Datasheet> 器件分类 > 存储> 存储> MX25L6465EM2I-10G

文档预览

MX25L6465EM2I-10G: 产品描述Flash, 16MX4, PDSO8, 0.200 INCH, ROHS COMPLIANT, SOP-8; 产品类别存储存储; 文件大小4MB，共85页; 制造商Macronix; 官网地址http://www.macronix.com/en-us/Pages/default.aspx; 标准

下载文档详细参数选型对比全文预览

MX25L6465EM2I-10G概述

Flash, 16MX4, PDSO8, 0.200 INCH, ROHS COMPLIANT, SOP-8

MX25L6465EM2I-10G规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Macronix
零件包装代码	SOIC
包装说明	SOP, SOP8,.3
针数	8
Reach Compliance Code	unknown
ECCN代码	EAR99
其他特性	ALSO CONFIGURABLE AS 64M X 1
备用内存宽度	2
最大时钟频率 (fCLK)	104 MHz
数据保留时间-最小值	20
耐久性	100000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G8
长度	5.28 mm
内存密度	67108864 bit
内存集成电路类型	FLASH
内存宽度	4
功能数量	1
端子数量	8
字数	16777216 words
字数代码	16000000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	16MX4
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP8,.3
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	3/3.3 V
编程电压	3.3 V
认证状态	Not Qualified
座面最大高度	2.16 mm
串行总线类型	SPI
最大待机电流	0.00002 A
最大压摆率	0.025 mA
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
类型	NOR TYPE
宽度	5.23 mm
写保护	HARDWARE/SOFTWARE

文档预览

下载PDF文档

全文
预览

MX25L6465E

MX25L12865E

MX25L6465E/MX25L12865E

HIGH PERFORMANCE

SERIAL FLASH SPECIFICATION

P/N: PM1557

REV. 1.4, FEB. 10, 2012

MX25L6465E

MX25L12865E

Contents

FEATURES .................................................................................................................................................................. 5

GENERAL DESCRIPTION ......................................................................................................................................... 7

Table 1. Additional Features .............................................................................................................................. 7

PIN CONFIGURATION ................................................................................................................................................ 8

PIN DESCRIPTION ...................................................................................................................................................... 8

BLOCK DIAGRAM....................................................................................................................................................... 9

DATA PROTECTION.................................................................................................................................................. 10

Table 2. Protected Area Sizes .......................................................................................................................... 11

Table 3. 4K-bit Secured OTP Definition

............................................................................................................ 11

Memory Organization ............................................................................................................................................... 12

Table 4-1. Memory Organization for MX25L6465E ......................................................................................... 12

Table 4-2. Memory Organization for MX25L12865E ....................................................................................... 13

DEVICE OPERATION ................................................................................................................................................ 14

Figure 1-1. Serial Modes Supported (for Normal Serial mode) ........................................................................ 14

Figure 1-2. Serial Modes Supported (for Double Transfer Rate serial read mode) .......................................... 14

HOLD FEATURE........................................................................................................................................................ 15

Figure 2. Hold Condition Operation ................................................................................................................. 15

COMMAND DESCRIPTION ....................................................................................................................................... 16

Table 5. Command Sets ................................................................................................................................... 16

(1) Write Enable (WREN) ................................................................................................................................. 18

(2) Write Disable (WRDI).................................................................................................................................. 18

(3) Read Identification (RDID)

.......................................................................................................................... 18

(4) Read Status Register (RDSR) .................................................................................................................... 19

(5) Write Status Register (WRSR).................................................................................................................... 20

Protection Modes ............................................................................................................................................. 20

(6) Read Data Bytes (READ) ........................................................................................................................... 21

(7) Read Data Bytes at Higher Speed (FAST_READ) ..................................................................................... 21

(8) Fast Double Transfer Rate Read (FASTDTRD) .......................................................................................... 21

(9) 2 x I/O Read Mode (2READ) ...................................................................................................................... 21

(10) 2 x I/O Double Transfer Rate Read Mode (2DTRD) ................................................................................. 22

(11) 4 x I/O Read Mode (4READ)..................................................................................................................... 22

(12) 4 x I/O Double Transfer Rate Read Mode (4DTRD) ................................................................................. 23

(13) Sector Erase (SE) ..................................................................................................................................... 23

