3-BIT SCANNABLE REGISTER
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Microchip(微芯科技) |
| 包装说明 | PLASTIC, LCC-28 |
| Reach Compliance Code | _compli |
| 其他特性 | DIAGNOSTIC SCAN REGISTER WITH SELECTABLE SERIAL AND PARALLEL DATA INPUT |
| 系列 | 100E |
| JESD-30 代码 | S-PQCC-J28 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 位数 | 3 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 输出特性 | OPEN-EMITTER |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC28,.5SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | -4.5 V |
| 最大电源电流(ICC) | 110 mA |
| 传播延迟(tpd) | 1.025 ns |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | ECL |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 触发器类型 | POSITIVE EDGE |

| SY100E212JC | SY10E212JCTR | SY10E212JC | SY10E212 | SY100E212JCTR | |
|---|---|---|---|---|---|
| 描述 | 3-BIT SCANNABLE REGISTER | 3-BIT SCANNABLE REGISTER | 3-BIT SCANNABLE REGISTER | 3-BIT SCANNABLE REGISTER | 3-BIT SCANNABLE REGISTER |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | - | Microchip(微芯科技) |
| 包装说明 | PLASTIC, LCC-28 | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | - | PLASTIC, LCC-28 |
| Reach Compliance Code | _compli | compli | compli | - | _compli |
| 其他特性 | DIAGNOSTIC SCAN REGISTER WITH SELECTABLE SERIAL AND PARALLEL DATA INPUT | DIAGNOSTIC SCAN REGISTER WITH SELECTABLE SERIAL AND PARALLEL DATA INPUT | DIAGNOSTIC SCAN REGISTER WITH SELECTABLE SERIAL AND PARALLEL DATA INPUT | - | DIAGNOSTIC SCAN REGISTER WITH SELECTABLE SERIAL AND PARALLEL DATA INPUT |
| 系列 | 100E | 10E | 10E | - | 100E |
| JESD-30 代码 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 | - | S-PQCC-J28 |
| JESD-609代码 | e0 | e0 | e0 | - | e0 |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | - | D FLIP-FLOP |
| 位数 | 3 | 3 | 3 | - | 3 |
| 功能数量 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 28 | 28 | 28 | - | 28 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C |
| 输出特性 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | - | OPEN-EMITTER |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | QCCJ | - | QCCJ |
| 封装等效代码 | LDCC28,.5SQ | LDCC28,.5SQ | LDCC28,.5SQ | - | LDCC28,.5SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | - | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | - | CHIP CARRIER |
| 电源 | -4.5 V | -5.2 V | -5.2 V | - | -4.5 V |
| 传播延迟(tpd) | 1.025 ns | 1.025 ns | 1.025 ns | - | 1.025 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 表面贴装 | YES | YES | YES | - | YES |
| 技术 | ECL | ECL | ECL | - | ECL |
| 温度等级 | OTHER | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | - | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn85Pb15) |
| 端子形式 | J BEND | J BEND | J BEND | - | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | - | QUAD |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | - | POSITIVE EDGE |
| 长度 | - | 11.48 mm | 11.48 mm | - | 11.48 mm |
| 湿度敏感等级 | - | 1 | 1 | - | 1 |
| 峰值回流温度(摄氏度) | - | 240 | 240 | - | 240 |
| 座面最大高度 | - | 4.57 mm | 4.57 mm | - | 4.57 mm |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | - | 30 |
| 宽度 | - | 11.48 mm | 11.48 mm | - | 11.48 mm |
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