Datasheet> 器件分类 > 存储> 存储> MX25L12875FZ2I-10G

文档预览

MX25L12875FZ2I-10G: 产品描述Flash, 32MX4, PDSO8, 8 X 6 MM, 0.80 MM HEIGHT, 1.27 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, MO-220, WSON-8; 产品类别存储存储; 文件大小1MB，共102页; 制造商Macronix; 官网地址http://www.macronix.com/en-us/Pages/default.aspx; 标准

下载文档详细参数全文预览

MX25L12875FZ2I-10G概述

Flash, 32MX4, PDSO8, 8 X 6 MM, 0.80 MM HEIGHT, 1.27 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, MO-220, WSON-8

MX25L12875FZ2I-10G规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Macronix
零件包装代码	QFN
包装说明	HVSON,
针数	8
Reach Compliance Code	unknow
ECCN代码	EAR99
其他特性	CAN BE ORGNISED AS 128 MBIT X 1
备用内存宽度	2
最大时钟频率 (fCLK)	104 MHz
JESD-30 代码	R-PDSO-N8
JESD-609代码	e3
长度	8 mm
内存密度	134217728 bi
内存集成电路类型	FLASH
内存宽度	4
湿度敏感等级	3
功能数量	1
端子数量	8
字数	33554432 words
字数代码	32000000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	32MX4
封装主体材料	PLASTIC/EPOXY
封装代码	HVSON
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
并行/串行	SERIAL
峰值回流温度（摄氏度）	260
编程电压	3 V
座面最大高度	0.8 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	MATTE TIN (800)
端子形式	NO LEAD
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	40
宽度	6 mm

文档预览

下载PDF文档

全文
预览

MX25L12875F

DATASHEET

P/N: PM1855

MX25L12875F

Contents

1. FEATURES .............................................................................................................................................................. 4

2. GENERAL DESCRIPTION ..................................................................................................................................... 6

Table 1. Read performance Comparison ....................................................................................................6

3. PIN CONFIGURATIONS ......................................................................................................................................... 7

4. PIN DESCRIPTION .................................................................................................................................................. 7

5. BLOCK DIAGRAM................................................................................................................................................... 8

6. DATA PROTECTION................................................................................................................................................ 9

Table 2. Protected Area Sizes ...................................................................................................................10

Table 3. 4K-bit Secured OTP Definition

.................................................................................................... 11

7. Memory Organization ........................................................................................................................................... 12

Table 4. Memory Organization ..................................................................................................................12

8. DEVICE OPERATION ............................................................................................................................................ 13

8-1. Quad Peripheral Interface (QPI) Read Mode .......................................................................................... 15

9. COMMAND DESCRIPTION ................................................................................................................................... 16

9-1.

9-2.

9-3.

9-4.

9-5.

9-6.

9-7.

9-8.

9-9.

9-10.

9-11.

9-12.

9-13.

9-14.

9-15.

9-16.

9-17.

9-18.

9-19.

9-20.

9-21.

9-22.

9-23.

9-24.

9-25.

P/N: PM1855

Table 5. Command Set..............................................................................................................................16

Write Enable (WREN) .............................................................................................................................. 20

Write Disable (WRDI)............................................................................................................................... 21

Read Identification (RDID)

....................................................................................................................... 22

Release from Deep Power-down (RDP), Read Electronic Signature (RES) ........................................... 23

Read Electronic Manufacturer ID & Device ID (REMS) ........................................................................... 25

QPI ID Read (QPIID) ............................................................................................................................... 26

Table 6. ID Definitions

..............................................................................................................................26

Read Status Register (RDSR) ................................................................................................................. 27

Read Configuration Register (RDCR)

...................................................................................................... 28

Table 7. Configuration

Write Status Register (WRSR)................................................................................................................. 34

Table 8. Protection Modes.........................................................................................................................35

Read Data Bytes (READ) ........................................................................................................................ 38

Read Data Bytes at Higher Speed (FAST_READ) .................................................................................. 39

