89872 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16
89872 系列, 低偏移时钟驱动器, 1 实输出(S), 0 反向输出(S), QCC16
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | DFN |
| 包装说明 | HVQCCN, |
| 针数 | 16 |
| 制造商包装代码 | MLF |
| Reach Compliance Code | compli |
| 其他特性 | IT ALSO HAS CLOCK OUTPUTS QA AND QA BAR WITH DIFFERENTIAL MUX INPUT CONDITIONING |
| 系列 | 89872 |
| 输入调节 | DIFFERENTIAL |
| JESD-30 代码 | S-XQCC-N16 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 逻辑集成电路类型 | LOW SKEW CLOCK DRIVER |
| 湿度敏感等级 | 2 |
| 功能数量 | 1 |
| 反相输出次数 | |
| 端子数量 | 16 |
| 实输出次数 | 4 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 0.75 ns |
| 认证状态 | Not Qualified |
| Same Edge Skew-Max（tskwd） | 0.03 ns |
| 座面最大高度 | 0.95 mm |
| 最大供电电压 (Vsup) | 2.625 V |
| 最小供电电压 (Vsup) | 2.375 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3 mm |
| 最小 fmax | 2000 MHz |
| SY89872UMGTR | SY89872UMITR | SY89872U | SY89872UMI | SY89872UMI-TR | |
|---|---|---|---|---|---|
| 描述 | 89872 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16 | 89872 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16 | 89872 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16 | 89872 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16 | IC CLK BUFFER 1:3 2GHZ 16MLF |
| 是否Rohs认证 | 符合 | 不符合 | - | 不符合 | - |
| 零件包装代码 | DFN | DFN | - | DFN | - |
| 包装说明 | HVQCCN, | HVQCCN, LCC16,.12SQ,20 | - | HVQCCN, LCC16,.12SQ,20 | - |
| 针数 | 16 | 16 | - | 16 | - |
| 制造商包装代码 | MLF | MLF | - | MLF | - |
| Reach Compliance Code | compli | _compli | - | _compli | - |
| 其他特性 | IT ALSO HAS CLOCK OUTPUTS QA AND QA BAR WITH DIFFERENTIAL MUX INPUT CONDITIONING | CAN ALSO OPERATE WITH 3.3V SUPPLY | - | CAN ALSO OPERATE WITH 3.3V SUPPLY | - |
| 系列 | 89872 | 89872 | 89872 | 89872 | - |
| 输入调节 | DIFFERENTIAL | DIFFERENTIAL | - | DIFFERENTIAL | - |
| JESD-30 代码 | S-XQCC-N16 | S-XQCC-N16 | - | S-XQCC-N16 | - |
| JESD-609代码 | e4 | e0 | - | e0 | - |
| 长度 | 3 mm | 3 mm | - | 3 mm | - |
| 逻辑集成电路类型 | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | - | LOW SKEW CLOCK DRIVER | - |
| 湿度敏感等级 | 2 | 2 | - | 2 | - |
| 功能数量 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 16 | 16 | 16 | 16 | - |
| 实输出次数 | 4 | 1 | - | 1 | - |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | - |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | - |
| 封装代码 | HVQCCN | HVQCCN | - | HVQCCN | - |
| 封装形状 | SQUARE | SQUARE | - | SQUARE | - |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - |
| 峰值回流温度（摄氏度） | 260 | 240 | - | 240 | - |
| 传播延迟（tpd） | 0.75 ns | 0.75 ns | - | 0.75 ns | - |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | - |
| Same Edge Skew-Max（tskwd） | 0.03 ns | 0.015 ns | - | 0.015 ns | - |
| 座面最大高度 | 0.95 mm | 0.95 mm | - | 0.95 mm | - |
| 最大供电电压 (Vsup) | 2.625 V | 2.625 V | - | 2.625 V | - |
| 最小供电电压 (Vsup) | 2.375 V | 2.375 V | - | 2.375 V | - |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | - | 2.5 V | - |
| 表面贴装 | YES | YES | Yes | YES | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | - |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - |
| 端子节距 | 0.5 mm | 0.5 mm | - | 0.5 mm | - |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | - |
| 处于峰值回流温度下的最长时间 | 40 | 30 | - | 30 | - |
| 宽度 | 3 mm | 3 mm | - | 3 mm | - |
| 最小 fmax | 2000 MHz | 2000 MHz | - | 2000 MHz | - |
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