(14) Block Erase (BE)....................................................................................................................................... 24

(15) Block Erase (BE32K) ................................................................................................................................ 24

(16) Chip Erase (CE) ........................................................................................................................................ 24

(17) Page Program (PP)................................................................................................................................... 25

(18) 4 x I/O Page Program (4PP) ..................................................................................................................... 25

Program/Erase Flow(1) with read array data ................................................................................................... 26

Program/Erase Flow(2) without read array data .............................................................................................. 27

(19) Continuously program mode (CP mode) .................................................................................................. 28

(20) Parallel Mode (Highly recommended for production throughputs increasing) .......................................... 28

(21) Deep Power-down (DP) ............................................................................................................................ 29

(22) Release from Deep Power-down (RDP), Read Electronic Signature (RES) ............................................ 29

(23) Read Electronic Manufacturer ID & Device ID (REMS), (REMS2), (REMS4), (REMS4D) ....................... 29

Table 6. ID Definitions

..................................................................................................................................... 30

P/N: PM1557

REV. 1.4, FEB. 10, 2012

MX25L6465E

MX25L12865E

(24) Enter Secured OTP (ENSO) ..................................................................................................................... 30

(25) Exit Secured OTP (EXSO) ........................................................................................................................ 30

(26) Read Security Register (RDSCUR) .......................................................................................................... 30

Security Register Definition

.............................................................................................................................. 31

(27) Write Security Register (WRSCUR).......................................................................................................... 31

(28) Write Protection Selection (WPSEL)......................................................................................................... 32

BP and SRWD if WPSEL=0 ............................................................................................................................. 32

The individual block lock mode is effective after setting WPSEL=1 ................................................................. 33

WPSEL Flow .................................................................................................................................................... 34

(29) Single Block Lock/Unlock Protection (SBLK/SBULK) ............................................................................... 35

Block Lock Flow ............................................................................................................................................... 35

Block Unlock Flow ............................................................................................................................................ 36

(30) Read Block Lock Status (RDBLOCK) ....................................................................................................... 37

(31) Gang Block Lock/Unlock (GBLK/GBULK)................................................................................................. 37

(32) Clear SR Fail Flags (CLSR) ...................................................................................................................... 37

(33) Enable SO to Output RY/BY# (ESRY) ...................................................................................................... 37

(34) Disable SO to Output RY/BY# (DSRY) ..................................................................................................... 37

(35) Read SFDP Mode (RDSFDP)................................................................................................................... 38

Read Serial Flash Discoverable Parameter (RDSFDP) Sequence .................................................................. 38

Table a-1. Signature and Parameter Identification Data Values for MX25L6465E

........................................... 39

Table b-1. Parameter Table (0): JEDEC Flash Parameter Tables for MX25L6465E ........................................ 40

Table c-1. Parameter Table (1): Macronix Flash Parameter Tables for MX25L6465E ..................................... 42

Table a-2. Signature and Parameter Identification Data Values for MX25L12865E

......................................... 43

Table b-2. Parameter Table (0): JEDEC Flash Parameter Tables for MX25L12865E ...................................... 44

Table c-2. Parameter Table (1): Macronix Flash Parameter Tables for MX25L12865E ................................... 46

POWER-ON STATE ................................................................................................................................................... 48

ELECTRICAL SPECIFICATIONS .............................................................................................................................. 49

ABSOLUTE MAXIMUM RATINGS ................................................................................................................... 49

Figure 3. Maximum Negative Overshoot Waveform ........................................................................................ 49

CAPACITANCE TA = 25°C, f = 1.0 MHz........................................................................................................... 49

Figure 4. Maximum Positive Overshoot Waveform .......................................................................................... 49

Figure 5. OUTPUT LOADING ......................................................................................................................... 50

Table 7-1. MX25L6465E DC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC =

2.7V ~ 3.6V) .................................................................................................................................................... 51

Table 7-2. MX25L12865E DC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC =

2.7V ~ 3.6V) .................................................................................................................................................... 52

Table 8-1. MX25L6465E AC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC =

2.7V ~ 3.6V) .................................................................................................................................................... 53

Table 8-2. MX25L12865E AC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC

= 2.7V ~ 3.6V) ................................................................................................................................................. 55

Timing Analysis ........................................................................................................................................................ 57

