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- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
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© Nexperia B.V. (year). All rights reserved.
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PZUxBA series
Single Zener diodes
Rev. 01 — 19 September 2008
Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in a SOD323 (SC-76) very small Surface-Mounted
Device (SMD) plastic package.
1.2 Features
I
Non-repetitive peak reverse power
dissipation: P
ZSM
≤
40 W
I
Total power dissipation: P
tot
≤
320 mW
I
Tolerance series:
B: approximately
±5
%;
B1, B2, B3: approximately
±2
%
I
Wide working voltage range:
nominal 2.4 V to 36 V (E24 range)
I
Low reverse current I
R
range
I
Small plastic package suitable for
surface-mounted design
I
AEC-Q101 qualified
1.3 Applications
I
General regulation functions
1.4 Quick reference data
Table 1.
Symbol
V
F
P
ZSM
P
tot
[1]
[2]
[3]
Quick reference data
Parameter
forward voltage
non-repetitive peak reverse
power dissipation
total power dissipation
T
amb
≤
25
°C
Conditions
I
F
= 100 mA
[1]
[2]
Min
-
-
-
Typ
-
-
-
Max
1.1
40
320
Unit
V
W
mW
[3]
Pulse test: t
p
≤
300
µs; δ ≤
0.02.
t
p
= 100
µs;
square wave; T
j
= 25
°C
prior to surge
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
NXP Semiconductors
PZUxBA series
Single Zener diodes
2. Pinning information
Table 2.
Pin
1
2
Pinning
Description
cathode
anode
[1]
Simplified outline
1
2
Graphic symbol
1
2
006aaa152
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Package
Name
PZU2.4BA to
PZU36BA
[1]
PZU2.4BA/DG to
PZU36BA/DG
[1][2]
[1]
[2]
The series consists of 97 types with nominal working voltages from 2.4 V to 36 V.
/DG: halogen-free
Type number
Description
plastic surface-mounted package; 2 leads
Version
SOD323
SC-76
PZUXBA_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 19 September 2008
2 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
4. Marking
Table 4.
Marking codes
Marking code
B
PZU2.4*A
PZU2.7*A
PZU3.0*A
PZU3.3*A
PZU3.6*A
PZU3.9*A
PZU4.3*A
PZU4.7*A
PZU5.1*A
PZU5.6*A
PZU6.2*A
PZU6.8*A
PZU7.5*A
PZU8.2*A
PZU9.1*A
PZU10*A
PZU11*A
PZU12*A
PZU13*A
PZU14*A
PZU15*A
PZU16*A
PZU18*A
PZU20*A
PZU22*A
PZU24*A
PZU27*A
PZU30*A
PZU33*A
PZU36*A
[1]
Type number
[1]
Type number
[1]
B2
-
XB
XV
XY
MD
MG
MP
MU
MY
LH
LN
LT
LX
CS
CW
VC
VG
VM
VS
VU
VX
X2
X6
XE
XK
XP
-
-
-
-
B3
-
-
-
-
-
-
MR
MV
MZ
LK
LP
LU
LY
CT
CX
VD
VH
VN
VT
-
VY
X3
X7
XF
XL
XR
-
-
-
-
PZU2.4*A/DG
PZU2.7*A/DG
PZU3.0*A/DG
PZU3.3*A/DG
PZU3.6*A/DG
PZU3.9*A/DG
PZU4.3*A/DG
PZU4.7*A/DG
PZU5.1*A/DG
PZU5.6*A/DG
PZU6.2*A/DG
PZU6.8*A/DG
PZU7.5*A/DG
PZU8.2*A/DG
PZU9.1*A/DG
PZU10*A/DG
PZU11*A/DG
PZU12*A/DG
PZU13*A/DG
PZU14*A/DG
PZU15*A/DG
PZU16*A/DG
PZU18*A/DG
PZU20*A/DG
PZU22*A/DG
PZU24*A/DG
PZU27*A/DG
PZU30*A/DG
PZU33*A/DG
PZU36*A/DG
Marking code
B
Y8
Y9
YT
YW
YZ
NE
NM
NS
NW
RF
RL
RR
RV
RZ
EU
WA
WE
WK
WP
-
WV
WZ
Y4
YC
YG
YM
YS
NH
NK
NL
B1
-
YA
YU
YX
NC
NF
NN
NT
NX
RG
RM
RS
RW
ER
EV
WB
WF
WL
WR
-
WW
Y1
Y5
YD
YH
YN
-
-
-
-
B2
-
YB
YV
YY
ND
NG
NP
NU
NY
RH
RN
RT
RX
ES
EW
WC
WG
WM
WS
WU
WX
Y2
Y6
YE
YK
YP
-
-
-
-
B3
-
-
-
-
-
-
NR
NV
NZ
RK
RP
RU
RY
ET
EX
WD
WH
WN
WT
-
WY
Y3
Y7
YF
YL
YR
-
-
-
-
B1
-
XA
XU
XX
MC
MF
MN
MT
MX
LG
LM
LS
LW
CR
CV
VB
VF
VL
VR
-
VW
X1
X5
XD
XH
XN
-
-
-
-
X8
X9
XT
XW
XZ
ME
MM
MS
MW
LF
LL
LR
LV
LZ
CU
VA
VE
VK
VP
-
VV
VZ
X4
XC
XG
XM
XS
MH
MK
ML
* = B: tolerance series B, approximately
±5
%
* = B1, B2, B3: tolerance series B1, B2, B3: approximately
±2
%
PZUXBA_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 19 September 2008
3 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
I
F
I
ZSM
Parameter
forward current
non-repetitive peak reverse
current
non-repetitive peak reverse
power dissipation
total power dissipation
junction temperature
ambient temperature
storage temperature
t
p
= 100
µs;
square wave; T
j
= 25
°C
prior to surge
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
[1]
Conditions
Min
-
-
Max
200
see
Table 8
and
9
40
320
490
150
+150
+150
Unit
mA
P
ZSM
P
tot
T
j
T
amb
T
stg
[1]
[2]
[3]
[1]
-
-
-
-
−55
−65
W
mW
mW
°C
°C
°C
T
amb
≤
25
°C
[2]
[3]
6. Thermal characteristics
Table 6.
Symbol
R
th(j-a)
R
th(j-sp)
[1]
[2]
[3]
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
Conditions
in free air
[1]
[2]
[3]
Min
-
-
-
Typ
-
-
-
Max
390
255
55
Unit
K/W
K/W
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
Soldering point of cathode tab.
7. Characteristics
Table 7.
Characteristics
T
j
= 25
°
C unless otherwise specified.
Symbol
V
F
Parameter
forward voltage
I
F
= 10 mA
I
F
= 100 mA
[1]
Pulse test: t
p
≤
300
µs; δ ≤
0.02.
Conditions
[1]
Min
-
-
Typ
-
-
Max
0.9
1.1
Unit
V
V
PZUXBA_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 19 September 2008
4 of 14
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