Metal-Oxide Varistors
(MOVs)
Surface Mount Multilayer Varistors (MLVs) > MHS Series
MHS Varistor Series
Description
RoHS
The Multilayer High–Speed MHS Series is a very-low
capacitance extension to the Littelfuse ML family of
transient voltage surge suppression devices available in an
0402 and 0603–size surface mount chip.
The MHS Series provides protection from ESD and EFT in
high–speed data line and other high frequency applications.
The low capacitance of the MHS Series permits usage
in analog or digital circuits where it will not attenuate or
distort the desired signal or data.
Their small size is ideal for high–density printed circuit
boards, being typically applied to protect intergrated
circuits and other sensitive components. They are
particularly well suited to suppress ESD events including
those specified in IEC 61000-4-2 or other standards used
for Electromagnetic Compliance (EMC) testing.
The MHS Series is manufactured from semiconducting
ceramics and is supplied in a leadless, surface mount
package. The MHS Series is also compatible with modern
reflow and wave soldering prcesses.
Littelfuse Inc. manufactures other multilayer varistor series
products, see the ML, MLE, MLN and AUML Series data
sheets.
Datasheet
Size Table
Metric
1005
1608
EIA
0402
0603
Additional Information
Resources
Samples
Applications
•
•
•
•
Data, Diagnostic
I/O Ports
Universal Serial
Bus (USB)
Video & Audio Ports
Portable/Hand-
Held Products
•
•
•
Mobile
Communications
Computer/DSP
Products
Industrial Instruments
Including Medical
Features
•
•
Halogen-Free and
RoHS compliant
3pF 12pF and 22pF
,
,
capacitance versions
suitable for high–speed
data rate lines
ESD rated to IEC
61000-4-2 (Level 4)
•
•
•
•
EFT/B rated to IEC
61000-4-4 (Level 4)
Low leakage currents
-55ºC to +125ºC
operating temp. range
Inherently bi-directional
•
Absolute Maximum Ratings
• For ratings of individual members of a series, see device ratings and specifications table.
Continuous
Steady State Applied Voltage:
DC Voltage Range (V
M(DC)
) :
V0402/0603MHS03
V0402/0603MHS12
V0402/0603MHS22
Operating Ambient Temperature Range (T
A
)
Storage Temperature Range (T
STG
)
MHS Series
≤ 42
≤ 18
≤ 09
-55 to +125
-55 to +150
Units
V
V
V
O
C
C
O
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Metal-Oxide Varistors
(MOVs)
Device Ratings and Specifications
Performance Specifications (25 ºC)
Maximum
Clamping
Voltage At
1A (8X20µs)
(V
c
)
V0402MHS03N
V0603MHS03N
V0402MHS12N
(Note 5)
Part
Number
Maximum ESD Clamp
Voltage
(Note 1)
8kV Contact
(Note 2)
Clamp
(V)
<300
<300
<300
<300
<125
<125
<125
<125
<125
<125
<65
<65
15kV AIR
(Note 3)
Clamp
(V)
<400
<400
<400
<400
<160
<160
<160
<160
<160
<160
<100
<100
Typical
Typical Leakage
Typical
Inductance
Current at Specified Capacitance at
(from Impedance
DC Voltage
1MHz (1V p-p)
Analysis)
3.5V
5.5V
C
(Note 4)
L
MIN
MAX
P
I
L
(µA)
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
(µA)
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.00
(pF)
2
2
1
1
8
8
8
8
15
15
15
15
(pF)
5
(nH)
<1.0
<1.0
<1.0
<1.0
<1.0
<1.0
<1.0
<1.0
<1.0
<1.0
<1.0
<1.0
135
135
135
135
55
55
55
55
30
30
30
30
V0402MHS03F
(Note 7)
(Note 5)
5
6
6
16
16
16
16
29
29
29
29
V0603MHS03F
(Note 7)
(Note 5)
V0402MHS12F
(Note 7)
V0603MHS12N
(Note 5)
V0603MHS12F
V0402MHS22F
V0603MHS22F
(Note 7)
V0402MHS22N
(Note 5)
(Note 7)
V0603MHS22N
(Note 5)
(Note 7)
NOTES:
1. Tested to IEC-61000-4-2 Human Body Model (HBM) discharge test circuit.
2. Direct discharge to device terminals (IEC preferred test method).
3. Corona discharge through air (represents actual ESD event).
4. Capacitance may be customized, contact your Littelfuse Sales Representative.
5. V0402MHSxxx (0402 size devices) available as "R" packaging option only. Example: V0402MHS03NR. See Packaging and Tape and Reel sections (last page) for additional information.
