Hall ICs
AN48810B
Low current consumption, high sensitivity CMOS Hall IC
One-way magnetic field operation
0.225
0.22
+0.10
-0.05
5
4
Unit: mm
0.13
M
■
Overview
The AN48810B is a Hall IC (a magnetic sensor) which
has 2 times or more sensitivity and a low current consump-
tion of about one three-hundredth compared with our
conventional one.
In this Hall IC, a Hall element, a offset cancel circuit,
an amplifier circuit, a sample and hold circuit, a Schmidt
circuit, and output stage FET are integrated on a single
chip housed in a small package by IC technique.
2.10
±0.10
M
ain
Di
sc te
on na
tin nc
ue e/
d
0.225
1
2
3
0.65 0.65
1.30
±0.10
2.00
±0.10
1.65
±0.10
■
Features
•
High sensitivity (6 mT max.) due to offset cancel circuit
and a new sample and hold circuit
•
Small current by using intermittent action
•
Small package (SMD)
•
CMOS inverter output
■
Applications
•
Flip type cellular phone, digital video camera
■
Block Diagram
V
CC
5
/D
isc
on
tin
CLK
Ma
int
en
an
Hall
element
Switch
GND
2
Note) The magnetism detection time should be longer than one intermittent action cycle (On
=
200
µs
and Off
=
51 ms).
■
Pin Descriptions
Pin No.
1
2
3
Symbol
Out
GND
N.C.
Output
Ground
Description
Pin No.
4
5
Symbol
N.C.
V
CC
Power supply
Description
Publication date: November 2002
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0.32
±0.10
0 to 0.10
0.10
Seating plane
1
2
3
5
4
0.80
±0.10
SMINI-5DA (Lead-free package)
N.C.
3
N.C.
4
ue
On/Off control
Sample
and
hold
ce
1
Out
Amplifier
SPC00016AEB
0.11
+0.10
-0.05
1
AN48810B
■
Absolute Maximum Ratings
Parameter
Supply voltage
Symbol
V
CC
V
OUT
Output current
Power dissipation
Operating ambient temperature
Storage temperature
I
O
P
D
T
opr
T
stg
Rating
5
5
15
60
−20
to
+75
−55
to
+125
Unit
V
V
mA
mW
°C
°C
■
Recommended Operating Range
Parameter
Supply voltage
Symbol
V
CC
■
Electrical Characteristics at T
a
=
25°C
Parameter
Symbol
B
H-L
B
L-H
BW
Operating magnetic flux density 1
Operating magnetic flux density 2
Hysteresis width
Output voltage 1
Output voltage 2
Supply current 1
Supply current 2
Supply current 3
V
OL
V
OH
tin
I
CCON
I
CCOFF
system is off. One magnetism detection cycle is On
=
200
µs
and Off
=
51 ms. I
CCAVE
is an average consumption current.
■
Technical Data
•
Position of a Hall element (unit in mm)
Distance from a package surface to sensor part: 0.31 mm (reference value)
A Hall element is placed on the shaded part in the figure.
Ma
int
en
Note) 1. Symbol B
H-L
stands for the operating magnetic flux density where its output level varies from high to low.
2. Symbol B
L-H
stands for the operating magnetic flux density where its output level varies from low to high.
3. I
CCON
is a consumption current when the magnetism detection system is on, and I
CCOFF
is that when the magnetism detection
an
ce
/D
I
CCAVE
2
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Range
Unit
V
2.5 to 3.5
Conditions
Min
Typ
Max
6
Unit
mT
V
CC
=
3 V
V
CC
=
3 V
V
CC
=
3 V
0.5
mT
1.2
mT
V
V
CC
=
3 V, I
O
=
2 mA, B
=
6 mT
V
CC
=
3 V, B
=
0.5 mT
V
CC
=
3 V, B
=
0.5 mT
V
CC
=
3 V, B
=
0.5 mT
0.1
0.3
V
CC
=
3 V, I
O
= −2
mA, B
=
0.5 mT
2.7
2.9
2
3
V
mA
µA
µA
10
15
1.0
0.31
1.0
SPC00016AEB
M
ain
Di
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on na
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d
isc
on
ue
Note) 1. Except for the operating ambient temperature and storage temperature, all ratings are for T
a
=
25°C.
