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74LVT2244, 74LVTH2244 — Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs and 25
Ω
Series Resistors in the Outputs
February 2008
74LVT2244, 74LVTH2244
Low Voltage Octal Buffer/Line Driver with 3-STATE
Outputs and 25
Ω
Series Resistors in the Outputs
Features
■
Input and output interface capability to systems at
■
■
General Description
The LVT2244 and LVTH2244 are octal buffers and line
drivers designed to be employed as memory address
drivers, clock drivers and bus oriented transmitters or
receivers which provides improved PC board density.
The equivalent 25Ω-Series resistors helps reduce output
overshoot and undershoot.
The LVTH2244 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These octal buffers and line drivers are designed for low-
voltage (3.3V) V
CC
applications, but with the capability to
provide a TTL interface to a 5V environment. The
LVT2244 and LVTH2244 are fabricated with an
advanced BiCMOS technology to achieve high speed
operation similar to 5V ABT while maintaining low power
dissipation.
■
■
■
■
■
5V V
CC
Equivalent 25
Ω
-Series resistors on outputs
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH2244),
also available without bushold feature (74LVT2244)
Live insertion/extraction permitted
Power Up/Down high impedance provides glitch-free
bus loading
Outputs source/sink –12mA/+12mA
Latch-up performance exceeds 500mA
ESD performance:
– Human-body model
>
2000V
– Machine model
>
200V
– Charged-device model
>
1000V
Ordering Information
Order Number
74LVT2244WM
74LVT2244SJ
74LVT2244MTC
74LVTH2244WM
74LVTH2244SJ
74LVTH2244MTC
Package
Number
M20B
M20D
MTC20
M20B
M20D
MTC20
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
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