PMPB14XP
3 July 2018
12 V, P-channel Trench MOSFET
Product data sheet
1. General description
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power
DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench
MOSFET technology.
2. Features and benefits
•
•
•
•
•
Low threshold voltage
Trench MOSFET technology
Side wettable flanks for optical solder inspection
Small and leadless ultra thin SMD plastic package: 2 x 2 x 0.65 mm
Exposed drain pad for excellent thermal conduction
3. Applications
•
•
•
•
Charging switch for portable devices
DC-to-DC converters
Power management in battery-driven portable devices
Hard disk and computing power management
4. Quick reference data
Table 1. Quick reference data
Symbol
V
DS
V
GS
I
D
R
DSon
[1]
Parameter
drain-source voltage
gate-source voltage
drain current
drain-source on-state
resistance
Conditions
T
j
= 25 °C
V
GS
= -4.5 V; T
amb
= 25 °C; t ≤ 5 s
V
GS
= -4.5 V; I
D
= -8.6 A; T
j
= 25 °C
[1]
Min
-
-8
-
-
Typ
-
-
-
14
Max
-12
8
-12.7
19
2
Unit
V
V
A
mΩ
Static characteristics
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for drain 6 cm .
Nexperia
PMPB14XP
12 V, P-channel Trench MOSFET
5. Pinning information
Table 2. Pinning information
Pin
1
2
3
4
5
6
7
8
Symbol Description
D
D
G
S
D
D
D
S
drain
drain
gate
source
drain
drain
drain
source
Simplified outline
1
2
3
7
6
5
4
G
S
017aaa094
Graphic symbol
D
8
Transparent top view
DFN2020MD-6 (SOT1220)
6. Ordering information
Table 3. Ordering information
Type number
PMPB14XP
Package
Name
Description
Version
DFN2020MD-6 DFN2020MD-6: plastic thermal enhanced ultra thin small outline SOT1220
package; no leads; 6 terminals
7. Marking
Table 4. Marking codes
Type number
PMPB14XP
Marking code
5B
PMPB14XP
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2018. All rights reserved
Product data sheet
3 July 2018
2 / 15
Nexperia
PMPB14XP
12 V, P-channel Trench MOSFET
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
DS
V
GS
I
D
Parameter
drain-source voltage
gate-source voltage
drain current
V
GS
= -4.5 V; T
amb
= 25 °C; t ≤ 5 s
V
GS
= -4.5 V; T
amb
= 25 °C
V
GS
= -4.5 V; T
amb
= 100 °C
I
DM
P
tot
peak drain current
total power dissipation
T
amb
= 25 °C; single pulse; t
p
≤ 10 µs
T
amb
= 25 °C
T
amb
= 25 °C; t ≤ 5 s
T
sp
= 25 °C
T
j
T
amb
T
stg
I
S
[1]
Conditions
T
j
= 25 °C
[1]
[1]
[1]
[1]
[1]
Min
-
-8
-
-
-
-
-
-
-
-55
-55
-65
Max
-12
8
-12.7
-8.6
-5.4
-35
1.8
3.9
15.6
150
150
150
-1.6
2
Unit
V
V
A
A
A
A
W
W
W
°C
°C
°C
A
junction temperature
ambient temperature
storage temperature
source current
T
amb
= 25 °C
[1]
Source-drain diode
-
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for drain 6 cm .
120
P
der
(%)
80
017aaa123
120
I
der
(%)
80
017aaa124
40
40
0
- 75
- 25
25
75
125
T
j
(°C)
175
0
- 75
- 25
25
75
125
T
j
(°C)
175
Fig. 1.
Normalized total power dissipation as a
function of junction temperature
Fig. 2.
Normalized continuous drain current as a
function of junction temperature
PMPB14XP
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2018. All rights reserved
Product data sheet
3 July 2018
3 / 15
Nexperia
PMPB14XP
12 V, P-channel Trench MOSFET
-10
2
I
D
(A)
-10
Limit R
DSon
= V
DS
/I
D
t
p
= 10 µs
100 µs
1 ms
-1
10 ms
DC; T
sp
= 25 °C
DC; T
amb
= 25 °C;
drain mounting pad 6 cm
2
100 ms
aaa-028623
-10
-1
-10
-2
-10
-1
-1
-10
V
DS
(V)
-10
2
Fig. 3.
Safe operating area; junction to ambient; continuous and peak drain currents as a function of drain-
source voltage
PMPB14XP
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2018. All rights reserved
Product data sheet
3 July 2018
4 / 15
Nexperia
PMPB14XP
12 V, P-channel Trench MOSFET
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
R
th(j-a)
Parameter
thermal resistance
from junction to
ambient
thermal resistance
from junction to solder
point
Conditions
in free air
in free air; t ≤ 5 s
[1]
[2]
[2]
Min
-
-
-
-
Typ
226
60
27
4
Max
260
70
32
8
Unit
K/W
K/W
K/W
K/W
R
th(j-sp)
[1]
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
2
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm .
10
3
Z
th(j-a)
(K/W)
10
2
aaa-028626
duty cycle = 1
0.75
0.33
0.20
0.50
0.25
0.10
10
0.05
0.01
0.02
0
1
10
-3
10
-2
10
-1
1
10
10
2
t
p
(s)
10
3
FR4 PCB, standard footprint
Fig. 4.
10
2
duty cycle = 1
Z
th(j-a)
(K/W)
0.75
0.50
0.33
0.20
10
0.05
0.01
0
0.10
0.02
0.25
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
aaa-028627
1
10
-3
10
-2
10
-1
2
1
10
10
2
t
p
(s)
10
3
FR4 PCB, mounting pad for drain 6 cm
Fig. 5.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMPB14XP
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2018. All rights reserved
Product data sheet
3 July 2018
5 / 15
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