2. The reverse insertion of this IC will cause its breakdown.
3. It will operate normally in several tens of ms after power on.
4. This IC is not suitable for car electrical equipment.
AN48810B
■
Technical Data (continued)
•
Magneto-electro conversion characteristics
S
Output voltage
B
L-H
BW
Direction of applied magnetic field
•
Simple polarity distinction method of mounting magnet to product incorporating Hall IC
Magnet
Plastic bar
Ma
int
en
an
Operating magnetic flux density
Supply voltage
2.0
T
a
=
25°C
ce
•
Main characterisitcs
/D
isc
on
A magnet, which is used in pair with a Hall IC, can be mounted to a product incorporating a built-in Hall IC (e.g.,
a cellular phone) smoothly and correctly with a simple tool. The polarity of the magnet (hereafter referred to as Hall
IC magnet) will be automatically discriminated.
This tool is a plastic bar, one end of which is attached with a small magnet (hereafter referred to as plastic bar
magnet), as shown in the above illustration. The plastic bar magnet, the polarity of which is known, is secured on the
bar with a plastic cover. When the plastic bar magnet is located close to the Hall IC magnet, the Hall IC magnet will
be attracted to the plastic bar magnet. The contact side of the Hall IC magnet is different in polarity from that of the
plastic bar magnet. As a matter of course, the polarity of the Hall IC magnet will be known then. The Hall IC magnet
can be mounted to the appliance in this state. The attraction force of the plastic bar magnet is rather weak due to the
plastic cover on it. Therefore, the plastic bar can be separated from the Hall IC magnet with ease after the Hall IC
magnet is mounted properly.
Operating magnetic flux density
B (mT)
Operating magnetic flux density B
(mT)
Sample 1 BW
1.5
Sample 2 BW
1.0
Sample 3 BW
0.5
0
2
2.5
3
3.5
4
4.5
5
Supply voltage
V
CC
(V)
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Operating magnetic flux density
Plastic cover
Magnet for Hall IC
6
V
CC
=
3.0 V
Sample 1 B
H-L
M
ain
Di
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on na
tin nc
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d
N
B
H-L
Applied magnetic flux density B
tin
ue
Operating magnetic flux density
Ambient temperature
5
Sample 3 B
H-L
Sample 1 B
L-H
4
Sample 2 B
H-L
3
Sample 3 B
L-H
Sample 2 B
L-H
2
−25
0
25
50
75
Ambient temperature T
a
(°C)
SPC00016AEB
3
AN48810B
■
Technical Data (continueed)
•
Main characterisitcs
Operating magnetic flux density
Supply voltage
6
Sample 2 B
H-L
Average consumption current
Supply voltage
25
5
Average consumption current
I
CCAVE
(µA)
T
a
=
25°C
Output
=
High
Operating magnetic flux density B
(mT)
Sample 2 B
L-H
20
4
Sample 1 B
H-L
Sample 1 B
L-H
1
0
2
2.5
3
3.5
4
4.5
Supply voltage
V
CC
(V)
Low-level output voltage
Supply voltage
I
O
=
2 mA
0.07
Low-level output voltage
V
OL
(V)
75°C
25°C
Low-level output voltage
V
OL
(V)
0.06
0.05
0.04
0.03
0.02
125°C
−25°C
−50°C
0.01
on
0.00
0
1
2
3
4
5
0.14
Ma
int
en
an
∆
high-level output voltage
Supply voltage
125°C
I
O
= −2
mA
ce
/D
Supply voltage
V
CC
(V)
∆
hgh-level output voltage
∆V
OH
(V)
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0
75°C
25°C
∆
hgh-level output voltage
∆V
OH
(V)
−25°C
−50°C
1
2
3
4
5
Supply voltage
V
CC
(V)
4
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5
125°C
0
M
ain
Di
sc te
on na
tin nc
ue e/
d
3
2
Sample 3 B
H-L
Sample 3 B
L-H
10
−50°C
25°C
15
5
0
1
2
3
4
5
6
Supply voltage
V
CC
(V)
Low-level output voltage
Ambient temperature
0.07
V
CC
=
3.0 V
0.06
0.05
0.04
0.03
0.02
0.01
tin
ue
6
0.00
−50
−25
0
25
50
75
100
125
isc
Ambient temperature T
a
(°C)
∆
high-level output voltage
Ambient temperature
0.14
V
CC
=
3.0 V
0.12
0.10
0.08
0.06
0.04
0.02
6
0.00
−50
−25
0
25
50
75
100
125
Ambient temperature T
a
(°C)
SPC00016AEB
AN48810B
■
Caution on Use of Hall ICs
The Hall ICs are often used to detect movement. In such cases, the position of the Hall IC may be changed by
exposition to shock or vibration over a long period of time, and it causes the detection level change. To prevent this, fix
the package with adhesives or fix it on a dedicated case.
