10E SERIES, 4-INPUT OR/NOR GATE, PDSO8
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Microchip(微芯科技) |
零件包装代码 | MSOP |
包装说明 | TSSOP, TSSOP8,.19 |
针数 | 8 |
Reach Compliance Code | _compli |
其他特性 | ALSO OPERATES WITH VEE = -3.0V TO -5.5V WITH VCC = 0V |
系列 | 10E |
JESD-30 代码 | S-PDSO-G8 |
JESD-609代码 | e0 |
长度 | 3 mm |
逻辑集成电路类型 | OR/NOR GATE |
湿度敏感等级 | 1 |
功能数量 | 1 |
输入次数 | 4 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP8,.19 |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
包装方法 | TAPE AND REEL |
峰值回流温度(摄氏度) | 240 |
电源 | +-3.3/+-5 V |
最大电源电流(ICC) | 31 mA |
Prop。Delay @ Nom-Su | 0.3 ns |
传播延迟(tpd) | 0.25 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
座面最大高度 | 1.1 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | ECL |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 3 mm |
SY10EP01VKITR | SY10EP01V_05 | SY10EP01VZITR | SY10EP01VZI | SY10EP01VZGTR | SY10EP01VKI | SY10EP01VKGTR | |
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描述 | 10E SERIES, 4-INPUT OR/NOR GATE, PDSO8 | 10E SERIES, 4-INPUT OR/NOR GATE, PDSO8 | 10E SERIES, 4-INPUT OR/NOR GATE, PDSO8 | 10E SERIES, 4-INPUT OR/NOR GATE, PDSO8 | 10E SERIES, 4-INPUT OR/NOR GATE, PDSO8 | 10E SERIES, 4-INPUT OR/NOR GATE, PDSO8 | 10E SERIES, 4-INPUT OR/NOR GATE, PDSO8 |
系列 | 10E | 10E | 10E | 10E | 10E | 10E | 10E |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 符合 | 不符合 | 符合 |
厂商名称 | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
零件包装代码 | MSOP | - | SOIC | SOIC | SOIC | MSOP | MSOP |
包装说明 | TSSOP, TSSOP8,.19 | - | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | SOP, | TSSOP, TSSOP8,.19 | TSSOP, |
针数 | 8 | - | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | _compli | - | _compli | _compli | compli | _compli | compli |
其他特性 | ALSO OPERATES WITH VEE = -3.0V TO -5.5V WITH VCC = 0V | - | ALSO OPERATES WITH VEE = -3.0V TO -5.5V WITH VCC = 0V | ALSO OPERATES WITH VEE = -3.0V TO -5.5V WITH VCC = 0V | - | ALSO OPERATES WITH VEE = -3.0V TO -5.5V WITH VCC = 0V | - |
JESD-30 代码 | S-PDSO-G8 | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 |
JESD-609代码 | e0 | - | e0 | e0 | e4 | e0 | e4 |
长度 | 3 mm | - | 4.93 mm | 4.93 mm | 4.93 mm | 3 mm | 3 mm |
逻辑集成电路类型 | OR/NOR GATE | - | OR/NOR GATE | OR/NOR GATE | OR/NOR GATE | OR/NOR GATE | OR/NOR GATE |
湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 |
输入次数 | 4 | - | 4 | 4 | 4 | 4 | 4 |
最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | - | SOP | SOP | SOP | TSSOP | TSSOP |
封装等效代码 | TSSOP8,.19 | - | SOP8,.25 | SOP8,.25 | - | TSSOP8,.19 | - |
封装形状 | SQUARE | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 240 | - | 240 | 240 | 260 | 240 | 260 |
电源 | +-3.3/+-5 V | - | +-3.3/+-5 V | +-3.3/+-5 V | - | +-3.3/+-5 V | - |
最大电源电流(ICC) | 31 mA | - | 31 mA | 31 mA | - | 31 mA | - |
Prop。Delay @ Nom-Su | 0.3 ns | - | 0.3 ns | 0.3 ns | - | 0.3 ns | - |
传播延迟(tpd) | 0.25 ns | - | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
施密特触发器 | NO | - | NO | NO | - | NO | - |
座面最大高度 | 1.1 mm | - | 1.73 mm | 1.73 mm | 1.73 mm | 1.1 mm | 1.1 mm |
最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
技术 | ECL | - | ECL | ECL | ECL | ECL | ECL |
端子面层 | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn85Pb15) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子节距 | 0.65 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm |
处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | 40 | 30 | 40 |
宽度 | 3 mm | - | 3.94 mm | 3.94 mm | 3.94 mm | 3 mm | 3 mm |
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