F-219
(0.635 mm) .025"
HDLSP–035–1000
HDLSP SERIES
HIGH-DENSITY/HIGH-SPEED CABLE SYSTEM
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?HDLSP
Cable:
32 AWG low skew
pair cable
Insulator Material:
LCP
Terminal Material:
Phosphor Bronze
Jacket Material:
PVC
Insulator:
Dielectric
Conductors:
Copper
Braid:
Tinned Copper
Covers:
Diecast Zinc Alloy
Current Rating:
1.5 A per pin
(4 adjacent pins
powered)
Mates with:
HDI6
Industry’s densest
I/O cable system
32 AWG low skew
pair cable
OTHER SOLUTIONS
For HT3.1 see
www.samtec.com/ht3
and specify part number
HDR-149112-XXXX.
Designed
for heavy
duty handling
12 pairs
per side
48 pairs in 28 mm x 14 mm
panel opening
TYPE
ALSO AVAILABLE
(MOQ Required)
• Other lengths
NO. OF
POSITIONS
LENGTH
= High-density
Low Skew Pair Cable
HDLSP
(Per Row)
= 12 Pairs per side
–035
= Length in millimeters
–1000, –2000
(Standard lengths)
–“XXXX”
(35.13) 1.383
B35
A35
(25.50) (22.85)
1.004
.900
B1
A1
(6.10)
.240
Supplied with
dust caps
(4.58)
.180
LENGTH
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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