Datasheet> 器件分类 > 存储> 存储> MT41J512M4HX-15E:D

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MT41J512M4HX-15E:D: 产品描述IC DRAM 2G PARALLEL 78FBGA; 产品类别存储存储; 文件大小3MB，共212页; 制造商Micron Technology; 官网地址http://www.mdtic.com.tw/; 标准

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MT41J512M4HX-15E:D概述

IC DRAM 2G PARALLEL 78FBGA

MT41J512M4HX-15E:D规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	Micron Technology
零件包装代码	BGA
包装说明	TFBGA, BGA78,9X13,32
针数	78
Reach Compliance Code	compliant
ECCN代码	EAR99
访问模式	MULTI BANK PAGE BURST
最长访问时间	0.255 ns
其他特性	AUTO/SELF REFRESH
最大时钟频率 (fCLK)	667 MHz
I/O 类型	COMMON
交错的突发长度	8
JESD-30 代码	R-PBGA-B78
长度	11.5 mm
内存密度	2147483648 bit
内存集成电路类型	DDR DRAM
内存宽度	4
功能数量	1
端口数量	1
端子数量	78
字数	536870912 words
字数代码	512000000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度
组织	512MX4
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	TFBGA
封装等效代码	BGA78,9X13,32
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	1.5 V
认证状态	Not Qualified
刷新周期	8192
座面最大高度	1.2 mm
自我刷新	YES
连续突发长度	8
最大待机电流	0.012 A
最大压摆率	0.385 mA
最大供电电压 (Vsup)	1.575 V
最小供电电压 (Vsup)	1.425 V
标称供电电压 (Vsup)	1.5 V
表面贴装	YES
技术	CMOS
温度等级	OTHER
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	9 mm

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2Gb: x4, x8, x16 DDR3 SDRAM

Features

DDR3 SDRAM

MT41J512M4 – 64 Meg x 4 x 8 Banks

MT41J256M8 – 32 Meg x 8 x 8 Banks

MT41J128M16 – 16 Meg x 16 x 8 Banks

Features

•

= V

DDQ

= 1.5V ±0.075V

1.5V center-terminated push/pull I/O

Differential bidirectional data strobe

8n-bit prefetch architecture

Differential clock inputs (CK, CK#)

8 internal banks

Nominal and dynamic on-die termination (ODT)

for data, strobe, and mask signals

Programmable CAS READ latency (CL)

Posted CAS additive latency (AL)

Programmable CAS WRITE latency (CWL) based on

Fixed burst length (BL) of 8 and burst chop (BC) of 4

(via the mode register set [MRS])

Selectable BC4 or BL8 on-the-fly (OTF)

Self refresh mode

of 0°C to 95°C

– 64ms, 8192 cycle refresh at 0°C to 85°C

– 32ms, 8192 cycle refresh at 85°C to 95°C

Self refresh temperature (SRT)

Write leveling

Multipurpose register

Output driver calibration

Options

• Configuration

– 512 Meg x 4

– 256 Meg x 8

– 128 Meg x 16

• FBGA package (Pb-free) – x4, x8

– 78-ball (8mm x 10.5mm) Rev. H,M,J,K

– 78-ball (9mm x 11.5mm) Rev. D

• FBGA package (Pb-free) – x16

– 96-ball (9mm x 14mm) Rev. D

– 96-ball (8mm x 14mm) Rev. K

• Timing – cycle time

– 938ps @ CL = 14 (DDR3-2133)

– 1.071ns @ CL = 13 (DDR3-1866)

– 1.25ns @ CL = 11 (DDR3-1600)

– 1.5ns @ CL = 9 (DDR3-1333)

– 1.87ns @ CL = 7 (DDR3-1066)

• Operating temperature

– Commercial (0°C T

+95°C)

– Industrial (–40°C T

+95°C)

• Revision

Note:

Marking

512M4

256M8

128M16

-093

-107

-125

-15E

-187E

None

:D/:H/:J/:K/

•

1. Not all options listed can be combined to

define an offered product. Use the part

catalog search on

http://www.micron.com

for available offerings.

Table 1: Key Timing Parameters

Speed Grade

-093

1, 2, 3, 4

-107

1, 2, 3

-125

1, 2,

-15E

-187E

Notes:

Data Rate (MT/s)

2133

1866

1600

1333

1066

Target

RCD-

RP-CL

14-14-14

13-13-13

11-11-11

9-9-9

7-7-7

RCD

(ns)

CL (ns)

13.09

13.91

13.75

13.5

13.1

13.09

13.91

13.75

13.5

13.1

13.09

13.91

13.75

13.5

13.1

Backward compatible to 1066, CL = 7 (-187E).

Backward compatible to 1333, CL = 9 (-15E).

Backward compatible to 1600, CL = 11 (-125).

Backward compatible to 1866, CL = 13 (-107).

PDF: 09005aef826aaadc

2Gb_DDR3_SDRAM.pdf – Rev. P 2/12 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

2Gb: x4, x8, x16 DDR3 SDRAM

Features

Contents

State Diagram ................................................................................................................................................ 11

Functional Description ................................................................................................................................... 12

Industrial Temperature ............................................................................................................................... 12

General Notes ............................................................................................................................................ 12

Functional Block Diagrams ............................................................................................................................. 14

Ball Assignments and Descriptions ................................................................................................................. 16

Package Dimensions ....................................................................................................................................... 22

Electrical Specifications .................................................................................................................................. 26

Absolute Ratings ......................................................................................................................................... 26

Input/Output Capacitance .......................................................................................................................... 27

Thermal Characteristics .................................................................................................................................. 28

Electrical Specifications – I

Specifications and Conditions ............................................................................ 30

Electrical Characteristics – I

Specifications .................................................................................................. 41

