IC MOSFET DRIVER N-CH 8-MSOP
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | MSOP |
| 包装说明 | HTSSOP, TSSOP8,.19 |
| 针数 | 8 |
| 制造商包装代码 | MS8E |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 高边驱动器 | YES |
| 接口集成电路类型 | HALF BRIDGE BASED MOSFET DRIVER |
| JESD-30 代码 | S-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 标称输出峰值电流 | 1.4 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HTSSOP |
| 封装等效代码 | TSSOP8,.19 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 6 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 | 13.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 6 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 断开时间 | 0.045 µs |
| 接通时间 | 0.06 µs |
| 宽度 | 3 mm |
| LTC4444IMS8E-5#TRPBF | LTC4444EMS8E-5#PBF | LTC4444HMS8E-5#TRPBF | LTC4444IMS8E-5#PBF | LTC4444MPMS8E-5#PBF | LTC4444MPMS8E-5#TRPBF | LTC4444HMS8E-5#PBF | LTC4444EMS8E-5#TRPBF | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC MOSFET DRIVER N-CH 8-MSOP | IC mosfet driver N-CH 8-msop | IC MOSFET DVR N-CH SYNC HV 8MSOP | IC MOSFET DRIVER N-CH 8-MSOP | IC MOSFET DVR N-CH SYNC 8-MSOP | IC MOSFET DVR N-CH SYNC 8-MSOP | IC MOSFET DVR N-CH SYNC HV 8MSOP | IC MOSFET DRIVER N-CH 8-MSOP |
| Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | MSOP | MSOP | MSOP | MSOP | MSOP | MSOP | MSOP | MSOP |
| 包装说明 | HTSSOP, TSSOP8,.19 | HTSSOP, TSSOP8,.19 | HTSSOP, | HTSSOP, TSSOP8,.19 | HTSSOP, TSSOP8,.19 | HTSSOP, TSSOP8,.19 | HTSSOP, | HTSSOP, TSSOP8,.19 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 制造商包装代码 | MS8E | MS8E | MS8E | MS8E | MS8E | MS8E | MS8E | MS8E |
| Reach Compliance Code | compliant | compli | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 高边驱动器 | YES | YES | YES | YES | YES | YES | YES | YES |
| 接口集成电路类型 | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER |
| JESD-30 代码 | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HTSSOP | HTSSOP | HTSSOP | HTSSOP | HTSSOP | HTSSOP | HTSSOP | HTSSOP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | NOT SPECIFIED | 260 | 260 | 260 | NOT SPECIFIED | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 最大供电电压 | 13.5 V | 13.5 V | 13.5 V | 13.5 V | 13.5 V | 13.5 V | 13.5 V | 13.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | NOT SPECIFIED | 30 | 30 | 30 | NOT SPECIFIED | 30 |
| 断开时间 | 0.045 µs | 0.045 µs | 0.045 µs | 0.045 µs | 0.045 µs | 0.045 µs | 0.045 µs | 0.045 µs |
| 接通时间 | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 最高工作温度 | 125 °C | 85 °C | - | 125 °C | 125 °C | 125 °C | - | 85 °C |
| 标称输出峰值电流 | 1.4 A | 1.4 A | - | 1.4 A | 1.4 A | 1.4 A | - | 1.4 A |
| 封装等效代码 | TSSOP8,.19 | TSSOP8,.19 | - | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 | - | TSSOP8,.19 |
| 电源 | 6 V | 6 V | - | 6 V | 6 V | 6 V | - | 6 V |
| 温度等级 | AUTOMOTIVE | OTHER | - | AUTOMOTIVE | MILITARY | MILITARY | - | OTHER |
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