Figure 6. Serial Input Timing ............................................................................................................................ 57

Figure 7. Output Timing .................................................................................................................................... 57

Figure 8. Serial Input Timing for Double Transfer Rate Mode .......................................................................... 58

Figure 9. Serial Output Timing for Double Transfer Rate Mode ....................................................................... 58

Figure 10. Hold Timing ..................................................................................................................................... 59

Figure 11. WP# Disable Setup Timing and Hold Timing during WRSR when SRWD=1 .................................. 59

Figure 12. Write Enable (WREN) Sequence (Command 06) ........................................................................... 60

Figure 13. Write Disable (WRDI) Sequence (Command 04)............................................................................ 60

Figure 14. Read Identification (RDID) Sequence (Command 9F)

.................................................................... 60

P/N: PM1557

REV. 1.4, FEB. 10, 2012

MX25L6465E

MX25L12865E

Figure 15. Read Status Register (RDSR) Sequence (Command 05) .............................................................. 61

Figure 16. Write Status Register (WRSR) Sequence (Command 01)............................................................. 61

Figure 17. Read Data Bytes (READ) Sequence (Command 03) .................................................................... 62

Figure 18. Read at Higher Speed (FAST_READ) Sequence (Command 0B) ................................................ 62

Figure 19. Fast DT Read (FASTDTRD) Sequence (Command 0D)................................................................. 62

Figure 20. 2 x I/O Read Mode Sequence (Command BB) ............................................................................... 63

Figure 21. Fast Dual I/O DT Read (2DTRD) Sequence (Command BD) ......................................................... 63

Figure 22. 4 x I/O Read Mode Sequence (Command EB) ............................................................................... 64

Figure 23. 4 x I/O Read Enhance Performance Mode Sequence (Command EB) .......................................... 64

Figure 24. Fast Quad I/O DT Read (4DTRD) Sequence (Command ED)........................................................ 65

Figure 25. Fast Quad I/O DT Read (4DTRD) Enhance Performance Sequence (Command ED) ................... 65

Figure 26. Sector Erase (SE) Sequence (Command 20) ................................................................................ 66

Figure 27. Block Erase (BE/EB32K) Sequence (Command D8/52) ................................................................ 66

Figure 28. Chip Erase (CE) Sequence (Command 60 or C7) ......................................................................... 66

Figure 29. Page Program (PP) Sequence (Command 02).............................................................................. 67

Figure 30. 4 x I/O Page Program (4PP) Sequence (Command 38) ................................................................ 67

Figure 31. Continously Program (CP) Mode Sequence with Hardware Detection (Command AD) ................. 68

Figure 32-1. Enter Parallel Mode (ENPLM) Sequence (Command 55) .......................................................... 69

Figure 32-2. Exit Parallel Mode (EXPLM) Sequence (Command 45) ............................................................. 69

Figure 32-3. Parallel Mode Read Identification (Parallel RDID) Sequence (Command 9F)

........................... 69

Figure 32-4. Parallel Mode Read Electronic Manufacturer & Device ID (Parallel REMS) Sequence (Command

90) .................................................................................................................................................................... 70

Figure 32-5. Parallel Mode Release from Deep Power-down (RDP) and Read Electronic Signature (RES)

Sequence ......................................................................................................................................................... 70

Figure 32-6. Parallel Mode Read Array (Parallel READ) Sequence (Command 03) ...................................... 71

Figure 32-7. Parallel Mode Page Program (Parallel PP) Sequence (Command 02) ...................................... 71

Figure 33. Deep Power-down (DP) Sequence (Command B9)....................................................................... 71

Figure 34. Read Electronic Signature (RES) Sequence (Command AB) ........................................................ 72

Figure 35. Release from Deep Power-down (RDP) Sequence (Command AB) ............................................. 72

Figure 36. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90 or EF or DF or CF) ..

