|
THS1401IPFB |
THS1408IPFB |
THS1403IPFB |
THS1401IPFBG4 |
THS1408QPHP |
| 描述 |
14-Bit, 1-MSPS Analog-to-Digital Converter (ADC) 48-TQFP -40 to 85 |
14-Bit, 8-MSPS Analog-to-Digital Converter (ADC) 48-TQFP -40 to 85 |
14-Bit, 3-MSPS Analog-to-Digital Converter (ADC) 48-TQFP -40 to 85 |
Analog to Digital Converters - ADC 14-Bit 1/3/8 MSPS DSP-Compatible ADC |
IC DIFF INPUT A/D 48-HTQFP 14BIT |
| 是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
含铅 |
| 是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
不符合 |
| 零件包装代码 |
QFP |
QFP |
QFP |
QFP |
QFP |
| 包装说明 |
TFQFP, TQFP48,.35SQ |
TFQFP, TQFP48,.35SQ |
TFQFP, TQFP48,.35SQ |
TFQFP, TQFP48,.35SQ |
HTFQFP, TQFP48,.35SQ |
| 针数 |
48 |
48 |
48 |
48 |
48 |
| Reach Compliance Code |
compli |
compli |
compli |
compli |
compliant |
| ECCN代码 |
3A991.C.3 |
3A991.C.3 |
3A991.C.3 |
EAR99 |
EAR99 |
| 最大模拟输入电压 |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
| 最小模拟输入电压 |
-3.3 V |
-3.3 V |
-3.3 V |
- |
- |
| 最长转换时间 |
1 µs |
0.125 µs |
0.333 µs |
1 µs |
0.125 µs |
| 转换器类型 |
ADC, PROPRIETARY METHOD |
ADC, PROPRIETARY METHOD |
ADC, PROPRIETARY METHOD |
ADC, PROPRIETARY METHOD |
ADC, PROPRIETARY METHOD |
| JESD-30 代码 |
S-PQFP-G48 |
S-PQFP-G48 |
S-PQFP-G48 |
S-PQFP-G48 |
S-PQFP-G48 |
| 长度 |
7 mm |
7 mm |
7 mm |
7 mm |
7 mm |
| 最大线性误差 (EL) |
0.0153% |
0.0305% |
0.0153% |
0.0153% |
0.0458% |
| 湿度敏感等级 |
2 |
2 |
2 |
2 |
2 |
| 模拟输入通道数量 |
1 |
1 |
1 |
1 |
1 |
| 位数 |
14 |
14 |
14 |
14 |
14 |
| 功能数量 |
1 |
1 |
1 |
1 |
1 |
| 端子数量 |
48 |
48 |
48 |
48 |
48 |
| 最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
125 °C |
| 最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| 输出位码 |
BINARY, 2'S COMPLEMENT BINARY |
BINARY, 2'S COMPLEMENT BINARY |
BINARY, 2'S COMPLEMENT BINARY |
BINARY, 2'S COMPLEMENT BINARY |
BINARY, 2'S COMPLEMENT BINARY |
| 输出格式 |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
TFQFP |
TFQFP |
TFQFP |
TFQFP |
HTFQFP |
| 封装等效代码 |
TQFP48,.35SQ |
TQFP48,.35SQ |
TQFP48,.35SQ |
TQFP48,.35SQ |
TQFP48,.35SQ |
| 封装形状 |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| 封装形式 |
FLATPACK, THIN PROFILE, FINE PITCH |
FLATPACK, THIN PROFILE, FINE PITCH |
FLATPACK, THIN PROFILE, FINE PITCH |
FLATPACK, THIN PROFILE, FINE PITCH |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
| 峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
220 |
| 电源 |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| 采样速率 |
1 MHz |
8 MHz |
3 MHz |
1 MHz |
8 MHz |
| 采样并保持/跟踪并保持 |
SAMPLE |
SAMPLE |
SAMPLE |
SAMPLE |
SAMPLE |
| 座面最大高度 |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
| 标称供电电压 |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
| 表面贴装 |
YES |
YES |
YES |
YES |
YES |
| 技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| 温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
AUTOMOTIVE |
| 端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
| 端子节距 |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
| 端子位置 |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
| 处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| 宽度 |
7 mm |
7 mm |
7 mm |
7 mm |
7 mm |
| Base Number Matches |
1 |
1 |
1 |
1 |
1 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
| Factory Lead Time |
1 week |
1 week |
1 week |
- |
- |
| JESD-609代码 |
e4 |
e4 |
e4 |
e4 |
- |
| 最大压摆率 |
90 mA |
90 mA |
90 mA |
- |
- |
| 端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |