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SIRA88DP-T1-GE3

产品描述MOSFET N-CH 30V 45.5A POWERPAKSO
产品类别分立半导体    晶体管   
文件大小401KB,共13页
制造商Vishay(威世)
官网地址http://www.vishay.com
标准
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SIRA88DP-T1-GE3概述

MOSFET N-CH 30V 45.5A POWERPAKSO

SIRA88DP-T1-GE3规格参数

参数名称属性值
是否Rohs认证符合
包装说明SMALL OUTLINE, R-PDSO-F5
Reach Compliance Codeunknown
ECCN代码EAR99
雪崩能效等级(Eas)5 mJ
外壳连接DRAIN
配置SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压30 V
最大漏极电流 (ID)45.5 A
最大漏源导通电阻0.0067 Ω
FET 技术METAL-OXIDE SEMICONDUCTOR
JESD-30 代码R-PDSO-F5
元件数量1
端子数量5
工作模式ENHANCEMENT MODE
最高工作温度150 °C
最低工作温度-55 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性/信道类型N-CHANNEL
最大脉冲漏极电流 (IDM)100 A
表面贴装YES
端子形式FLAT
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
晶体管应用SWITCHING
晶体管元件材料SILICON
Base Number Matches1

文档预览

下载PDF文档
SiRA88DP
www.vishay.com
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET
PowerPAK
®
SO-8 Single
D
6
D
7
D
8
FEATURES
• TrenchFET
®
Gen IV power MOSFET
• 100 % R
g
and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
2
S
1
S
D
5
6.
1
5
m
m
1
Top View
5
5.1
mm
4
G
Bottom View
APPLICATIONS
• DC/DC conversion
• Battery protection
• Load switching
• DC/AC inverters
G
3
S
D
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
max. (Ω) at V
GS
= 10 V
R
DS(on)
max. (Ω) at V
GS
= 4.5 V
Q
g
typ. (nC)
I
D
(A)
Configuration
30
0.0067
0.0100
8.3
45.5
Single
S
N-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK SO-8
SiRA88DP-T1-GE3
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
T
C
= 25 °C
T
A
= 25 °C
L = 0.1 mH
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
SYMBOL
V
DS
V
GS
LIMIT
30
+20, -16
45.5
36.4
16.5
b, c
13.1
b, c
100
22.7
3
b, c
10
5
25
16
3.3
b, c
2.1
b ,c
-55 to +150
260
UNIT
V
Continuous drain current (T
J
= 150 °C)
I
D
Pulsed drain current (t = 300 μs)
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
I
DM
I
S
I
AS
E
AS
A
mJ
Maximum power dissipation
P
D
W
Operating junction and storage temperature range
Soldering recommendations (peak temperature)
d, e
T
J
, T
stg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
b, f
SYMBOL
TYPICAL
MAXIMUM
UNIT
t
10 s
R
thJA
30
37
Maximum junction-to-ambient
°C/W
4
5
Maximum junction-to-case (drain)
Steady state
R
thJC
Notes
a. Based on T
C
= 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 70 °C/W
S17-0792-Rev. B, 22-May-17
Document Number: 77777
1
For technical questions, contact:
pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000

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