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Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
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Please
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74LVT240, 74LVTH240 — Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs
January 2008
74LVT240, 74LVTH240
Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs
Features
■
Input and output interface capability to systems at
■
General Description
The LVT240 and LVTH240 are inverting octal buffers
and line drivers designed to be employed as memory
address drivers, clock drivers and bus oriented transmit-
ters or receivers which provides improved PC board
density.
The LVTH240 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These octal buffers and line drivers are designed for low-
voltage (3.3V) V
CC
applications, but with the capability to
provide a TTL interface to a 5V environment. The LVT240
and LVTH240 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining low power dissipation.
■
■
■
■
■
■
5V V
CC
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH240),
also available without bushold feature (74LVT240)
Live insertion/extraction permitted
Power Up/Down high impedance provides glitch-free
bus loading
Outputs source/sink –32mA/+64mA
Functionally compatible with the 74 series 240
Latch-up performance exceeds 500mA
ESD performance:
– Human-body model
>
2000V
– Machine model
>
200V
– Charged-device model
>
1000V
Ordering Information
Order Number
74LVT240WM
74LVT240SJ
74LVT240MSA
74LVT240MTC
74LVTH240WM
74LVTH240SJ
74LVTH240MSA
74LVTH240MTC
Package
Number
M20B
M20D
MSA20
MTC20
M20B
M20D
MSA20
MTC20
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
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