TVS Diode Arrays
(SPA
®
Diodes)
Lightning Surge Protection - AQ2555NUTG
SP3374NUTG
AQ2555NUTG 2.5V 45A Diode Array
Description
RoHS
Pb
GREEN
The AQ2555NUTG is a low-capacitance, TVS Diode Array
designed to provide protection against ESD (electrostatic
discharge), CDE (cable discharge events), EFT (electrical
fast transients), and lightning induced surges for high-
speed, differential data lines. It’s packaged in a μDFN
package (3.0 x 2.0mm) and each component can protect
up 4 channels or 2 differential pairs, up to 45A (IEC 61000-
4- 5 2
nd
edition,) and up to 30kV ESD (IEC 61000-4-2). The
“flow-through” design minimizes signal distortion, reduces
voltage overshoot, and provides a simplified PCB design.
The AQ2555NUTG with its low capacitance and low
clamping voltage makes it ideal for high-speed data
interfaces such as 1GbE applications found in notebooks,
switches, etc.
Pinout
10
9
8
7
6
Features
• ESD, IEC 61000-4-2,
±30kV contact, ±30kV air
• EFT, IEC 61000-4-4, 50A
(5/50ns)
• Lightning, IEC 61000-
4-5 2
nd
edition, 45A
(t
P
=8/20μs)
1
2
3
4
5
• μDFN-10 package is
optimized for high-speed
data line routing
• rovides protection for
P
two differential data pairs
(4 channels) up to 45A
• ow operating and
L
clamping voltage
• AEC-Q101 qualified
• Halogen free, Lead free
and RoHS compliant
• Moisture Sensitivity
Level(MSL -1)
• Low capacitance of
2.5pF@0V (TYP) per I/O
• Low leakage current of
0.1μA (TYP) at 2.5V
Functional Block Diagram
Applications
•10/100/1000 Ethernet
• LVDS Interfaces
• Integrated Magnetics
LINE1 IN (Pin 1)
LINE1 OUT (Pin 10)
• WAN/LAN Equipment
• Desktops, Servers and
Notebooks
Application Example
LINE2 IN (Pin 2)
LINE2 OUT (Pin 9)
GND
GND
RJ-45 Connector
LINE3 IN (Pin 4)
LINE3 OUT (Pin 7)
Ethernet PHY
TP0+
TP0-
LINE4_IN (Pin 5)
LINE4_OUT (Pin 6)
TP1+
TP1-
TP2+
TP2-
TP3+
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 08/29/17
TP3-
SP2574N
AQ2555
TVS Diode Arrays
(SPA
®
Diodes)
Lightning Surge Protection - AQ2555NUTG
SP3374NUTG
Absolute Maximum Ratings
Symbol
I
PP
P
Pk
T
OP
T
STOR
Parameter
Peak Current (t
p
=8/20μs)
Peak Pulse Power (t
p
=8/20μs)
Operating Temperature
Storage Temperature
Value
45
1000
-40 to 150
-55 to 150
Units
A
W
°C
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation
of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Characteristics
(T
OP
=25ºC)
Parameter
Reverse Standoff Voltage
Reverse Leakage Current
Snap Back Voltage
Symbol
V
RWM
I
R
V
SB
Test Conditions
I
R
≤ 1µA
V
RWM
= 2.5V, T = 25°C
I
SB
= 50mA
I
PP
= 1A, t
p
= 8/20μs, Any I/O to Ground
I
PP
= 10A, t
p
= 8/20μs, Any I/O to Ground
Clamp Voltage
V
C
I
PP
= 25A, t
p
= 8/20μs, Any I/O to Ground
I
PP
= 45A, t
p
= 8/20μs,
Line-to-Line
1
, two I/O Pins
connected together on each line
Dynamic Resistance
2
ESD Withstand Voltage
R
DYN
V
ESD
C
I/O to GND
C
I/O to I/O
TLP
p
=100ns, Any I/O to Ground
, t
IEC 61000-4-2 (Contact)
IEC 61000-4-2 (Air)
Between I/O Pins and Ground
V
R
= 0V, f = 1MHz
Between I/O Pins
V
R
= 0V, f = 1MHz
±30
±30
2.5
1.2
2.0
4.5
7
.5
12
19
0.1
Ω
kV
kV
pF
pF
V
0.1
Min
Typ
Max
2.5
0.5
Units
V
µA
V
Diode Capacitance
Notes:
1. Rating with 2 pins connected together per sugguested diagram ( For example, pin1 is connected to pin 10,
pin 2 is connected to Pin 9, Pin 4 is connected to pin 7 and pin 5 is connected to pin 6)
2. Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 08/29/17
