电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

SIA918EDJ-T1-GE3

产品描述MOSFET 2N-CH 30V POWERPAK SC70-6
产品类别半导体    分立半导体   
文件大小384KB,共9页
制造商Vishay(威世)
官网地址http://www.vishay.com
标准
下载文档 详细参数 全文预览

SIA918EDJ-T1-GE3在线购买

供应商 器件名称 价格 最低购买 库存  
SIA918EDJ-T1-GE3 - - 点击查看 点击购买

SIA918EDJ-T1-GE3概述

MOSFET 2N-CH 30V POWERPAK SC70-6

SIA918EDJ-T1-GE3规格参数

参数名称属性值
FET 类型2 个 N 沟道(双)
FET 功能标准
漏源电压(Vdss)30V
电流 - 连续漏极(Id)(25°C 时)4.5A(Tc)
不同 Id,Vgs 时的 Rds On(最大值)58 毫欧 @ 3A,4.5V
不同 Id 时的 Vgs(th)(最大值)900mV @ 250µA
不同 Vgs 时的栅极电荷 (Qg)(最大值)5.5nC @ 4.5V
功率 - 最大值7.8W
工作温度-55°C ~ 150°C(TJ)
安装类型表面贴装
封装/外壳PowerPAK® SC-70-6 双
供应商器件封装PowerPAK® SC-70-6 双

文档预览

下载PDF文档
SiA918EDJ
www.vishay.com
Vishay Siliconix
Dual N-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
V
DS
(V)
30
R
DS(on)
() MAX.
0.058 at V
GS
= 4.5 V
0.065 at V
GS
= 2.5 V
0.077 at V
GS
= 1.8 V
I
D
(A)
4.5
a
4.5
a
4.5
a
FEATURES
Q
g
(TYP.)
3.6 nC
PowerPAK
®
SC-70-6L
Dual
S
2
4
G
2
5
D
1
6
• TrenchFET
®
power MOSFET
• Thermally enhanced PowerPAK
®
SC-70 package
- Small footprint area
- Low on-resistance
• Typical ESD protection: 1000 V (HBM)
• 100 % R
g
tested
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
APPLICATIONS
D
1
D
2
1
m
5m
2.0
Top View
3
D
2
Bottom View
2
G
1
1
S
1
• Portable devices such as smart phones, tablet PCs and
mobile computing
- Load switch
- DC/DC converter
- Power management
D
1
D
2
Marking Code:
CL
Ordering Information:
SiA918EDJ-T1-GE3 (lead (Pb)-free and halogen free)
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
T
C
= 25 °C
Continuous Drain Current (T
J
= 150 °C)
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Pulsed Drain Current (t = 100 μs)
Continuous Source-Drain Diode Current
T
C
= 25 °C
T
A
= 25 °C
T
C
= 25 °C
Maximum Power Dissipation
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak
Temperature)
d,e
T
J
, T
stg
P
D
I
DM
I
S
I
D
SYMBOL
V
DS
V
GS
LIMIT
30
±8
4.5
a
4.5
a
4.4
b, c
3.5
b, c
15
4.5
a
1.6
b, c
7.8
5
1.9
b, c
1.2
b, c
-55 to +150
260
°C
W
A
UNIT
V
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient
b, f
Maximum Junction-to-Case (Drain)
t
5s
Steady State
SYMBOL
R
thJA
R
thJC
TYPICAL
52
12.5
MAXIMUM
65
16
UNIT
°C/W
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state condition is 110 °C/W.
S16-1004-Rev. A, 30-May-16
Document Number: 79034
1
For technical questions, contact:
pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
2.
2.
05
m
m
m
G
1
G
2
N-Channel MOSFET
S
1
N-Channel MOSFET
S
2

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1373  268  2497  732  1974  3  11  59  30  4 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved