IC ADC 8BIT LP 10-UMAX
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, TSSOP10,.19,20 |
| 针数 | 10 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 最大模拟输入电压 | 1.064 V |
| 最小模拟输入电压 | -1.064 V |
| 最长转换时间 | 35 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-PDSO-G10 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 最大线性误差 (EL) | 0.1953% |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 2 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 10 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP10,.19,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 采样并保持/跟踪并保持 | TRACK |
| 座面最大高度 | 1.1 mm |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3 mm |
| MAX1108EUB+T | MAX1109EUB+ | MAX1108CUB+T | AP99LT06GP-HF_14 | MAX1108EUB+TG07 | MAX1108EUB+G07 | MAX1109EUB+T | MAX1109CUB+ | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC ADC 8BIT LP 10-UMAX | analog to digital converters - adc 2ch single-supply low-P serial 8-bit | analog to digital converters - adc 2ch single-supply low-P serial 8-bit | Simple Drive Requirement | analog to digital converters - adc 2ch single-supply low-P serial 8-bit | analog to digital converters - adc 2ch single-supply low-P serial 8-bit | IC ADC 8BIT LP 10-UMAX | |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | - | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | SOIC | SOIC | SOIC | - | - | - | SOIC | SOIC |
| 包装说明 | TSSOP, TSSOP10,.19,20 | USOP, UMAX-10 | TSSOP, TSSOP10,.19,20 | - | MO-187C-BA, UMAX-10 | MO-187C-BA, UMAX-10 | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 |
| 针数 | 10 | 10 | 10 | - | - | - | 10 | 10 |
| Reach Compliance Code | compliant | compli | compli | - | compli | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | - | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 6 weeks | 6 weeks | 6 weeks | - | - | - | 6 weeks | 6 weeks |
| 最大模拟输入电压 | 1.064 V | 2.128 V | 1.064 V | - | 2.128 V | 2.128 V | 2.128 V | 2.128 V |
| 最小模拟输入电压 | -1.064 V | -2.128 V | -1.064 V | - | -2.128 V | -2.128 V | -2.128 V | -2.128 V |
| 最长转换时间 | 35 µs | 35 µs | 35 µs | - | 35 µs | 35 µs | 35 µs | 35 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | - | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 |
| JESD-609代码 | e3 | e3 | e3 | - | - | - | e3 | e3 |
| 长度 | 3 mm | 3 mm | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm |
| 最大线性误差 (EL) | 0.1953% | 0.1953% | 0.1953% | - | 0.1953% | 0.1953% | 0.1953% | 0.1953% |
| 湿度敏感等级 | 1 | 1 | 1 | - | - | - | 1 | 1 |
| 模拟输入通道数量 | 2 | 2 | 2 | - | 2 | 2 | 2 | 2 |
| 位数 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 10 | 10 | 10 | - | 10 | 10 | 10 | 10 |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | - | 85 °C | 85 °C | 85 °C | 70 °C |
| 最低工作温度 | -40 °C | -40 °C | - | - | -40 °C | -40 °C | -40 °C | - |
| 输出位码 | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | - | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL | SERIAL | SERIAL | - | SERIAL | SERIAL | SERIAL | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSSOP | - | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | - | - | - | TSSOP10,.19,20 | TSSOP10,.19,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | - | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 |
| 电源 | 3/5 V | 3/5 V | 3/5 V | - | - | - | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | - | Not Qualified | Not Qualified |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | - | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | - | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 标称供电电压 | 3 V | 5 V | 3 V | - | 3 V | 3 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | - | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | - | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - | - | - | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 |
| 宽度 | 3 mm | 3 mm | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm |
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