3.3V/5V 1GHz DIFFERENTIAL PECL/ECL RECEIVER/BUFFER
| 参数名称 | 属性值 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | DFN |
| 包装说明 | HVSON, SOLCC8,.08,20 |
| 针数 | 8 |
| 制造商包装代码 | MLF |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 其他特性 | SEATED HT-CALCULATED; ALSO OPERATES IN VCC 5V NOMINAL |
| 差分输出 | YES |
| 输入特性 | DIFFERENTIAL |
| 接口集成电路类型 | LINE RECEIVER |
| JESD-30 代码 | S-XDSO-N8 |
| 长度 | 2 mm |
| 标称负供电电压 | -3.3 V |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 最小输出摆幅 | 0.515 V |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC8,.08,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 最大接收延迟 | 375 ns |
| 接收器位数 | 1 |
| 座面最大高度 | 0.9254 mm |
| 最大压摆率 | 22 mA |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 宽度 | 2 mm |
| SY89216VMITR | SY89216V | SY89206V | SY89216VMGTR | SY89206VMGTR | SY89206VMITR | |
|---|---|---|---|---|---|---|
| 描述 | 3.3V/5V 1GHz DIFFERENTIAL PECL/ECL RECEIVER/BUFFER | 3.3V/5V 1GHz DIFFERENTIAL PECL/ECL RECEIVER/BUFFER | 3.3V/5V 1GHz DIFFERENTIAL PECL/ECL RECEIVER/BUFFER | 3.3V/5V 1GHz DIFFERENTIAL PECL/ECL RECEIVER/BUFFER | 3.3V/5V 1GHz DIFFERENTIAL PECL/ECL RECEIVER/BUFFER | 3.3V/5V 1GHz DIFFERENTIAL PECL/ECL RECEIVER/BUFFER |
| 厂商名称 | Microchip(微芯科技) | - | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 零件包装代码 | DFN | - | - | DFN | DFN | DFN |
| 包装说明 | HVSON, SOLCC8,.08,20 | - | - | HVSON, SOLCC8,.08,20 | HVSON, | HVSON, SOLCC8,.08,20 |
| 针数 | 8 | - | - | 8 | 8 | 8 |
| 制造商包装代码 | MLF | - | - | MLF | MLF | MLF |
| Reach Compliance Code | compli | - | - | compli | compli | compli |
| ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 |
| 输入特性 | DIFFERENTIAL | - | - | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL |
| 接口集成电路类型 | LINE RECEIVER | - | - | LINE RECEIVER | LINE RECEIVER | LINE RECEIVER |
| JESD-30 代码 | S-XDSO-N8 | - | - | S-XDSO-N8 | S-XDSO-N8 | S-XDSO-N8 |
| 长度 | 2 mm | - | - | 2 mm | 2 mm | 2 mm |
| 功能数量 | 1 | - | - | 1 | 1 | 1 |
| 端子数量 | 8 | - | - | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | - | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | - | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVSON | - | - | HVSON | HVSON | HVSON |
| 封装形状 | SQUARE | - | - | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 最大接收延迟 | 375 ns | - | - | 375 ns | 425 ns | 375 ns |
| 接收器位数 | 1 | - | - | 1 | 1 | 1 |
| 座面最大高度 | 0.9254 mm | - | - | 0.9254 mm | 0.9754 mm | 0.9254 mm |
| 最大供电电压 | 3.6 V | - | - | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 3 V | - | - | 3 V | 3 V | 3 V |
| 标称供电电压 | 3.3 V | - | - | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | - | - | YES | YES | YES |
| 温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | - | - | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | - | - | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | - | - | DUAL | DUAL | DUAL |
| 宽度 | 2 mm | - | - | 2 mm | 2 mm | 2 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
