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EPF10K100AFC484-3N

产品描述Loadable PLD, 0.8ns, CMOS, PBGA484, FINE LINE, BGA-484
产品类别可编程逻辑    可编程逻辑器件   
文件大小640KB,共128页
制造商Altera (Intel)
标准  
下载文档 详细参数 选型对比 全文预览

EPF10K100AFC484-3N概述

Loadable PLD, 0.8ns, CMOS, PBGA484, FINE LINE, BGA-484

EPF10K100AFC484-3N规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Altera (Intel)
零件包装代码BGA
包装说明BGA,
针数484
Reach Compliance Codecompliant
Is SamacsysN
其他特性4992 LOGIC ELEMENTS; 624 LABS
最大时钟频率80 MHz
JESD-30 代码S-PBGA-B484
JESD-609代码e1
长度23 mm
湿度敏感等级3
专用输入次数4
I/O 线路数量369
端子数量484
最高工作温度70 °C
最低工作温度
组织4 DEDICATED INPUTS, 369 I/O
输出函数REGISTERED
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)260
可编程逻辑类型LOADABLE PLD
传播延迟0.8 ns
认证状态Not Qualified
座面最大高度2.1 mm
最大供电电压3.6 V
最小供电电压3 V
标称供电电压3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间40
宽度23 mm
Base Number Matches1

文档预览

下载PDF文档
Includes
FLEX 10KA
FLEX 10K
Embedded Programmable
Logic Device Family
Data Sheet
®
January 2003, ver. 4.2
Features...
The industry’s first embedded programmable logic device (PLD)
family, providing System-on-a-Programmable-Chip (SOPC)
integration
Embedded array for implementing megafunctions, such as
efficient memory and specialized logic functions
Logic array for general logic functions
High density
10,000 to 250,000 typical gates (see
Tables 1
and
2)
Up to 40,960 RAM bits; 2,048 bits per embedded array block
(EAB), all of which can be used without reducing logic capacity
System-level features
MultiVolt
TM
I/O interface support
5.0-V tolerant input pins in FLEX
®
10KA devices
Low power consumption (typical specification less than 0.5 mA
in standby mode for most devices)
FLEX 10K and FLEX 10KA devices support peripheral
component interconnect Special Interest Group (PCI SIG)
PCI
Local Bus Specification, Revision 2.2
FLEX 10KA devices include pull-up clamping diode, selectable
on a pin-by-pin basis for 3.3-V PCI compliance
Select FLEX 10KA devices support 5.0-V PCI buses with eight or
fewer loads
Built-in Joint Test Action Group (JTAG) boundary-scan test
(BST) circuitry compliant with IEEE Std. 1149.1-1990, available
without consuming any device logic
Table 1. FLEX 10K Device Features
Feature
Typical gates (logic and RAM)
(1)
Maximum system gates
Logic elements (LEs)
Logic array blocks (LABs)
Embedded array blocks (EABs)
Total RAM bits
Maximum user I/O pins
EPF10K10
EPF10K10A
10,000
31,000
576
72
3
6,144
150
EPF10K20
20,000
63,000
1,152
144
6
12,288
189
EPF10K30
EPF10K30A
30,000
69,000
1,728
216
6
12,288
246
EPF10K40
40,000
93,000
2,304
288
8
16,384
189
EPF10K50
EPF10K50V
50,000
116,000
2,880
360
10
20,480
310
Altera Corporation
DS-F10K-4.2
1

EPF10K100AFC484-3N相似产品对比

EPF10K100AFC484-3N EPF10K100ABI600-2N EPF10K100ABC600-2N EPF10K100ABC600-1N EPF10K100ABC600-3N EPF10K100AFC484-1N
描述 Loadable PLD, 0.8ns, CMOS, PBGA484, FINE LINE, BGA-484 Loadable PLD, 0.7ns, CMOS, PBGA600, BGA-600 Loadable PLD, 0.7ns, CMOS, PBGA600, BGA-600 Loadable PLD, 0.6ns, CMOS, PBGA600, BGA-600 Loadable PLD, 0.8ns, CMOS, PBGA600, BGA-600 Loadable PLD, 0.6ns, CMOS, PBGA484, FINE LINE, BGA-484
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合
厂商名称 Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
零件包装代码 BGA BGA BGA BGA BGA BGA
包装说明 BGA, BGA, BGA, BGA, BGA, BGA,
针数 484 600 600 600 600 484
Reach Compliance Code compliant compliant compliant compliant compliant compliant
JESD-30 代码 S-PBGA-B484 S-PBGA-B600 S-PBGA-B600 S-PBGA-B600 S-PBGA-B600 S-PBGA-B484
JESD-609代码 e1 e1 e1 e1 e1 e1
长度 23 mm 45 mm 45 mm 45 mm 45 mm 23 mm
湿度敏感等级 3 3 3 3 3 3
专用输入次数 4 4 4 4 4 4
I/O 线路数量 369 406 406 406 406 369
端子数量 484 600 600 600 600 484
最高工作温度 70 °C 85 °C 70 °C 70 °C 70 °C 70 °C
组织 4 DEDICATED INPUTS, 369 I/O 4 DEDICATED INPUTS, 406 I/O 4 DEDICATED INPUTS, 406 I/O 4 DEDICATED INPUTS, 406 I/O 4 DEDICATED INPUTS, 406 I/O 4 DEDICATED INPUTS, 369 I/O
输出函数 REGISTERED REGISTERED REGISTERED REGISTERED REGISTERED REGISTERED
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 260 245 245 245 245 260
可编程逻辑类型 LOADABLE PLD LOADABLE PLD LOADABLE PLD LOADABLE PLD LOADABLE PLD LOADABLE PLD
传播延迟 0.8 ns 0.7 ns 0.7 ns 0.6 ns 0.8 ns 0.6 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.1 mm 1.93 mm 1.93 mm 1.93 mm 1.93 mm 2.1 mm
最大供电电压 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 3 V 3 V 3 V 3 V 3 V 3 V
标称供电电压 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 40 40 40 40 40 40
宽度 23 mm 45 mm 45 mm 45 mm 45 mm 23 mm
Base Number Matches 1 1 1 1 1 1
Is Samacsys N - - N N N

 
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