......................................................................................................................................................................... 73

Figure 37. Write Protection Selection (WPSEL) Sequence (Command 68).................................................... 73

Figure 38. Single Block Lock/Unlock Protection (SBLK/SBULK) Sequence (Command 36/39) ..................... 74

Figure 39. Read Block Protection Lock Status (RDBLOCK) Sequence (Command 3C) ................................ 74

Figure 40. Gang Block Lock/Unlock (GBLK/GBULK) Sequence (Command 7E/98) ...................................... 74

Figure 41. Power-up Timing ............................................................................................................................. 75

Table 9. Power-Up Timing ............................................................................................................................... 75

INITIAL DELIVERY STATE............................................................................................................................... 75

OPERATING CONDITIONS ....................................................................................................................................... 76

Figure 42. AC Timing at Device Power-Up ....................................................................................................... 76

Figure 43. Power-Down Sequence .................................................................................................................. 77

ERASE AND PROGRAMMING PERFORMANCE .................................................................................................... 78

DATA RETENTION .................................................................................................................................................... 78

LATCH-UP CHARACTERISTICS .............................................................................................................................. 78

ORDERING INFORMATION ...................................................................................................................................... 79

PART NAME DESCRIPTION ..................................................................................................................................... 80

PACKAGE INFORMATION ........................................................................................................................................ 81

REVISION HISTORY ................................................................................................................................................. 84

P/N: PM1557

REV. 1.4, FEB. 10, 2012

MX25L6465EM2I-10G相似产品对比

	MX25L6465EM2I-10G	MX25L6465EZNI-10G	MX25L12865EMI-10G	MX25L6465EMI-10G	MX25L12865EZNI-10G
描述	Flash, 16MX4, PDSO8, 0.200 INCH, ROHS COMPLIANT, SOP-8	Flash, 16MX4, PDSO8, 8 X 6 MM, 0.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, MO-220, WSON-8	IC FLASH 128MBIT	IC FLASH 64MBIT	IC FLASH 128MBIT
是否Rohs认证	符合	符合	符合	符合	符合
零件包装代码	SOIC	QFN	SOIC	SOIC	QFN
包装说明	SOP, SOP8,.3	VSON, SOLCC8,.25	SOP, SOP16,.4	SOP, SOP16,.4	8 X 6 MM, 0.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, MO-220, WSON-8
针数	8	8	16	16	8
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
其他特性	ALSO CONFIGURABLE AS 64M X 1	ALSO CONFIGURABLE AS 64M X 1	ALSO CONFIGURABLE AS 128M X 1	ALSO CONFIGURABLE AS 64M X 1	ALSO CONFIGURABLE AS 128M X 1
备用内存宽度	2	2	2	2	2
最大时钟频率 (fCLK)	104 MHz	104 MHz	104 MHz	104 MHz	104 MHz
数据保留时间-最小值	20	20	20	20	20
耐久性	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G8	R-PDSO-N8	R-PDSO-G16	R-PDSO-G16	R-PDSO-N8
长度	5.28 mm	8 mm	10.3 mm	10.3 mm	8 mm
内存密度	67108864 bit	67108864 bit	134217728 bit	67108864 bit	134217728 bit
内存集成电路类型	FLASH	FLASH	FLASH	FLASH	FLASH
内存宽度	4	4	4	4	4
功能数量	1	1	1	1	1
端子数量	8	8	16	16	8
字数	16777216 words	16777216 words	33554432 words	16777216 words	33554432 words
字数代码	16000000	16000000	32000000	16000000	32000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	16MX4	16MX4	32MX4	16MX4	32MX4
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	VSON	SOP	SOP	VSON
封装等效代码	SOP8,.3	SOLCC8,.25	SOP16,.4	SOP16,.4	SOLCC8,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
编程电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.16 mm	0.8 mm	2.65 mm	2.65 mm	0.8 mm
串行总线类型	SPI	SPI	SPI	SPI	SPI
最大待机电流	0.00002 A	0.00002 A	0.00004 A	0.00002 A	0.00004 A
最大压摆率	0.025 mA	0.025 mA	0.025 mA	0.025 mA	0.025 mA
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
标称供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	GULL WING	NO LEAD	GULL WING	GULL WING	NO LEAD
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
类型	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
宽度	5.23 mm	6 mm	7.52 mm	7.52 mm	6 mm
写保护	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE
厂商名称	Macronix	Macronix	Macronix	Macronix	-
Base Number Matches	-	1	1	1	1

MX25L6465EM2I-10G

MX25L6465EM2I-10G概述

MX25L6465EM2I-10G规格参数

文档预览

MX25L6465EM2I-10G相似产品对比

推荐资源