Electrical Specifications – DC and AC .............................................................................................................. 45

DC Operating Conditions ........................................................................................................................... 45

Input Operating Conditions ........................................................................................................................ 45

AC Overshoot/Undershoot Specification ..................................................................................................... 48

Slew Rate Definitions for Single-Ended Input Signals ................................................................................... 52

Slew Rate Definitions for Differential Input Signals ...................................................................................... 54

ODT Characteristics ....................................................................................................................................... 55

ODT Resistors ............................................................................................................................................ 56

ODT Sensitivity .......................................................................................................................................... 57

ODT Timing Definitions ............................................................................................................................. 57

Output Driver Impedance ............................................................................................................................... 61

34 Ohm Output Driver Impedance .............................................................................................................. 62

34 Ohm Driver ............................................................................................................................................ 63

34 Ohm Output Driver Sensitivity ................................................................................................................ 64

Alternative 40 Ohm Driver .......................................................................................................................... 65

40 Ohm Output Driver Sensitivity ................................................................................................................ 65

Output Characteristics and Operating Conditions ............................................................................................ 67

Reference Output Load ............................................................................................................................... 69

Slew Rate Definitions for Single-Ended Output Signals ................................................................................. 70

Slew Rate Definitions for Differential Output Signals .................................................................................... 71

Speed Bin Tables ............................................................................................................................................ 72

Electrical Characteristics and AC Operating Conditions ................................................................................... 77

Command and Address Setup, Hold, and Derating ........................................................................................... 97

Data Setup, Hold, and Derating ...................................................................................................................... 105

Commands – Truth Tables ............................................................................................................................. 114

Commands ................................................................................................................................................... 117

DESELECT ................................................................................................................................................ 117

NO OPERATION ........................................................................................................................................ 117

ZQ CALIBRATION LONG ........................................................................................................................... 117

ZQ CALIBRATION SHORT .......................................................................................................................... 117

ACTIVATE ................................................................................................................................................. 117

READ ........................................................................................................................................................ 117

WRITE ...................................................................................................................................................... 118

PRECHARGE ............................................................................................................................................. 119

REFRESH .................................................................................................................................................. 119

SELF REFRESH .......................................................................................................................................... 120

DLL Disable Mode ..................................................................................................................................... 121

PDF: 09005aef826aaadc

2Gb_DDR3_SDRAM.pdf – Rev. P 2/12 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

2Gb: x4, x8, x16 DDR3 SDRAM

Features

Input Clock Frequency Change ...................................................................................................................... 125

Write Leveling ............................................................................................................................................... 127

Write Leveling Procedure ........................................................................................................................... 129

Write Leveling Mode Exit Procedure ........................................................................................................... 131

Initialization ................................................................................................................................................. 132

Mode Registers .............................................................................................................................................. 134

Mode Register 0 (MR0) ................................................................................................................................... 135

Burst Length ............................................................................................................................................. 135

Burst Type ................................................................................................................................................. 136

DLL RESET ................................................................................................................................................ 137

Write Recovery .......................................................................................................................................... 137

Precharge Power-Down (Precharge PD) ...................................................................................................... 138

CAS Latency (CL) ....................................................................................................................................... 138

Mode Register 1 (MR1) ................................................................................................................................... 139

DLL ENABLE/DISABLE .............................................................................................................................. 139

Output Drive Strength ............................................................................................................................... 140

OUTPUT ENABLE/DISABLE ...................................................................................................................... 140

TDQS ENABLE .......................................................................................................................................... 140

On-Die Termination (ODT) ........................................................................................................................ 141

WRITE LEVELING ..................................................................................................................................... 141

Posted CAS Additive Latency (AL) ............................................................................................................... 141

Mode Register 2 (MR2) ................................................................................................................................... 143

CAS WRITE Latency (CWL) ........................................................................................................................ 143

AUTO SELF REFRESH (ASR) ....................................................................................................................... 144

SELF REFRESH TEMPERATURE (SRT) ........................................................................................................ 144

SRT versus ASR .......................................................................................................................................... 145

Dynamic On-Die Termination (ODT) ......................................................................................................... 145

Mode Register 3 (MR3) ................................................................................................................................... 146

MULTIPURPOSE REGISTER (MPR) ............................................................................................................ 146

MPR Functional Description ...................................................................................................................... 147

MPR Address Definitions and Bursting Order .............................................................................................. 148

MPR Read Predefined Pattern .................................................................................................................... 153

MODE REGISTER SET (MRS) Command ........................................................................................................ 153

ZQ CALIBRATION Operation ......................................................................................................................... 154

ACTIVATE Operation ..................................................................................................................................... 155

READ Operation ............................................................................................................................................ 157

WRITE Operation .......................................................................................................................................... 168

DQ Input Timing ....................................................................................................................................... 176

PRECHARGE Operation ................................................................................................................................. 178

SELF REFRESH Operation .............................................................................................................................. 178

Extended Temperature Usage ........................................................................................................................ 180

Power-Down Mode ........................................................................................................................................ 181

RESET Operation ........................................................................................................................................... 189

On-Die Termination (ODT) ............................................................................................................................ 191

Functional Representation of ODT ............................................................................................................. 191

Nominal ODT ............................................................................................................................................ 191

Dynamic ODT ............................................................................................................................................... 193

Dynamic ODT Special Use Case ................................................................................................................. 193

Functional Description .............................................................................................................................. 193

Synchronous ODT Mode ................................................................................................................................ 199

ODT Latency and Posted ODT .................................................................................................................... 199

Timing Parameters .................................................................................................................................... 199

PDF: 09005aef826aaadc

2Gb_DDR3_SDRAM.pdf – Rev. P 2/12 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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