IC FLASH 32M SPI 86MHZ 24CSPBGA
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Macronix |
| 包装说明 | TBGA, BGA24,5X5,40 |
| Reach Compliance Code | unknown |
| Factory Lead Time | 16 weeks |
| 备用内存宽度 | 1 |
| 最大时钟频率 (fCLK) | 86 MHz |
| 数据保留时间-最小值 | 20 |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PBGA-B24 |
| 长度 | 8 mm |
| 内存密度 | 33554432 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 2 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 字数 | 16777216 words |
| 字数代码 | 16000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 16MX2 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TBGA |
| 封装等效代码 | BGA24,5X5,40 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3/3.3 V |
| 编程电压 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 串行总线类型 | SPI |
| 最大待机电流 | 0.00002 A |
| 最大压摆率 | 0.025 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 类型 | NOR TYPE |
| 宽度 | 6 mm |
| 写保护 | HARDWARE/SOFTWARE |
| MX25L3206EXCI-12G | MX25L3206EPI-12G | MX25L3206EZUI-12G | MX25L3206EM2I-12G | MX25L3206EZNI-12G | MX25L3206EMI-12G | |
|---|---|---|---|---|---|---|
| 描述 | IC FLASH 32M SPI 86MHZ 24CSPBGA | Flash, 16MX2, PDIP8, 0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, MS-001, DIP-8 | 16M X 2 FLASH 3.3V PROM, PDSO8 | IC FLASH 32M SPI 86MHZ 8SOP | IC FLASH 32M SPI 86MHZ 8WSON | IC FLASH 32M SPI 86MHZ 16SOP |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix |
| 包装说明 | TBGA, BGA24,5X5,40 | DIP, DIP8,.3 | HVSON, SOLCC8,.15,32 | SOP, SOP8,.31 | 6 X 5 MM, 0.80 MM HEIGHT, 1.27 PITCH, HALOGEN FREE AND ROHS COMPLIANT, MO-220, WSON-8 | SOP, SOP16,.4 |
| Reach Compliance Code | unknown | unknow | unknow | compliant | unknown | compliant |
| 备用内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 |
| 最大时钟频率 (fCLK) | 86 MHz | 86 MHz | 86 MHz | 86 MHz | 86 MHz | 86 MHz |
| 数据保留时间-最小值 | 20 | 20 | 20 | 20 | 20 | 20 |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PBGA-B24 | R-PDIP-T8 | S-PDSO-N8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-G16 |
| 长度 | 8 mm | 9.27 mm | 4 mm | 5.28 mm | 6 mm | 10.3 mm |
| 内存密度 | 33554432 bit | 33554432 bi | 33554432 bi | 33554432 bit | 33554432 bit | 33554432 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 2 | 2 | 2 | 2 | 2 | 2 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 8 | 8 | 8 | 8 | 16 |
| 字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
| 字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 16MX2 | 16MX2 | 16MX2 | 16MX2 | 16MX2 | 16MX2 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TBGA | DIP | HVSON | SOP | HVSON | SOP |
| 封装等效代码 | BGA24,5X5,40 | DIP8,.3 | SOLCC8,.15,32 | SOP8,.31 | SOLCC8,.25 | SOP16,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE | IN-LINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | 260 | 260 | 260 |
| 电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 编程电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 5.33 mm | 0.6 mm | 2.16 mm | 0.8 mm | 2.65 mm |
| 串行总线类型 | SPI | SPI | SPI | 3-WIRE | SPI | SPI |
| 最大待机电流 | 0.00002 A | 0.00002 A | 0.00002 A | 0.00004 A | 0.00002 A | 0.00002 A |
| 最大压摆率 | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | THROUGH-HOLE | NO LEAD | GULL WING | NO LEAD | GULL WING |
| 端子节距 | 1 mm | 2.54 mm | 0.8 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 40 | 40 | 40 | 40 | 40 |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 6 mm | 7.62 mm | 4 mm | 5.23 mm | 5 mm | 7.52 mm |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| Factory Lead Time | 16 weeks | - | 16 weeks | 16 weeks | 16 weeks | 16 weeks |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 零件包装代码 | - | DIP | SON | SOIC | QFN | SOIC |
| 针数 | - | 8 | 8 | 8 | 8 | 16 |
| ECCN代码 | - | EAR99 | EAR99 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A |
| JESD-609代码 | - | - | e3 | e3 | e3 | e3 |
| 湿度敏感等级 | - | - | 3 | 3 | 3 | 3 |
| 端子面层 | - | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) | Matte Tin (Sn) | Tin (Sn) |
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