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SIR668DP-T1-RE3

产品描述MOSFET N-CH 100V 95A POWERPAKSO
产品类别半导体    分立半导体   
文件大小390KB,共13页
制造商Vishay(威世)
官网地址http://www.vishay.com
标准
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SIR668DP-T1-RE3概述

MOSFET N-CH 100V 95A POWERPAKSO

SIR668DP-T1-RE3规格参数

参数名称属性值
FET 类型N 沟道
技术MOSFET(金属氧化物)
漏源电压(Vdss)100V
电流 - 连续漏极(Id)(25°C 时)95A(Tc)
驱动电压(最大 Rds On,最小 Rds On)7.5V,10V
不同 Id,Vgs 时的 Rds On(最大值)4.8 毫欧 @ 20A,10V
不同 Id 时的 Vgs(th)(最大值)3.4V @ 250µA
不同 Vgs 时的栅极电荷 (Qg)(最大值)83nC @ 7.5V
Vgs(最大值)±20V
不同 Vds 时的输入电容(Ciss)(最大值)5400pF @ 50V
功率耗散(最大值)104W(Tc)
工作温度-55°C ~ 150°C(TJ)
安装类型表面贴装
供应商器件封装PowerPAK® SO-8
封装/外壳PowerPAK® SO-8

文档预览

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SiR668DP
www.vishay.com
Vishay Siliconix
N-Channel 100 V (D-S) MOSFET
PowerPAK
®
SO-8 Single
D
6
D
7
D
8
FEATURES
• TrenchFET
®
Gen IV power MOSFET
• Very low R
DS
- Q
g
figure-of-merit (FOM)
• Tuned for the lowest R
DS
- Q
oss
FOM
• 100 % R
g
and UIS tested
• Material categorization: for definitions of
compliance please see
www.vishay.com/doc?99912
D
5
6.
15
m
m
1
Top View
5.1
m
5m
4
G
Bottom View
3
S
2
S
1
S
APPLICATIONS
• Synchronous rectification
• Primary side switch
• DC/DC converters
• OR-ing
• Power supplies
• Motor drive control
• Battery and load switch
D
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
max. () at V
GS
= 10 V
R
DS(on)
max. () at V
GS
= 7.5 V
Q
g
typ. (nC)
I
D
(A)
Configuration
100
0.00480
0.00505
55
95
Single
G
S
N-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK SO-8
SiR668DP-T1-RE3
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
T
C
= 25 °C
T
A
= 25 °C
L = 0.1 mH
SYMBOL
V
DS
V
GS
I
D
I
DM
I
S
I
AS
E
AS
P
D
T
J
, T
stg
LIMIT
100
± 20
95
76
23.2
b, c
18.6
b, c
200
94
5.6
b, c
35
61.2
104
66.6
6.25
b, c
4
b, c
-55 to +150
260
UNIT
V
Continuous drain current (T
J
= 150 °C)
Pulsed drain current (t = 100 μs)
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
A
mJ
T
C
= 25 °C
T
C
= 70 °C
Maximum power dissipation
T
A
= 25 °C
T
A
= 70 °C
Operating junction and storage temperature range
Soldering recommendations (peak temperature)
c
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum junction-to-ambient
b
t
10 s
R
thJA
15
20
°C/W
0.9
1.2
Maximum junction-to-case (drain)
Steady state
R
thJC
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 54 °C/W.
g. T
C
= 25 °C.
S16-2422-Rev. A, 28-Nov-16
Document Number: 75351
1
For technical questions, contact:
pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000

 
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