MMSZ5221B-MMSZ5259B
Technical Data
Data Sheet N0205, Rev. B
MMSZ5221B-MMSZ5259B
ZENER DIODES
Features
Planar Die Construction
500mW Power Dissipation
2.4V- 39V Standoff Voltage
5% Nominal Zener Voltage
Designed for Surface Mount Application
Plastic Material-UL Recognition Flammability
Classification 94V-O
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon
request
SOD-123
Circuit Diagram
Mechanical Data
Case: SOD-123, Molded Plastic
Terminals: Plated Leads Solderable per MIL-STD-202,
Method 208
Polarity: Cathode Band
Weight: 0.01 grams(approx)
Maximum Ratings
@T
A
=25°C unless otherwise specified
Characteristic
Power Dissipation
(Note 1)
Forward Voltage (Note 2) @ I
F
= 10mA
Typical Thermal resistance junction to Ambient Air
Operating Junction and Storage
Temperature Range
Symbol
P
D
V
F
R
θJA
T
J
,T
STG
Value
500
0.9
357
-55 to 150
Units
mW
V
°C/W
°C
Notes: 1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm
2
.
2. Tested with pulses, Tp≤1.0ms.
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MMSZ5221B-MMSZ5259B
Technical Data
Data Sheet N0205, Rev. B
Electrical Characteristics
@T
A
=25°C unless otherwise specified
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MMSZ5221B-MMSZ5259B
Technical Data
Data Sheet N0205, Rev. B
Ratings and Characteristics Curves
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MMSZ5221B-MMSZ5259B
Technical Data
Data Sheet N0205, Rev. B
Mechanical Dimensions SOD-123
Millimeters
MIN.
1.050
0.000
1.050
0.450
0.080
MAX.
1.250
0.100
1.150
0.650
0.150
Inches
MIN.
0.041
1
0.000
0.041
0.018
0.003
MAX.
0.049
0.004
0.045
0.026
0.006
SYMBOL
A
A1
A2
b
c
D
E
E1
L
L1
θ
1.500
1.700
2.600
2.800
3.550
3.850
0.500 REF.
0.250
0.450
0°
8°
0.059
0.067
0.102
0.110
0.140
0.152
0.020 REF.
0.010
0.018
0°
8°
Note: If date code is before 2016 year, please contact with factory about marking.
Ordering Information
Device
MMSZ5221B-
MMSZ5259B
Package
SOD-123
(Pb-Free)
Shipping
3000pcs / reel
Marking Diagram
For information on tape and reel specifications, including part
orientation and tape sizes, please refer to our tape and reel
packaging specification.
C1
= Marking code
Carrier Tape Specification SOD-123
SYMBOL
A
B
C
d
E
F
P
P0
P1
W
Millimeters
Min.
Max.
1.80
3.89
1.52
1.45
1.65
3.40
3.90
3.90
1.90
7.90
1.90
3.99
1.62
1.65
1.85
3.60
4.10
4.10
2.10
8.30
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MMSZ5221B-MMSZ5259B
Technical Data
Data Sheet N0205, Rev. B
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
- Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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