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74AHC1G07GW-Q100H

产品描述IC BUF NON-INVERT 5.5V 5TSSOP
产品类别逻辑    逻辑   
文件大小689KB,共12页
制造商Nexperia
官网地址https://www.nexperia.com
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74AHC1G07GW-Q100H概述

IC BUF NON-INVERT 5.5V 5TSSOP

74AHC1G07GW-Q100H规格参数

参数名称属性值
Brand NameNexperia
厂商名称Nexperia
零件包装代码TSSOP
包装说明TSSOP,
针数5
制造商包装代码SOT353-1
Reach Compliance Codecompliant
Samacsys Description74AHC1G07-Q100 - Buffer with open-drain output@en-us
系列AHC/VHC/H/U/V
JESD-30 代码R-PDSO-G5
长度2.05 mm
逻辑集成电路类型BUFFER
功能数量1
输入次数1
端子数量5
最高工作温度125 °C
最低工作温度-40 °C
输出特性OPEN-DRAIN
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)NOT SPECIFIED
传播延迟(tpd)12.5 ns
筛选级别AEC-Q100
座面最大高度1.1 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度1.25 mm
Base Number Matches1

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74AHC1G07-Q100;
74AHCT1G07-Q100
Buffer with open-drain output
Rev. 2 — 18 November 2014
Product data sheet
1. General description
74AHC1G07-Q100 and 74AHCT1G07-Q100 are high-speed Si-gate CMOS devices.
They provide a non-inverting buffer.
The output of these devices is open-drain and can be connected to other open-drain
outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions. For
digital operation, this device must have a pull-up resistor to establish a logic HIGH-level.
The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V.
The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from
40 C
to +85
C
and from
40 C
to +125
C
High noise immunity
Low power dissipation
SOT353-1 and SOT753 package options
ESD protection:
MIL-STD-883, method 3015 exceeds 2000 V
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0
)
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74AHC1G07GW-Q100
74AHCT1G07GW-Q100
74AHC1G07GV-Q100
74AHCT1G07GV-Q100
40 C
to +125
C
40 C
to +125
C
Name
Description
Version
SOT353-1
SOT753
TSSOP5 plastic thin shrink small outline package;
5 leads; body width 1.25 mm
SC-74A
plastic surface-mounted package; 5 leads
Type number

74AHC1G07GW-Q100H相似产品对比

74AHC1G07GW-Q100H 74AHCT1G07GV-Q100 74AHCT1G07GW-Q100 74AHC1G07GV-Q100H
描述 IC BUF NON-INVERT 5.5V 5TSSOP Buffer, AHCT/VHCT/VT Series, 1-Func, 1-Input, CMOS, PDSO5 Buffer, AHCT/VHCT/VT Series, 1-Func, 1-Input, CMOS, PDSO5 IC BUFFER NON-INVERT 5.5V 5TSOP
厂商名称 Nexperia Nexperia Nexperia Nexperia
包装说明 TSSOP, TSOP, TSSOP, TSOP,
Reach Compliance Code compliant compliant compliant compliant
系列 AHC/VHC/H/U/V AHCT/VHCT/VT AHCT/VHCT/VT AHC/VHC/H/U/V
JESD-30 代码 R-PDSO-G5 R-PDSO-G5 R-PDSO-G5 R-PDSO-G5
长度 2.05 mm 2.9 mm 2.05 mm 2.9 mm
逻辑集成电路类型 BUFFER BUFFER BUFFER BUFFER
功能数量 1 1 1 1
输入次数 1 1 1 1
端子数量 5 5 5 5
最高工作温度 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
输出特性 OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP TSOP TSSOP TSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
传播延迟(tpd) 12.5 ns 9 ns 9 ns 12.5 ns
筛选级别 AEC-Q100 AEC-Q100 AEC-Q100 AEC-Q100
座面最大高度 1.1 mm 1.1 mm 1.1 mm 1.1 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2 V 4.5 V 4.5 V 2 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.95 mm 0.65 mm 0.95 mm
端子位置 DUAL DUAL DUAL DUAL
宽度 1.25 mm 1.5 mm 1.25 mm 1.5 mm
Base Number Matches 1 1 1 1

 
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