6. The typical capacitance rating is discrete component test result.
7 Items are lead free and antimony free, available as "R" packing option only.
.
Peak Current and Energy Derating Curve
For applications exceeding 125ºC ambient temperature, the peak surge
current and energy ratings must be reduced as shown below.
Standby Current at Normalized Varistor Voltage and
Temperature
1.2
NORMALIZED VARISTOR VOLTAGE (V)
1.0
0.8
0.6
0.4
0.2
0.0
125
O
25
O
85
O
100
PERCENT OF RATED VALUE
80
60
40
20
0
-55
0.0001
50
60
70
80
90
100
110
120
130 140 150
AMBIENT TEMPERATURE (
o
C)
0.001
0.01
CURRENT (mA)
0.1
1
Figure
FIGURE 1.
1
PEAK CURRENT AND ENERGY DERATING CURVE
Figure 2
FIGURE 2. STANDBY CURRENT AT NORMALIZED VARISTOR
VOLTAGE AND TEMPERATURE
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at
www.littelfuse.com/disclaimer-electronics.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors
(MOVs)
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Nominal Voltage Stability to Multiple ESD Impulses
(8kV Contact Discharges per IEC 61000-4-2)
60
NOMINAL VOLTAGE AT 1mADC
V0402MHS03
V0603MHS03
Insertion Loss (S21) Characteristics
0
50
INSERTION LOSS (dB)
40
-10
V0402MHS12
V0603MHS12
V0402MHS03
V0603MHS03
30
V0402MHS12
V0603MHS12
20
V0402MHS22
V0603MHS22
-20
V0402MHS22
V0603MHS22
10
0
-30
10
Figure 3
1
10
100
1000
FREQUENCY (MHz)
10000
100
1000
10000
Number of Pulses
Figure 4
FIGURE 4. INSERTION LOSS (S21) CHARACTERISTICS
Device Characteristics
FIGURE 3. NOMINAL VOLTAGE STABILITY TO MULTIPLE
ESD IMPULSES (8KV CONTACT DISCHARGES
PER IEC 61000-4-2)
Speed of Response
The Multilayer Suppressor is a leadless device. Its response
time is not limited by the parasitic lead inductances found
in other surface mount packages. The response time of the
Z
N
O dielectric material is less than 1ns and the MLE can
clamp very fast dV/dT events such as ESD. Additionally,
in “real world” applications, the associated circuit wiring
is often the greatest factor effecting speed of response.
Therefore, transient suppressor placement within a circuit
can be considered important in certain instances.
Multilayer Internal Construction
FIRED CERAMIC
DIELECTRIC
At low current levels, the V-I curve of the multilayer
transient voltage suppressor approaches a linear (ohmic)
relationship and shows a temperature dependent effect.
At or below the maximum working voltage, the suppressor
is in a high resistance model (approaching 10
6
Ω at its
maximum rated working voltage). Leakage currents at
maximum rated voltage are below 100µA, typically 25µA;
for 0402 size below 20µA, typically 5µA.
Typical Temperature Dependance of the Characteristic
Curve in the Leakage Region
100%
SUPPRESSOR VOLTAGE IN PERCENT OF
T
V
NOM
VALUE A 25
o
C (%)
METAL
ELECTRODES
METAL END
TERMINATION
DEPLETION
10%
1E
-9
25
1E
-8
o
50
o
75
o
1E
-7
100
o
125
o
C
1E
-6
1E
-5
1E
-4
1E
-3
1E
-2
REGION
DEPLETION
Figure 5
SUPPRESSOR CURRENT (A
DC
)
Figure 6
REGION
GRAINS
FIGURE 10. TYPICAL TEMPERATURE DEPENDANCE OF THE CHARACTERISTIC
CURVE IN THE LEAKAGE REGION
FIGURE 11. MULTILA
YER INTERNAL CONSTRUCTION
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
The recommended solder for the MHS suppressor is
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder flux.
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
Figure 7
5.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Reflow Solder Profile
230
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Metal-Oxide Varistors
(MOVs)
230
230
Lead–free (Pb-free) Soldering Recommendations
When using a reflow process, care should be taken to
ensure that the MHS chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50ºC before cleaning.
Littelfuse offers the Nickel Barrier Termination finish for the
optimum Lead–free solder performance.
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free wave
soldering, the Wave Solder Profile still applies.
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
Product Dimensions (mm)
PAD LAYOUT DEMENSIONS
CHIP LAYOUT DIMENSIONS
E
Wave Solder Profile
5.
5.
Figure 8
6.
6.
Lead–free Re-flow Profile
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 260˚C
MAXIMUM TEMPERATURE5˚C
20 - 40 SECONDS WITHIN 5˚C
RAMP RATE
<3˚C/s
RAMP RATE
60 - 150 SEC
<3˚C/s
> 217˚C
60 - 150 SEC
> 217˚C
PREHEAT ZONE
PREHEAT ZONE
Figure 10
5.0
5.0
6.0
6.0
7.0
7.0
FIGURE 7. LEAD-FREE RE-FLOW PROFILE
FIGURE 7. LEAD-FREE RE-FLOW PROFILE
D
L
W
Note: Avoid metal runs in this area, parts are
Note: Avoid metal runs in
use in applications using
not recommended for
this area, parts are not
recommended for use in applications using silver
Silver (Ag) epoxy paste.
(Ag) expoxy paste.
Dimension
A
0402 Size
IN
0.067
0.020
0.024
0.024
0.01 +/- 0.006
0603 Size
MM
1.700
0.510
0.610
0.600
IN
0.100
0.030
0.035
0.040
MM
2.540
0.760
0.890
1.000
0.4 +/- 0.2
TABLE 1: PAD LAYOUT DIMENSIONS
DIMENSION
mm
0402
0603
1.70
2.54
A
in
0.067
0.100
mm
0.510
0.760
B
in
0.020
0.030
mm
0.610
0.890
C
in
0.024
0.035
B
C
D
(max.)
E
L
W
0.25 +/- 0.15 0.015 +/- 0.008
0.039 +/- 0.004 1.00 +/- 0.10 0.063 +/- 0.006 1.6 +/- 0.15
0.020 +/- 0.004 0.50 +/- 0.10 0.032 +/- 0.006 0.8 +/- 0.15
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-Oxide Varistors
(MOVs)
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Part Numbering System
V 0402 MHS 03 N R
DEVICE FAMILY
Littelfuse TVSS Device
DEVICE SIZE
0402 = .04 inch x .02 inch
(1.0 mm x 0.5 mm)
0603 = .063 inch x .031 inch
(1.6 mm x 0.8 mm)
PACKING OPTIONS
(See quantities in Packaging section)
T = (0603 device only)13in (330mm) Diameter Reel, Plastic Carrier Tape
H = (0603 device only) 7in (178mm) Diameter Reel, Plastic Carrier Tape
R = (available for 0402 and 0603 devices) 7in (178mm) Diameter Reel, Paper Carrier Tape
END TERMINATION OPTION
Nickel Barrier(Ni/Sn)
N letter: lead free
F letter: lead free and antimony free
CAPACITANCE DESIGNATION
03 = 3pF
12 = 12pF
22 = 22pF
SERIES DESIGNATOR
MHS = Multilayer Hi-Speed
Packaging*
Quantity
Device Size
0603
0402
13 Inch Reel
("T" Option)
10,000
not available
7 Inch Reel
("H" Option)
2,500
not available
7 Inch Reel
("R" Option)
4,000
10,000
*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.
Tape and Reel Specifications
T
D
0
P
0
P
2
E
F
K
0
B
0
W
T
1
D
1
P
1
A
0
Symbol
A
0
B
0
K
0
W
F
E
P
1
P
2
P
0
D
0
D
1
T
1
T
Width of Cavity
Length of Cavity
Depth of Cavity
Width of Tape
Description
Dimensions in Millimeters
0402 Size
0603 Size
Dependent on Chip Size to Minimize Rotation.
Dependent on Chip Size to Minimize Rotation.
Dependent on Chip Size to Minimize Rotation.
8 -/+ 0.2
3.5 -/+.05
1.75 -/+ 0.1
2 -/+ 0.05
2 -/+ 0.1
4 -/+ 0.1
1.55 -/+ 0.05
N/A
0.1 Max
1.1
8 -/+ 0.3
3.5 -/+.05
1.75 -/+ 0.1
4 -/+ 0.1
2 -/+ 0.1
4 -/+ 0.1
1.55 -/+ 0.05
1.05 -/+ 0.05
0.1 Max
1.1
Distance Between Drive Hole Centers and Cavity Centers
Distance Between Drive Hole Centers and Tape Edge
Distance Between Cavity Centers
Axial Drive Distance Between Drive Hole Centers & Cavity Centers
Axial Drive Distance Between Drive Hole Centers
Drive Hole Diameter
Diameter of Cavity Piercing
Top Tape Thickness
Nominal Carrier Tape Thickness
Notes:
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
