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74LVT373, 74LVTH373 — Low Voltage Octal Transparent Latch with 3-STATE Outputs
February 2008
74LVT373, 74LVTH373
Low Voltage Octal Transparent Latch with 3-STATE Outputs
Features
■
Input and output interface capability to systems at
■
General Description
The LVT373 and LVTH373 consist of eight latches with
3-STATE outputs for bus organized system applications.
The latches appear transparent to the data when Latch
Enable (LE) is HIGH. When LE is LOW, the data satisfy-
ing the input timing requirements is latched. Data
appears on the bus when the Output Enable (OE) is
LOW. When OE is HIGH, the bus output is in a high
impedance state.
The LVTH373 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These octal latches are designed for low-voltage (3.3V)
V
CC
applications, but with the capability to provide a TTL
interface to a 5V environment. The LVT373 and
LVTH373 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining low power dissipation.
■
■
■
■
■
5V V
CC
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH373),
also available without bushold feature (74LVT373)
Live insertion/extraction permitted
Power Up/Down high impedance provides glitch-free
bus loading
Outputs source/sink –32 mA/+64 mA
Functionally compatible with the 74 series 373
ESD performance:
– Human-body model
>
2000V
– Machine model
>
200V
– Charged-device model
>
1000V
Ordering Information
Order Number
74LVT373WM
74LVT373SJ
74LVT373MTC
74LVTH373WM
74LVTH373SJ
74LVTH373MTC
Package
Number
M20B
M20D
MTC20
M20B
M20D
MTC20
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
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