58026 SERIES, DUAL 2 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, QCC32
58026 系列, 双 2 线 TO 1 线 多路复用器, 互补输出, QCC32
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | DFN |
| 包装说明 | HVQCCN, LCC32,.2SQ,20 |
| 针数 | 32 |
| 制造商包装代码 | MLF |
| Reach Compliance Code | compli |
| 其他特性 | SEATED HT-CALCULATED; ALSO OPERATES AT 3.3V SUPPLY |
| 系列 | 58026 |
| JESD-30 代码 | S-XQCC-N32 |
| JESD-609代码 | e4 |
| 长度 | 5 mm |
| 逻辑集成电路类型 | MULTIPLEXER |
| 湿度敏感等级 | 2 |
| 功能数量 | 2 |
| 输入次数 | 2 |
| 输出次数 | 1 |
| 端子数量 | 32 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC32,.2SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 包装方法 | TR |
| 峰值回流温度（摄氏度） | 260 |
| 最大电源电流（ICC） | 130 mA |
| 传播延迟（tpd） | 0.31 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.9 mm |
| 最大供电电压 (Vsup) | 2.625 V |
| 最小供电电压 (Vsup) | 2.375 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 5 mm |
| SY58026UMGTR | SY58026U | SY58026UMI | SY58026UMITR | SY58026UMI-TR | |
|---|---|---|---|---|---|
| 描述 | 58026 SERIES, DUAL 2 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, QCC32 | 58026 SERIES, DUAL 2 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, QCC32 | 58026 SERIES, DUAL 2 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, QCC32 | 58026 SERIES, DUAL 2 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, QCC32 | IC MUX 10.7GBPS DUAL 2:1 32-MLF |
| 厂商名称 | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | - |
| 零件包装代码 | DFN | - | DFN | DFN | - |
| 包装说明 | HVQCCN, LCC32,.2SQ,20 | - | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 | - |
| 针数 | 32 | - | 32 | 32 | - |
| 制造商包装代码 | MLF | - | MLF | MLF | - |
| Reach Compliance Code | compli | - | compli | compli | - |
| 其他特性 | SEATED HT-CALCULATED; ALSO OPERATES AT 3.3V SUPPLY | - | SEATED HT-CALCULATED; ALSO OPERATES AT 3.3V SUPPLY | SEATED HT-CALCULATED; ALSO OPERATES AT 3.3V SUPPLY | - |
| 系列 | 58026 | 58026 | 58026 | 58026 | - |
| JESD-30 代码 | S-XQCC-N32 | - | S-XQCC-N32 | S-XQCC-N32 | - |
| 长度 | 5 mm | - | 5 mm | 5 mm | - |
| 逻辑集成电路类型 | MULTIPLEXER | - | MULTIPLEXER | MULTIPLEXER | - |
| 功能数量 | 2 | 2 | 2 | 2 | - |
| 输入次数 | 2 | - | 2 | 2 | - |
| 输出次数 | 1 | - | 1 | 1 | - |
| 端子数量 | 32 | 32 | 32 | 32 | - |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | - |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - |
| 封装主体材料 | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | - |
| 封装代码 | HVQCCN | - | HVQCCN | HVQCCN | - |
| 封装等效代码 | LCC32,.2SQ,20 | - | LCC32,.2SQ,20 | LCC32,.2SQ,20 | - |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | - |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - |
| 最大电源电流（ICC） | 130 mA | - | 130 mA | 130 mA | - |
| 传播延迟（tpd） | 0.31 ns | - | 0.31 ns | 0.31 ns | - |
| 座面最大高度 | 0.9 mm | - | 0.9 mm | 0.9 mm | - |
| 最大供电电压 (Vsup) | 2.625 V | - | 2.625 V | 2.625 V | - |
| 最小供电电压 (Vsup) | 2.375 V | - | 2.375 V | 2.375 V | - |
| 标称供电电压 (Vsup) | 2.5 V | - | 2.5 V | 2.5 V | - |
| 表面贴装 | YES | Yes | YES | YES | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | - |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | - |
| 宽度 | 5 mm | - | 5 mm | 5 mm | - |
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