1. A case using an adhesive
Some kinds of adhesive generate corrosive gas (such as chloric gas) during curing. This corrosive gas corrodes the
aluminum on the surface of the Hall IC, and may cause a functional defect of disconnection.
If Hall IC is to be sealed after installation, attention should be given to the adhesive or resin used for peripherals
and substrate cleaner, as well as to the adhesive used for Hall IC installation. Please confirm the above matter to those
manufacturers before using.
We could not select the specified adhesive, for we find it difficult to guarantee the ingredient of each adhesive.
2. Power supply line/Power transmission line
If a power supply line/power transmission line becomes longer, noise and/or oscillation may be found on the line.
In this case, set the capacitor of 0.1
µF
to 10
µF
near the Hall IC to prevent it.
If a voltage of 18 V or more is thought to be applied to the power supply line (flyback voltage from coil or the ignition
pulse, etc.), avoid it with external components (capacitor, resistor, Zener diode, diode, surge absorbing elements, etc.).
3. On mounting of the surface mount type package (MINI-3DR)
When mounted on the printed circuit board, the Hall IC may be highly stressed by the warp that may occur from
the soldering. This may also cause a change in the operating magnetic flux density and a deterioration of its resistance
to moisture.
Wrong
4. V
CC
and GND
Do not reverse V
CC
and GND. If the V
CC
and GND pins are reversely connected, this IC will be destroyed. If the
IC GND-pin voltage is set higher than other pin voltage, the IC configuration will become the same as a forward
biased diode. Therefore, it will turn on at the diode forward voltage (approximately 0.7 V), and a large current will
flow through the IC, ending up in its destruction. (This is common to monolithic IC.)
5. Cautions on power-on of Hall IC
When a Hall IC is turned on, the position of the magnet or looseness may change the output of a Hall IC, and a pulse
may be generated. Therefore, care should be given whenever the output state of a Hall IC is critical when the supply
power is on.
6. On fixing a Hall IC to holder
When a Hall IC is mounted on the printed circuit board with a holder and the coefficient of expansion of the holder
is large, the lead wire of the Hall IC will be stretched and it may give a stress to the Hall IC.
If the lead wire is stressed intensely due to the distortion of holder or board, the adhesives between the package and
the lead wire may be weakened and cause a minute gap resulting in the deterioration of its resistance to moisture.
Sensitivity may also be changed by this stress.
7. On using flux in soldering
Choose a flux which does not include ingredients from halogen group, such as chlorine, fluorine, etc. The
ingredients of halogen group may enter where the lead frame and package resin joint, causing corrosion and the
disconnection of the aluminum wiring on the surface of an IC chip.
8. In case of the magnetic field of a magnet is too strong
Output may be inverted when applying a magnetic flux density of 100 mT or more. Accordingly, magnetic flux
density should be used within the range of 100 mT.
9. On surface treatment of mini-mold package
Surface treatment is available in either smooth or dull finish.
10. On soldering of the surface mount type package
Surface mounting type Hall ICs are apt to change its electrical characteristics due to the stress from soldering at
mounting. Therefore, avoid the mounting by flow (dipping) and a soldering iron. Please mount it by reflow soldering
abiding by its recommended conditions.
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/en at
/ ion
.
Correct
SPC00016AEB
Ma
int
en
an
ce
M
ain
Di
sc te
on na
tin nc
ue e/
d
/D
isc
on
tin
ue
5
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