TVS Diode Arrays
(SPA
®
Diodes)
Lightning Surge Protection - AQ2555NUTG
SP3374NUTG
Capacitance vs. Reverse Bias
5.0
Capacitance (pF)
Clamping Voltage vs. I
PP
(I/O to GND)
15
3.0
2.0
1.0
0.0
Clamp Voltage (V
C
)
4.0
12
9
6
3
0
0.5
1
1.5
2
2.5
0
0.0
5.0
10.0
15.0
20.0
25.0
Bias Voltage (V)
Peak Pulse Current-I
PP
(A)
Clamping Voltage vs. I
PP
(Line-to-Line)
20
18
8/20μs Pulse Waveform
110%
100%
90%
80%
Clamp Voltage (V
C
)
16
14
Percent of I
PP
0
5
10
15
20
25
30
35
40
45
12
10
8
6
4
2
0
70%
60%
50%
40%
30%
20%
10%
0%
0.0
5.0
10.0
15.0
20.0
25.0
30.0
Peak Pulse Current-I
PP
(A)
Time ( s)
Transmission Line Pulsing(TLP) Plot
20
18
16
14
Power Derating Curve
100
Peak Pulse Power (P
PP
) or Current (I
PP
)
Derating in Percentage %
0
1
2
3
4
5
6
7
8
90
TLP Current (A)
12
10
8
6
4
2
0
80
70
60
50
0
25
50
75
100
125
150
175
TLP Voltage (V)
T
J
- Initial Junction Temperature (ºC)
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 08/29/17
TVS Diode Arrays
(SPA
®
Diodes)
Lightning Surge Protection - AQ2555NUTG
SP3374NUTG
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus) Temp (T
L
)
to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
Pb – Free assembly
Temperature
T
P
T
L
T
S(max)
Preheat
Ramp-up
t
P
Critical Zone
T
L
to T
P
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260
+0/-5
°C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
t
L
Ramp-do
Ramp-down
T
S(min)
t
S
time to peak temperature
25
Time
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
Ordering Information
Part Number
AQ2555NUTG
Package
µDFN-10
(3.0x2.0mm)
Marking
AQ2555
Min. Order Qty.
3000
Part Numbering System
Part Marking System
AQ 2555N U T G
TVS Diode Arrays
(SPA
®
Automotive
Grade DiodesDiodes)
Series
G= Green
T= Tape & Reel
Package
DFN-10 (3.0x2.0mm)
AQ2555
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 08/29/17
TVS Diode Arrays
(SPA
®
Diodes)
Lightning Surge Protection - AQ2555NUTG
SP3374NUTG
Package Dimensions — µDFN-10 (3.0x2.0mm)
D
b1
L
Package
JEDEC
E
L1
µDFN-10 (3.0x2.0mm)
MO-229
Millimeters
Min
0.50
0.00
0.15
0.25
2.90
1.90
Nom
0.60
0.03
0.15 Ref
0.20
0.35
3.00
2.00
0.60 BSC
0.65 BSC
0.95 BSC
0.25
0.95
0.30
1.00
0.35
1.05
0.010
0.037
0.25
0.45
3.10
2.10
0.006
0.010
0.114
0.075
Max
0.65
0.05
Min
0.020
0.000
Inches
Nom
0.024
0.001
0.006 Ref
0.008
0.014
0.118
0.079
0.024 BSC
0.026 BSC
0.037
0.012
0.039
0.014
0.041
0.010
0.018
0.122
0.083
Max
0.026
0.002
Symbol
PIN1 INDICATOR
e
e1
e2
A
b
A
A1
A3
b
b1
D
A3
A1
0.95mm
0.95mm
0.25mm
0.95mm
0.95mm
0.25mm
E
e
e1
e2
1.98mm
1.00mm
1.40mm
1.98mm
0.85mm
1.40mm
L
L1
Notes :
0.60mm
0.40mm
0.40mm
0.60mm
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
0.60mm 0.65mm 0.65mm 0.60mm
0.60mm 0.65mm 0.65mm 0.60mm
Recommended Soldering Pads Layout
Recommended Stencil Apertures
Recommended Stencil thickness 5mils
Tape & Reel Specification — µDFN-10 (3.0x2.0mm)
P0
P2
ø1.55±0.05
E
Top
Cover
Tape
5° Max
W
A0
B0
F
Package
µDFN-10 (3.0x2.0mm)
Millimeters
2.30 +/- 0.10
3.20 +/- 0.10
1.75 +/- 0.10
3.50 +/- 0.05
1.0 +/- 0.10
4.00 +/- 0.10
4.00 +/- 0.10
2.00 +/- 0.10
0.3 +/- 0.05
8.00 +0.30/- 0.10
T
Device Orientation in Tape
Symbol
A0
B0
E
F
K0
P
K0
P
ø1.0±0.1
Pin1 Location
P0
P2
T
W
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at
www.littelfuse.com/disclaimier-electronics.
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 08/29/17
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