HSSC424.xxx - 0402 High Stability
Silicon Capacitor
Rev 3.2
Key features
Ultra high stability :
Temperature <±0.5% (-55 °C to +150 °C)
Voltage <0.1 %/V
Negligible aging <0.001% /1000hours
Unique high capacitance in EIA/0402 package
size, up to 100 nF
High reliability (FIT <0.017 parts / billion hours)
Low leakage current down to 100 pA
Low ESL and Low ESR
Suitable with lead free reflow-soldering
*Please
refer to our assembly Application Note for further recommendations
Key applications
All demanding applications, such as
medical, aerospace, automotive industry
High stability applications
Decoupling / Filtering / Charge pump
(i.e.: Pacemakers / defibrillators)
Devices with battery operations
Replacement of X7R and NP0
Downsizing
Thanks to the unique IPDiA Silicon capacitor
technology, most of the problems encountered in
demanding application can be solved.
High Stability Silicon Capacitors
are dedicated to
applications
where
Reliability
is
the
main
The
IPDiA
technology
features
a
capacitor
²
integration capability (up to 250nF/mm ) which
allows a
smaller case size
than existing solutions
to
answer
high
volume
constraints.
This
technology also offers
high reliability,
up to 10
times
better
than
alternative
capacitor
parameter thanks to our end of production Burn-
in.
HSSC avoid the need to oversize the capacitor
value for sensitive capacitive circuitry and offers a
higher DC voltage stability.
This
technology
provides
industry
leading
technologies, such as Tantalum or MLCC, and
eliminates cracking phenomena.
This Silicon based technology is RoHS compliant
and compatible with lead free reflow soldering
process.
performances relative to the
capacitor stability
over the full
operating voltage & temperature
range.
The very high and stable insulation resistance of
silicon capacitors can enhance up to 30 % the
battery lifetime
in mobile applications.
HSSC424.xxx
Electrical specification
Capacitance value
10
15
22
33
47
68
Contact
IPDIA Sales
680 pF:
935.131.424.368
6.8 nF:
935.131.424.468
Contact
IPDIA Sales
Contact
Contact
Contact
1 pF
IPDIA Sales
IPDIA Sales
IPDIA Sales
100 pF:
150 pF:
220 pF:
10 pF
935.131.424.310 935.131.424.315 935.131.424.322
1 nF:
1.5 nF:
2.2 nF:
0.1 nF
935.131.424.410 935.131.424.415 935.131.424.422
10 nF:
15 nF:
22 nF:
935.131.424.510 935.131.424.515 935.131.424.522
100 nF:
10 nF
935.131.424.610
Contact
Contact
IPDIA Sales
IPDIA Sales
330 pF:
470 pF:
935.131.424.333 935.131.424.347
3.3 nF:
4.7 nF:
935.131.424.433 935.131.424.447
47 nF:
33 nF:
935.131.424.547
935.131.424.533 935.131.724.547
1 nF
Parameters
Capacitance range
Capacitance tolerances
Operating temperature range
Storage temperatures
Temperature coefficient
Breakdown voltage (BV)
Capacitance variation versus
RVDC
Equivalent Serial Inductor (ESL)
Equivalent Serial Resistor (ESR)
Insulation resistance
Ageing
Reliability
Capacitor height
Value
100 pF to 100 nF
(***)
±15
%
(***)
(**)
-55 °C to 150 °C
- 70 °C to 165 °C
<±0.5 %, from -55 °C to +150 °C
11, 30 V
(***)
0.1 % /V (from 0 V to RVDC)
Max 100 pH
Max 400m
(***)
100G
min @ 3V,from
-55°C to +150°C
Negligible, < 0.001 % / 1000h
FIT<0.017 parts / billion hours,
Max 400 µm
(*)
Unit
(*) Thinner thickness (as low as 100 µm thick) available, see Low Profile Silicon Capacitor product: LPSC
(**) Extended temperature range (up to +250 °C) available, see Xtreme Temperature Silicon Capacitor product: XTSC
(***) Other values on request.
Temperature coefficient
PICS vs. MLCC capacitors
20
10
0
Capacitance change (%)
Capacitance change (%)
Temperature
Temperature coefficient
coefficient
PICS vs. MLCC
PICS vs. MLCC capacitors
capacitors
PICS
C0G
X8R
X7R
0
10
DC Voltage stability
MLCC capacitors vs. PICS
1,1
ESL (nH) @25°C
0402 C0G(NPO) vs. PICS
PICS
1
0,9
20
10
0
Capacitance change (%)
20
-10
10
-20
0
-30
-40
-10
-50
-20
Z5U
C0G
X8R
X7R
PICS
PICS
-10
Capacitance change (%)
C0G
C0G
X8R
X7R
-20
C0G
0,8
0,7
-10
-20
-30
-40
-50
-60
-70
-80
-50
X7R
-40
-50
-60
-70
-80
Y5V
ESL(nH)
-30
-30
-60
-40
-70
-50
-80
-50
0
50
Z5U
Y5V
0,6
0,5
0,4
0,3
0,2
Z5U
100
150
200
-60
-70
Temperature (°C)
Y5V
Y5V
PICS
0,1
0
-80
-50
0
-90
0
50
50
100
100
150
150
200
200
-100
0
1
2
3
Bias voltage (V)
4
5
6
7
Temperature (°C)
Temperature (°C)
0
50
100
150
200
250
300
350
400
450
500
550
600
650
700
750
800
850
900
950 1000
Capacitance (pF)
Fig.1 Capacitance change versus temperature
variation compared with alternative dielectrics
Fig.2 Capacitance change versus voltage
variation compared with alternative dielectrics
Fig.3 ESL versus capacitance value
compared with alternative dielectrics
Part Number
935.131.
B.2
Breakdown
Voltage
4 = 11V
7 = 30V
S.
Size
4 = 0402
U
Unit
0 = 10 f
1 = 0.1 p
2=1p
3 = 10 p
4 = 0.1 n
xx
i.e.: 100 nF/0402 case (HSSC type)
935.131.424.610
5=1n
6 = 10 n
7 = 0.1 µ
8=1µ
9 = 10 µ
Value (E6)
10
15
22
33
47
68
Termination and Outline
Termination
Lead-free nickel/solder coating compatible
with automatic soldering technologies:
reflow and manual.
Typical dimensions, all dimensions in mm.
Package outline
L
Typ.
Comp.
size
L
W
0402
W
1.16±0.05
0.66±0.05
Land
pattern
IPD
component
Solder
Resist
(0402 PCB footprint)
Packaging
Tape and reel, tray, waffle pack or wafer delivery.
Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner. The information
presented in this document does not form part of any
quotation or contract, is believed to be accurate and reliable
and may be changed without notice. No liability will be
accepted by the publisher for any consequence of its use.
Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
For more information, please visit:
http://www.ipdia.com
To contact us, email to:
sales@ipdia.com
Date of release: 28
th
February 2014
Document identifier: CL431 111 615 137
FPGA/CPLD
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