MT46HC16M32LFCM-6L:B概述

DDR DRAM, 16MX32, 6ns, CMOS, PBGA90, 10 X 13 MM, GREEN, PLASTIC, VFBGA-90

MT46HC16M32LFCM-6L:B规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	Micron Technology
零件包装代码	BGA
包装说明	VFBGA,
针数	90
Reach Compliance Code	compliant
ECCN代码	EAR99
Is Samacsys	N
访问模式	FOUR BANK PAGE BURST
最长访问时间	6 ns
其他特性	AUTO/SELF REFRESH
JESD-30 代码	R-PBGA-B90
JESD-609代码	e1
长度	13 mm
内存密度	536870912 bit
内存集成电路类型	DDR DRAM
内存宽度	32
功能数量	1
端口数量	1
端子数量	90
字数	16777216 words
字数代码	16000000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	16MX32
封装主体材料	PLASTIC/EPOXY
封装代码	VFBGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260
认证状态	Not Qualified
座面最大高度	1 mm
自我刷新	YES
最大供电电压 (Vsup)	1.95 V
最小供电电压 (Vsup)	1.7 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	30
宽度	10 mm
Base Number Matches	1

MT46HC16M32LFCM-6L:B相似产品对比

	MT46HC16M32LFCM-6L:B	MT46HC16M32LFCX-5IT:B	MT46HC32M16LFBF-54IT:B	MT46HC16M32LGCX-6L:B	MT46HC32M16LFCX-75LIT:B	MT46HC32M16LGCM-6IT:B	MT46HC32M16LFCM-5LIT:B	MT46HC32M16LFBF-75:B	MT46HC32M16LFBF-5IT:B
描述	DDR DRAM, 16MX32, 6ns, CMOS, PBGA90, 10 X 13 MM, GREEN, PLASTIC, VFBGA-90	DDR DRAM, 16MX32, 5ns, CMOS, PBGA90, 9 X 13 MM, GREEN, PLASTIC, VFBGA-90	DDR DRAM, 32MX16, 5.4ns, CMOS, PBGA60, 8 X 9 MM, GREEN, PLASTIC, VFBGA-60	DDR DRAM, 16MX32, 6ns, CMOS, PBGA90, 9 X 13 MM, GREEN, PLASTIC, VFBGA-90	DDR DRAM, 32MX16, 7.5ns, CMOS, PBGA90, 9 X 13 MM, GREEN, PLASTIC, VFBGA-90	DDR DRAM, 32MX16, 6ns, CMOS, PBGA90, 10 X 13 MM, GREEN, PLASTIC, VFBGA-90	DDR DRAM, 32MX16, 5ns, CMOS, PBGA90, 10 X 13 MM, GREEN, PLASTIC, VFBGA-90	DDR DRAM, 32MX16, 7.5ns, CMOS, PBGA60, 8 X 9 MM, GREEN, PLASTIC, VFBGA-60	DDR DRAM, 32MX16, 5ns, CMOS, PBGA60, 8 X 9 MM, GREEN, PLASTIC, VFBGA-60
是否无铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,
针数	90	90	60	90	90	90	90	60	60
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Is Samacsys	N	N	N	N	N	N	N	N	N
访问模式	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
最长访问时间	6 ns	5 ns	5.4 ns	6 ns	7.5 ns	6 ns	5 ns	7.5 ns	5 ns
其他特性	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 代码	R-PBGA-B90	R-PBGA-B90	R-PBGA-B60	R-PBGA-B90	R-PBGA-B90	R-PBGA-B90	R-PBGA-B90	R-PBGA-B60	R-PBGA-B60
JESD-609代码	e1	e1	e1	e1	e1	e1	e1	e1	e1
长度	13 mm	13 mm	9 mm	13 mm	13 mm	13 mm	13 mm	9 mm	9 mm
内存密度	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit
内存集成电路类型	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
内存宽度	32	32	16	32	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1	1
端子数量	90	90	60	90	90	90	90	60	60
字数	16777216 words	16777216 words	33554432 words	16777216 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words
字数代码	16000000	16000000	32000000	16000000	32000000	32000000	32000000	32000000	32000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	85 °C	85 °C	70 °C	85 °C	85 °C	85 °C	70 °C	85 °C
最低工作温度	-	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C	-	-40 °C
组织	16MX32	16MX32	32MX16	16MX32	32MX16	32MX16	32MX16	32MX16	32MX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	260	260
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
自我刷新	YES	YES	YES	YES	YES	YES	YES	YES	YES
最大供电电压 (Vsup)	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V
最小供电电压 (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
标称供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	30	30	30	30	30	30	30	30	30
宽度	10 mm	9 mm	8 mm	9 mm	10 mm	10 mm	10 mm	8 mm	8 mm
Base Number Matches	1	1	1	1	1	1	1	1	1

MT46HC16M32LFCM-6L:B

MT46HC16M32LFCM-6L:B概述

MT46HC16M32LFCM-6L:B规格参数

MT46HC16M32LFCM-6L:B相似产品对比

推荐资源