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74LCXH16245G

产品描述IC TXRX NON-INVERT 3.6V 54FBGA
产品类别逻辑    逻辑   
文件大小216KB,共10页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
标准
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74LCXH16245G概述

IC TXRX NON-INVERT 3.6V 54FBGA

74LCXH16245G规格参数

参数名称属性值
是否Rohs认证符合
厂商名称ON Semiconductor(安森美)
包装说明LFBGA,
Reach Compliance Codecompliant
系列LVC/LCX/Z
JESD-30 代码R-PBGA-B54
长度8 mm
逻辑集成电路类型BUS TRANSCEIVER
位数8
功能数量2
端口数量2
端子数量54
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码LFBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度)NOT SPECIFIED
传播延迟(tpd)5.4 ns
座面最大高度1.4 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度5.5 mm
Base Number Matches1

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Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
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device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated
device numbers. The most current and up-to-date ordering information can be found at
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Please
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ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number
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74LCXH16245G相似产品对比

74LCXH16245G 74LCXH16245MTDX 74LCXH16245GX
描述 IC TXRX NON-INVERT 3.6V 54FBGA Bus Transceivers Transcvr w/Bushold LV 16Bit Bidirect IC TXRX NON-INVERT 3.6V 54FBGA
厂商名称 ON Semiconductor(安森美) ON Semiconductor(安森美) ON Semiconductor(安森美)
包装说明 LFBGA, TSSOP, TSSOP48,.3,20 LFBGA,
Reach Compliance Code compliant compliant compliant
系列 LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 代码 R-PBGA-B54 R-PDSO-G48 R-PBGA-B54
长度 8 mm 12.5 mm 8 mm
逻辑集成电路类型 BUS TRANSCEIVER BUS TRANSCEIVER BUS TRANSCEIVER
位数 8 8 8
功能数量 2 2 2
端口数量 2 2 2
端子数量 54 48 54
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFBGA TSSOP LFBGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, LOW PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
传播延迟(tpd) 5.4 ns 5.4 ns 5.4 ns
座面最大高度 1.4 mm 1.2 mm 1.4 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2 V 2 V 2 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 BALL GULL WING BALL
端子节距 0.8 mm 0.5 mm 0.8 mm
端子位置 BOTTOM DUAL BOTTOM
宽度 5.5 mm 6.1 mm 5.5 mm
Base Number Matches 1 1 1
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED -
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED -
Factory Lead Time - 1 week 1 week
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