Dual Output Read Mode (DREAD) .......................................................................................................... 40

2 x I/O Read Mode (2READ) ................................................................................................................... 41

Quad Read Mode (QREAD) .................................................................................................................... 42

4 x I/O Read Mode (4READ) ................................................................................................................... 43

Burst Read ............................................................................................................................................... 45

Performance Enhance Mode ................................................................................................................... 46

Performance Enhance Mode Reset ........................................................................................................ 49

Fast Boot ................................................................................................................................................. 50

Sector Erase (SE) .................................................................................................................................... 53

Block Erase (BE32K) ............................................................................................................................... 54

Block Erase (BE) ..................................................................................................................................... 55

Chip Erase (CE) ....................................................................................................................................... 56

Page Program (PP) ................................................................................................................................. 57

4 x I/O Page Program (4PP) .................................................................................................................... 59

REV. 1.1, OCT. 31, 2013

MX25L12875F

Deep Power-down (DP) ........................................................................................................................... 60

Enter Secured OTP (ENSO) .................................................................................................................... 61

Exit Secured OTP (EXSO) ....................................................................................................................... 61

Read Security Register (RDSCUR) ......................................................................................................... 61

Write Security Register (WRSCUR)......................................................................................................... 61

Table 9. Security Register Definition

.........................................................................................................62

9-31. Write Protection Selection (WPSEL)........................................................................................................ 63

9-32. Advanced Sector Protection .................................................................................................................... 65

9-33. Password Protection Mode ...................................................................................................................... 72

9-34. Program/Erase Suspend/Resume ........................................................................................................... 74

9-35. Erase Suspend ........................................................................................................................................ 74

9-36. Program Suspend .................................................................................................................................... 74

9-37. Write-Resume .......................................................................................................................................... 76

9-38. No Operation (NOP) ................................................................................................................................ 76

9-39. Software Reset (Reset-Enable (RSTEN) and Reset (RST)) ................................................................... 76

9-40. Read SFDP Mode (RDSFDP).................................................................................................................. 78

Table 10. Signature and Parameter Identification Data Values

................................................................79

Table 11. Parameter Table (0): JEDEC Flash Parameter Tables ..............................................................80

Table 12. Parameter Table (1): Macronix Flash Parameter Tables ...........................................................82

10. RESET.................................................................................................................................................................. 84

Table 13. Reset Timing-(Power On) ..........................................................................................................84

Table 14. Reset Timing-(Other Operation) ................................................................................................84

11. POWER-ON STATE ............................................................................................................................................. 85

12. ELECTRICAL SPECIFICATIONS ........................................................................................................................ 86

Table 15. ABSOLUTE MAXIMUM RATINGS ............................................................................................86

Table 16. CAPACITANCE TA = 25°C, f = 1.0 MHz ....................................................................................86

Table 17. DC CHARACTERISTICS .........................................................................................................88

Table 18. AC CHARACTERISTICS .........................................................................................................89

13. OPERATING CONDITIONS ................................................................................................................................. 91

Table 19. Power-Up/Down Voltage and Timing

.........................................................................................93

13-1. INITIAL DELIVERY STATE

...................................................................................................................... 93

14. ERASE AND PROGRAMMING PERFORMANCE .............................................................................................. 94

15. DATA RETENTION .............................................................................................................................................. 94

16. LATCH-UP CHARACTERISTICS ........................................................................................................................ 94

17. ORDERING INFORMATION ................................................................................................................................ 95

18. PART NAME DESCRIPTION ............................................................................................................................... 96

19. PACKAGE INFORMATION .................................................................................................................................. 97

20. REVISION HISTORY ......................................................................................................................................... 101

9-26.

9-27.

9-28.

9-29.

9-30.

P/N: PM1855

REV. 1.1, OCT. 31, 2013

MX25L12875FZ2I-10G

MX25L12875FZ2I-10G概述

MX25L12875FZ2I-10G规格参数

文档预览

推荐资源