 9
IDT72V291
131,072 x 9
Pin-compatible with the IDT72V261/72V271 SuperSync FIFOs
10ns read/write cycle time (6.5ns access time)
Fixed, low first word data latency time
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable
settings
Retransmit operation with fixed, low first word data
latency time
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of two preselected offsets
Program partial flags by either serial or parallel means
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
Independent Read and Write clocks (permit reading and writing
simultaneously)
Available in the 64-pin Thin Quad Flat Pack (TQFP) and the 64-pin
Slim Thin Quad Flat Pack (STQFP)
High-performance submicron CMOS technology
Industrial Temperature Range (-40°C to + 85°C) is available
Green parts available, see ordering information
DESCRIPTION:
The IDT72V281/72V291 are exceptionally deep, high speed, CMOS
First-In-First-Out (FIFO) memories with clocked read and write controls.
These FIFOs offer numerous improvements over previous SuperSync
FIFOs, including the following:
The limitation of the frequency of one clock input with respect to the other has
been removed. The Frequency Select pin (FS) has been removed, thus
it is no longer necessary to select which of the two clock inputs, RCLK or
WCLK, is running at the higher frequency.
The period required by the retransmit operation is now fixed and short.
The first word data latency period, from the time the first word is written to an
empty FIFO to the time it can be read, is now fixed and short. (The variable
clock cycle counting delay associated with the latency period found on
previous SuperSync devices has been eliminated on this SuperSync family.)
FUNCTIONAL BLOCK DIAGRAM
WEN
WCLK
D
0
-D
8
LD SEN
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
WRITE CONTROL
LOGIC
RAM ARRAY
65,536 x 9
131,072 x 9
FLAG
LOGIC
WRITE POINTER
READ POINTER
OUTPUT REGISTER
MRS
PRS
READ
CONTROL
LOGIC
RT
RESET
LOGIC
RCLK
REN
OE
Q
0
-Q
8
4513 drw 01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The SuperSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©2009
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
FEBRUARY 2009
DSC-4513/3

IDT72V281L10TFG8相似产品对比

IDT72V281L10TFG8 IDT72V281L15TFGI IDT72V281L15TFGI8 IDT72V281L10TFG
描述 FIFO, 64KX9, 6.5ns, Synchronous, CMOS, PQFP64, SLIM, TQFP-64 FIFO, 64KX9, 10ns, Synchronous, CMOS, PQFP64, SLIM, TQFP-64 FIFO, 64KX9, 10ns, Synchronous, CMOS, PQFP64, SLIM, TQFP-64 FIFO, 64KX9, 6.5ns, Synchronous, CMOS, PQFP64, SLIM, TQFP-64
是否无铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 QFP QFP QFP QFP
包装说明 LFQFP, LFQFP, LFQFP, LFQFP,
针数 64 64 64 64
Reach Compliance Code compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
最长访问时间 6.5 ns 10 ns 10 ns 6.5 ns
周期时间 10 ns 15 ns 15 ns 10 ns
JESD-30 代码 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64
JESD-609代码 e3 e3 e3 e3
长度 10 mm 10 mm 10 mm 10 mm
内存密度 589824 bit 589824 bit 589824 bit 589824 bit
内存宽度 9 9 9 9
功能数量 1 1 1 1
端子数量 64 64 64 64
字数 65536 words 65536 words 65536 words 65536 words
字数代码 64000 64000 64000 64000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 85 °C 85 °C 70 °C
组织 64KX9 64KX9 64KX9 64KX9
可输出 YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFQFP LFQFP LFQFP
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
端子面层 MATTE TIN MATTE TIN MATTE TIN Matte Tin (Sn)
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 30 30 30
宽度 10 mm 10 mm 10 mm 10 mm
Base Number Matches 1 1 1 1
湿度敏感等级 - 3 3 3
ccs3.3中编译老是出现。.const not found
烧写flash时候ccs3.3中编译老是出现。.const not found,不知道是cmd文件中哪里出现了问题...
ranchunlei DSP 与 ARM 处理器
语音模块LD3320资料
语音模块LD3320资料...
梦之蓝930810 PCB设计
LM75使用心得
今天终于把LM75r程序写完了,测试发觉温度不太正常。最后确定原因: (1)一定要有一个稳定的标准电压,如果标称是3V的芯片,一定要提供3V的电源,否则的话,精度很差。 (2)在电源片并接一个104 ......
cscl 测试/测量
简单问题,抢分!!!!!
下面几个问题请高手帮忙解答: 1 设计信号处理器TMS320LF2407的最小系统原理框图,要求完成包括时钟,复位,微处理器监控和CPU的工作方式设置。 2 已知TMS320LF2407为核心的电能质量分析仪的 ......
qing_yx 嵌入式系统
为什么寄存器中P4.4OUT口显示1,而量出来是低电平?
:Cry: 有哪些可能的原因会造成这样的后果...
huang91 微控制器 MCU
很久没来论坛啦,散分!!
没事,散分!!路过接份吧...
jessica820915 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 23  745  169  2391  1315  13  4  27  44  55 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved