®
TVS Diode Arrays
(SPA
®
Diodes)
Low Capacitance ESD Protection - SP3130 Series
AQ3130Series
AQ3130 Series 0.3pF 10KV Bidirectional Discrete TVS
Description
RoHS
Pb
GREEN
The AQ3130 includes back-to-back TVS diodes fabricated
in a proprietary silicon avalanche technology to provide
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes up to the
maximum level specified in IEC 61000-4-2 international
standard without performance degradation. The back-to
back configuration provides symmetrical ESD protection for
data lines.
Pinout
SOD882
Features
• ESD protection of ±10kV
contact discharge, ±15kV
air discharge, (IEC 61000-
4-2)
• EFT protection,
IEC 61000-4-4, 40A
(tp=5/50ns)
• Lightning Protection, IEC
61000-4-5 2
nd
edition, 2A
(t
p
=8/20µs)
• Low capacitance of 0.3pF
@ V
R
=0V
• Low leakage current of
50nA (max) at 28V
• Space efficient 0402
footprint
• AEC-Q101 qualified
• Halogen free, lead free and
RoHS compliant
• Moisture Sensitivity
Level(MSL -1)
1
2
Functional Block Diagram
Applications
• Tablets
• Ultrabook
• eReader
• Smart Phones
• Digital Cameras
• MP3/ PMP
• Set Top Boxes
• Portable Medical
• NFC and FeliCa
• Automotive Applications
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 11/09/17
®
TVS Diode Arrays
(SPA
®
Diodes)
AQ3130Series
Low Capacitance ESD Protection - SP3130 Series
Absolute Maximum Ratings
Symbol
I
PP
T
OP
T
STOR
Parameter
Peak Current (t
p
=8/20μs)
Operating Temperature
Storage Temperature
Value
2.0
-40 to 150
-55 to 150
Units
A
°C
°C
Thermal Information
Parameter
Maximum Lead Temperature
(Soldering 20-40s)
Rating
260
Units
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the component. This is a stress only rating and operation of the
component at these or any other conditions above those indicated in the operational
sections of this specification is not implied.
Electrical Characteristics
(T
OP
=25ºC)
Parameter
Reverse Standoff Voltage
Reverse Leakage Current
Clamp Voltage
1
Symbol
V
RWM
I
LEAK
V
C
V
ESD
R
DYN
C
I/O-I/O
V
R
=28V with 1pin at GND
I
PP
=1A, t
p
=8/20µs, Fwd
I
PP
=2A, t
p
=8/20µs, Fwd
IEC 61000-4-2 (Contact)
IEC 61000-4-2 (Air)
TLP t
P
=100ns, I/O to GND
,
Reverse Bias=0V, f=1 MHz
±10
±15
1.0
0.3
0.45
1
39
42
Test Conditions
Min
Typ
Max
28
50
44
48
Units
V
nA
V
V
kV
kV
Ω
pF
ESD Withstand Voltage
1
Dynamic Resistance
2
Diode Capacitance
1
Note: 1. Parameter is guaranteed by design and/or component characterization.
2 Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns
8/20μs Pulse Waveform
110%
100%
90%
Capacitance vs. Reverse Bias
0.5
0.4
0.3
0.2
0.1
70%
60%
50%
40%
30%
20%
10%
0%
0.0
5.0
10.0
15.0
20.0
25.0
30.0
Capacitance (pF)
Time ( s)
80%
Percent of I
PP
0
0
4
8
12
16
Bias Voltage (V)
20
24
28
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 11/09/17
®
TVS Diode Arrays
(SPA
®
Diodes)
AQ3130Series
Low Capacitance ESD Protection - SP3130 Series
Transmission Line Pulsing (TLP) Plot
20
18
16
Insertion Loss (S21)
0
-1
-2
-3
TLP Current (A)
14
Attenuation (dB)
0
5
10
15
20
25
30
35
40 45
50
55 60
12
10
8
6
4
2
0
-4
-5
-6
-7
-8
-9
-10
10
100
Frequency (MHz)
1000
TLP Voltage (V)
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus) Temp (T
L
)
to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
Pb – Free assembly
150°C
Temperature
T
P
T
L
T
S(max)
Preheat
Ramp-up
t
P
Critical Zone
T
L
to T
P
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260
+0/-5
°C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
t
L
Ramp-do
Ramp-down
T
S(min)
t
S
time to peak temperature
25
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
Time
Product Characteristics
Lead Plating
Lead Material
Substrate material
Body Material
Flammability
Pre-Plated Frame
Copper Alloy
Silicon
Molded Epoxy
UL Recognized epoxy meeting
flammability rating V-0.
Part Numbering System
AQ 3130 01 E T G
–
Automotive Grade
TVS Diode Arrays
(SPA
®
Diodes)
Series
G= Green
T= Tape & Reel
Package
E: SOD882
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Part Marking System
Number of Channels
-01 = 1 Channel
T
Ordering Information
Part Number
AQ3130-01ETG
Package
SOD882
Marking
T
Min. Order Qty.
10000
Packaging Option
Tape & Reel – 8mm tape/7” reel
P0/P1
4mm/2mm
Packaging Specification
EIA RS-481
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 11/09/17
®
TVS Diode Arrays
(SPA
®
Diodes)
Low Capacitance ESD Protection - SP3130 Series
AQ3130Series
Package Dimensions — SOD882
A
E
Package
Symbol
B
F
SOD882
MO-236
Inches
Min
0.035
0.020
0.016
0.000
0.008
0.018
Max
0.043
0.028
0.024
0.002
0.014
0.022
Max
1.10
0.70
0.60
0.05
0.35
0.55
JEDEC
Millimeters
Min
0.90
0.50
0.40
0.00
0.20
0.45
Top View
e
Bottom View
A
B
C
C1
E
C
Side View
C1
0.325
0.325
F
e
0.650
0.65 BSC
0.026 BSC
0.650
0.975
Recommended Soldering Pad Layout (mm)
Embossed Carrier Tape & Reel Specification — SOD882
T
Top
Cover
Tape
P0
P2
Φ
2
:
1
.
55
±
0
.05
E
F
Tape Dimensions
Symbol
A0
B0
K0
Millimetres
Min
0.65
1.10
0.50
1.65
3.45
3.90
1.90
1.95
1.95
7
.90
Max
0.75
1.20
0.60
1.85
3.55
4.10
2.10
2.05
2.05
8.10
Reel Dimensions (Size
Φ178)
Symbol
M
N
W
W1
H
S
K
R
Millimetres
Min
177
.0
59.0
11.0
8.5
12.5
1.9
10.8
0.95
Max
179.0
61.0
12.0
9.5
13.5
2.1
11.2
1.05
3°
REF
W
A0
B0
K0
P1
Φ:
0
.
4
0
±0
.
05
E
F
P0
P1
P2
T
W
Reel Size 7 Inch
W1
S
R
M
N
K
H
W
Device Orientation in Tape
T
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at
http://www.littelfuse.com/disclaimer-electronics.
©2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 11/09/17
T
T
T
T
T
T
T
T
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
