IDH09SG60C
3 Generation thinQ!
Features
rd
TM
SiC Schottky Diode
Product Summary
V
DC
Q
C
I
F
;
T
C
<
130 °C
600
15
9
V
nC
A
• Revolutionary semiconductor material - Silicon Carbide
• Switching behavior benchmark
• No reverse recovery / No forward recovery
• Temperature independent switching behavior
• High surge current capability
• Pb-free lead plating; RoHS compliant
• Qualified according to JEDEC
1)
for target applications
• Breakdown voltage tested at 20mA
2)
• Optimized for high temperature operation
• Lowest Figure of Merit Q
C
/I
F
thinQ! 3G Diode designed for fast switching applications like:
• SMPS e.g.; CCM PFC
• Motor Drives; Solar Applications; UPS
Type
IDH09SG60C
Package
PG-TO220-2
Marking
D09G60C
Pin 1
C
Pin 2
A
Maximum ratings
Parameter
Continuous forward current
Symbol Conditions
I
F
T
C
<130 °C
T
C
=25 °C,
t
p
=10 ms
T
C
=150 °C,
t
p
=10 ms
T
C
=25 °C,
t
p
=10 µs
T
C
=25 °C,
t
p
=10 ms
T
C
=150 °C,
t
p
=10 ms
Repetitive peak reverse voltage
Diode dv/dt ruggedness
Power dissipation
Operating and storage temperature
Soldering temperature,
wavesoldering only allowed at leads
Mounting torque
V
RRM
dv/ dt
P
tot
T
j
,
T
stg
T
sold
1.6mm (0.063 in.)
from case for 10s
M3 and M3.5 screws
T
j
=25 °C
V
R
= 0….480 V
T
C
=25 °C
Value
9
49
42
400
12
9
600
50
115
-55 ... 175
260
60
Ncm
V
V/ns
W
°C
A
2
s
Unit
A
Surge non-repetitive forward current,
I
F,SM
sine halfwave
Non-repetitive peak forward current
i
²t value
I
F,max
∫i
2
dt
Rev. 2.3
page 1
2013-02-11
IDH09SG60C
Parameter
Symbol Conditions
min.
Thermal characteristics
Thermal resistance, junction - case
Thermal resistance,
junction - ambient
R
thJC
R
thJA
Thermal resistance,
junction- ambient,
leaded
-
-
-
-
1.3
62
K/W
Values
typ.
max.
Unit
Electrical characteristics,
at
T
j
=25 °C, unless otherwise specified
Static characteristics
DC blocking voltage
Diode forward voltage
V
DC
V
F
I
R
=0.05 mA,
T
j
=25 °C
I
F
=9 A,
T
j
=25 °C
I
F
=9 A,
T
j
=150 °C
Reverse current
I
R
V
R
=600 V,
T
j
=25 °C
V
R
=600 V,
T
j
=150 °C
AC characteristics
Total capacitive charge
Switching time
3)
Total capacitance
Q
c
t
c
C
V
R
=400 V,I
F
≤I
F,max
,
di
F
/dt =200 A/µs,
T
j
=150 °C
V
R
=1 V,
f
=1 MHz
V
R
=300 V,
f
=1 MHz
V
R
=600 V,
f
=1 MHz
-
-
-
-
-
15
-
280
35
35
-
<10
-
-
-
nC
ns
pF
600
-
-
-
-
-
1.8
2.2
0.7
3
-
2.1
-
80
800
µA
V
1)
2)
3)
J-STD20 and JESD22
All devices tested under avalanche conditions, for a time periode of 10ms, at 20mA.
t
c
is the time constant for the capacitive displacement current waveform (independent from T
j
, I
LOAD
and
di/dt), different from t
rr
which is dependent on T
j
, I
LOAD
and di/dt. No reverse recovery time constant t
rr
due
to absence of minority carrier injection.
4)
5)
Under worst case Z
th
conditions.
Only capacitive charge occuring, guaranteed by design.
Rev. 2.3
page 2
2013-02-11
IDH09SG60C
5 Typ. capacitance charge vs. current slope
Q
C
=f(di
F
/dt )
5)
;
I
F
≤I
F,max
6 Typ. reverse current vs. reverse voltage
I
R
=f(V
R
); parameter:
T
j
16
10
1
14
12
10
0
10
Q
c
[nC]
I
R
[µA]
8
10
-1
175°C
6
150°C
4
10
-2
100°C
25°C
2
10
-3
100
400
700
1000
100
-55°C
0
200
300
400
500
600
di
F
/dt [A/µs]
V
R
[V]
7 Typ. transient thermal impedance
Z
thJC
=f(t
p
); parameter:
D = t
P
/T
8 Typ. capacitance vs. reverse voltage
C
=f(V
R
);
T
C
=25 °C,
f
=1 MHz
10
1
350
300
250
10
0
Z
thJC
[K/W]
0.5
200
0.2
0.05
C
[pF]
150
10
-1
100
0.1
0.05
0.02
50
0
10
-2
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
0
10
-1
10
0
10
1
10
2
10
3
V
R
[V]
t
P
[s]
Rev. 2.3
page 4
2013-02-11
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